The path to successful IC-to-package-to-board-level-interconnect encounters many obstacles along the way. Finding the right materials, equipment and processes is critical. IPC, with event host Amkor Technology, is presenting the Conference on Component Technology: Closing the Gap in the Chip to PCB Process to help the PCB supply chain and chip manufacturers address the many technology challenges in IC-to-board-level interconnections.
With an emphasis on design and manufacturing of component technology to interconnection solutions, the event will tackle the latest advancements and discoveries. Don’t miss this opportunity to learn from the experts!
|This event will
- Interposer suppliers
- Materials suppliers
- Packaging manufacturers
- Chip manufacturers
Tuesday, September 10
9:00 am–12:00 pm
Design and Fabrication of Semiconductor Package Interposers and Substrates for Today’s Demanding Applications
Phil Marcoux, Director, PPM Associates
This workshop is a primer on the hows and whys of 2.5-D and 3-D. It will cover
the current “killer applications,” the materials and assembly methods used
and who’s doing them. Suggested design guidelines and business decision
planning tools will be covered. This course is of benefit to package designers, package fabricators, PCB designers and fabricators looking to expand into
the new market.
2:00 pm–5:00 pm
System Integration and Design Challenges
Nozad Karim, VP Electrical Engineering and Characterization,
System integration is driving and influencing performance improvements, miniaturization and cost reduction in new electronic products. This course will help participants identify the right packaging solution for broadband and wireless applications, as well as demonstrate the applicability of various interconnect solutions such as gold/copper/silver wires, solder and copper pillar flip chip, redistribution (RDL), interposers, embedded and integrated passive devices (IPD), and shielding to meet the concurrent design requirements for signal integrity, power integrity, electromagnetic compliance and thermal solutions.
September 11, 2013
||Welcome and Introduction
||Keynote: What is Happening at the Package/System Integration Level?
Ron Huemoeller, Sr. Vice President, Advanced Product Development, Amkor Technology
||Trends in Advanced Circuit Board Technologies and the Impact on the Chip World
• Hayao Nakahara, President, N.T. Information Ltd
|| Break /Exhibits
||Advancements in Silicon Interposers and Alternatives
Linda Matthew, Senior Analyst, TechSearch International Inc.
||The Impact of Different Interposers on Power Saving for Memory Modules
Nozad Karim, VP Electrical Engineering and Characterization, Amkor Technology
||PCB Fabrication Challenges & Solutions
• Raj Kumar, VP Technology — PCB, Viasystems North America, Inc.
||Implementation of High Speed Copper Plating, Full Dissolution Resist Stripping and Selective Copper Etching for Copper Pillar Bump Fabrication
• Lynn Michaelson, Senior Materials Scientist, Technic, Inc.
Opportunities and Challenges for Glass in 2.5D/3D Packaging Applications
• Scott C. Pollard, Laser/Mfg. Packaging Manager, Science & Technology
||Sintering Pastes: A Spectrum Solution to Electrical and Thermal Conduction in the Z-Axis
• Catherine Shearer, Senior Scientist, Ormet Circuits
||Electrodeposited Copper Foils Designed for Closing the Gap in Low Loss and High Speed and IC Packaging Process
• Jérôme Petry, Sales and Applications Manager, Circuit Foil Luxembourg
||Design of High-Performance DIMM-in-a-PACKAGE (DIAP) On-Board Memory Module
• Zhuowen Sun, Staff Engineer, Invensas
| September 12, 2013
||Leveraging PCB Infrastructure to Achieve Ultra-Fine Cu Geometries
• Michael Deley, Business Development Mgr., Averatek Corp.
|| Enabling I/O optimization with 3D SoC, SiP, and PCB co-design
• Humair Mandavia, Sr. Technical Marketing Manager, Zuken, Inc.
|| Trends in PWB and IC Packaging Substrates
• Brandon Prior, Senior Consultant, Prismark Partners, LLC
||Next Generation OSP Technology for IC Substrates and Chip Packaging
• Michael Carano, Director New Product, OMG Electronic Chemicals
||Key Polymer Challenges on the Road to 3D Integration
• Jeff Gotro, Ph.D., CMC, President, InnoCentrix
Future of Package for Computing Electronics
• Ram Viswanath, Design Manager, Intel
||Films for Improved Reliability in PCB and IC Packages
• Chris Hunrath, Technical Director, Integral Technology