 |
| IPC Tin Whiskers Conference |
| Sponsored by Lockheed Martin Corporation |
April 17–19, 2012 | Ft. Worth, Texas | www.ipc.org/tin-whiskers |
Workshops and Networking Reception: April 17
Technical Conference: April 18–19
This event will focus on practical methodologies that can be deployed today.
Real-world examples will be used to illustrate causes of growth, risk mitigation and materials perspective, methods for detection and failure analysis. Explore the full range of tin whiskers theory and practice in every market sector: military/aerospace, automotive and consumer electronics.
WORKSHOPS
Three-hour sessions of classroom instruction led by subject matter experts.
Morning session: 9:00 am–12:00 pm
Tin Whiskers Failure Risk and Mitigations Strategies
Level: Basic–Intermediate
Instructor: Michael Osterman, Ph.D., Associate Research Scientist, CALCE-University of Maryland
Afternoon session: 1:30 pm–4:30 pm
The Art of Appreciating Metal Whiskers: Practical Guidance for Electronics Professionals
Level: Advanced
Instructor: Lyudmyla Panashchenko, Aerospace Engineer, Goddard Space Center, NASA
NETWORKING RECEPTION for all event participants 5:00-6:30pm
TECHNICAL CONFERENCE
Agenda
| Tuesday, April 17 |
| |
Networking Reception for all event participants |
| Wednesday, April 18 |
| 8:00 am |
Check-in & Continental Breakfast |
| 8:30 am–9:15 am |
Welcome and Introduction: the State of Lead-Free Address
Linda Woody, Engineering Manager, Missile & Fire Control, Lockheed Martin |
| 9:15 am–10:00 am |
Mitigation Measurements and Whisker Survey of Commercial Components
Martin Wickham, National Physical Laboratory-NPL, UK |
| 10:00 am–10:15 am |
BREAK |
| 10:15–11:00 am |
Effectiveness of Photosintering in Mitigating
Tin Whisker Formation
Michael Osterman, Ph.D., Research Associate, CALCE |
| 11:00– am11:45 am |
Effects of Magnetism on the Morphology of Lead-Free Solder and Plating
Russell Hallman, Y-12 National Security Complex |
| 12:00 pm–1:00 pm |
LUNCHEON |
| 1:00– pm1:30 pm |
Tin-Lead Conversion Process
Scott Sentz, Director, AEM-Marketing |
| 1:30 pm–2:00 pm |
Mechanical and Electrical Properties of Sn, Zn and Cd Whisker
Aleksandra Fortier, Ph.D., Professor of Engineering, University of North Texas |
| 2:00 pm–3:00 pm |
Whisker Growth Evidence, Root Cause, Countermeasures
Dr. Werner Huegel, Tin Whiskers Expert, Bosch Automotive |
| 3:00 pm–3:15 pm |
BREAK |
| 3:15 pm–3:45 pm |
Tin Whiskers Inorganic Coatings Evaluation (TWICE) — A Strategic Environmental Research and Development Program (SERDP) Project
Dave Hillman, Product Material & Process Engineer, Rockwell Collins |
| 3:45 pm |
Adjourn |
Tour of the Lockheed Martin Facility:
Register by March 29 — Limited Capacity
– Security allows only U.S. citizens
– Background check |
| Thursday, April 19 |
| 8:00 am |
Check-in & Continental Breakfast |
| 8:30 am–9:30 am |
Keynote Address: Technology Trends for Aerospace & Defense Electronics
Assembly Industry
Bill Murphy, Fellow, Lockheed Martin Systems Integration |
| 9:30 am–10:15 am |
Special Considerations for the Medical Sector
Po Tse, Philips Healthcare, Senior Reliability Risk Manager for RoHS & REACH |
| 10:15 am–10:30 am |
BREAK |
| 10:30 am–11:30 am |
Tin Whisker Mitigation in Assembly
Polina Snugovsky, Ph.D, Sc.D., Celestica-Performance Innovation |
| 11:30 am–12:15 pm |
New Validation of Solder Coverage Requirements for GEIA-STD-0005-2
David Pinsky, Principal Engineer, Raytheon |
| Closing Remarks |
| Adjourn |
Special Contributors
- Hans-Peter Tranitz, Ph.D., Continental Automotive GmbH, Advanced Technologies
- George Milad, National Accounts Manager for Technology, Uyemura
| |
IPC Member |
Standard Price |
| Conference: |
$525 |
$675 |
| Individual Workshop: |
$250 |
$350 |
| Conference Plus two Workshops |
$775 |
$975 |
HOTEL
Omni Fort Worth Hotel
1300 Houston Street
Fort Worth, Texas 76102
To make your reservations, contact the Omni Fort Worth Hotel or call 1-800-THE-OMNI and state that you are with IPC to receive the discounted rate of $189. This rate is available until all discounted rooms are booked, or until Monday, March 26, 2012.
Questions? Contact IPC Professional Development at +1 847-597-2827.
TABLETOP EXHIBITS
Reach a focused audience concerned about tin whiskers.
As an exhibitor, your logo will appear on all IPC communications about this event:
- Global e-mail broadcasts to over 25,000 contacts
- Electronic brochure linked to website
- Materials distributed to attendees on-site
Showcase your products and services as a Tabletop exhibitor.
Contact IPC Sales at +1 847-597-2866.
MEDIA SPONSORS:
TABLETOP EXHIBITORS:
|
