IPC Professional Development Online brings industry experts to you. Your registration fee includes all individuals participating with one log-in, so gather the team and discover answers to your pressing questions. IPC Online Education: 2012 Winter Webinars Why Wedge Bond Lee Levine, Hesse & Knipps Tuesday, January 31 10:00 am–11:00 am, Central time Member: $75 Industry Rate: $100 Wire bonding is an ultrasonic welding process accomplished by deforming the wire and the substrate together, forming an alloy of the two. Wedge bonding, because it directly deforms the wire without first forming a ball, is capable of producing a bond with minimum deformation and extremely low loop heights. High quality wedge bonds can produce deformation just 20%-25% larger than the wire diameter, whereas typical ball bonds are 1.8-2 times the wire diameter. What you will learn Wedge bonding versus ball bonding for fine pitch and thin package requirements About the Instructor As distinguished member of the technical staff for Hesse & Knipps, Inc., Lee Levine provides support for customers with challenging wedge bonding process requirements. In addition, he researches and presents technical papers on various aspects of wedge bonding. View the other Winter Webinars Calculate your start time. All sessions will run from 10:00 am to 11:00 am, Central time (Chicago).