IPC/FED Conference on Embedded Components
IPC/FED Conference on Embedded Components
4–5 June 2013 • Frankfurt, Germany • Hotel InterContinental Frankfurt
Explore the latest developments in embedded component technology at the IPC/FED Conference on Embedded Components. Designed to bring the entire supply chain together, this conference will provide you with valuable access to industry experts who are advancing embedded components technology, including OEMs, fabricators, assemblers and designers. Receive the valuable information you need on reliability, test, assembly issues and new manufacturing methods in an efficient two-day program in an intimate setting conducive to networking.

In addition, a tabletop exhibition will showcase leading industry suppliers who will be available to answer your questions on embedded components technology. Contact Maria Labriola, IPC sales manager at MariaLabriola@ipc.org or +1 847-597-2866 for more information.

If you are a designer, manufacturer, supplier or end-user of embedded components technology, this conference is a must.

See you in Frankfurt!

Stephan Weyhe Stephan Weyhe,
Business Manager,
Sanjay Huprikar Sanjay Huprikar, Vice President, Member Success,

Who Should Attend
This event is for engineers, designers, marketers, sales professionals and decisions makers with an interest in embedded components technology. It is applicable to every area of the industry, including:

  • OEMs
  • Assemblers
  • Fabricators
  • Designers
  • Suppliers of materials, equipment, CAD and design services


  IPC/FED Member Industry Rate
Full Two-Day Conference* € 620 € 860
One-Day Conference** € 340 € 470

Pricing does not include German VAT of 19%.
Supplier is VMC. Payments should be made to IPC.

* Includes both days of the conference, two networking lunches, networking reception, exhibition and translation services.
** Includes one day of the conference, networking lunch, exhibits and translation services

Translation Services
(most presentations will be in English)
English–German translation services are included in the cost of registration.

Register Now

Hotel Information
The IPC/FED Conference on Embedded Components will take place at:
Hotel InterContinental Frankfurt
Wilhelm-Leuschner Strasse 43
Frankfurt 60329

€ 169 (single), € 189 (double)
Rate includes VAT, service charge, and American breakfast buffet.

Make your reservations by e-mail or call
+49 (0) 69 2605 2444 and state you are with IPC.

Tuesday, 4 June 2013
09:00 Check-in and Exhibits
09:30 Welcome and Introductions
09:45  Embedded Component Technology in Present and Future
Jürgen Wolf, Assistant Manager of Research and Development, Würth Elektronik
10:30    The Progress of Embedded Optical Waveguides in PCBs
Happy Holden, Director of Electronics Engineering and Innovation, Gentex
11:15 Break/Exhibits
11:45   Overview: Introduction in Embedded Technologies
Andreas Ostmann, Group Manager, Embedding & Substrates,  Fraunhofer, IZM
12:30 Achieving New Levels of Functional Density in Mobile Multimedia Devices Using the Z-dimension
Heiko Dudek, Art Director, Cadence Design Systems, Inc.
13:15 Lunch/Exhibits/Networking
14:45 Requirements for Embedded Components Pick & Place Technology
Sjef van Gastel and Patrick Huberts, Assembleon
15:30 Design with and Design for Embedded Components — Electronic Design Process Requirements and Today’s Solutions
Ralf Brüning, Production Manager High Speed Design Solutions, Zuken
16:15 Design and Assembly Process Implementation for Embedding Passive and Active Components
Vern Solberg, Consultant, Invensas
17:00 Reception
Wednesday, 5 June 2013
09:00 Exhibits
09:30 Design Flow for Embedded Actives
Per Viklund, Director of IC Packaging & RF, Mentor Graphics, Inc.
 10:15 Embedded Technology and its Introduction in Serial Production
Mike Morianz, Manager, Technology and Innovation Advanced Packaging,  AT&S Leoben, Österreich 
11:00 Break/Exhibits
11:30 Embedding of Passives and Active Components in a Rigid-Flex Printed Circuit Board
Michael Matthes, Development Engineer, Wittenstein Electronics GmbH
Dirk Müller, Business Manager, FlowCad
12:15 The Development of Challenges and Application Reliability for Next Generation Microelectronic and Electronic Products
Paul Wang, VP of Global Quality and Technology Engineering, MiTac
13:00 Lunch/Exhibits/Networking
14:30   Embedded Ultra-Thin Chip Packaging (UTCP) Technology
Jan Vanfletern, Project Manager, IMEC
15:15 Embedding: An Idea Enters Mass Production
Christian Rössle, Vice President of Sales & Marketing, Schweizer Electronic AG
16:00 Flex Based Embedded Die 3D-SiP Technology
Ted Tessier, CTO FlipChip International
16:45 End

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