IPC Conference on Flexible Circuits
IPC Flexible Circuits Conference
June 12–14, 2012 | Irvine, California

Explore the amazing potential of flexible circuits technology to manage high temperatures, reduce weight and space, and save on assembly.

Learn more with half-day workshop sessions on June 12.

Presentations on June 13–14 from an outstanding roster of speakers will provide practical information on a range of technical topics, along with the business outlook for this sector. A special focus on printed electronics is included.
Network in a professional environment during the afternoon luncheon and evening reception.

register

Tuesday, June 12

WORKSHOPS

Rigid/Flex in the Making — Basic Level
Dale Smith, DAS Flex Circuit Consultant, LLC
9:00 am–12:00 pm

Process Consideration for Flexible Circuits — from Metallization
through Final Finishes — Advanced Level
Mike Carano, Director of Global Business Development & Strategic Marketing, OMG Electronic Chemicals
2:00 pm-5:00 pm

NETWORKING RECEPTION FOR ALL PARTICIPANTS

5:00 pm–6:30 pm

Conference Agenda

Wednesday, June 13
8:00 am Check-in and Continental Breakfast
8:30 am Welcome and Introductions
Mike Carano, Director of Global Business Development & Strategic Marketing, OMG Electronic Chemicals
8:45 am Keynote Presentation: Supporting Electronic Innovations: Printed Electronics Opportunities
Happy Holden, Director of Electronics, Gentex Corporation
9:45 am
Case Study: Organizational Transition — from Rigid to Flex
Yash Sutariya, V.P. — Corporate Strategy, Saturn Electronics Corporation/Saturn Flex Systems, Inc.
10:30 am BREAK
10:45 am Sales-Marketing Flex vs. Sales-Marketing of PCBs
Al Wasserzug, Director of Corporate Development, Vulcan Flex Circuit Corporation
11:30 am Design, Fabrication and Electrical Analysis of High Speed Flex
Glenn Oliver, Design/Applications Engineer and Sidney Cox, Ph.D., Research Scientist, DuPont
12:15 pm LUNCHEON
1:15 pm Common Technical Challenges — Ask the Flexperts
Mark Verbrugge, Program Manager, Pica Manufacturing Solutions
Mark Finstad, Senior Applications Engineer, Flexible Circuit Technologies, Inc.

2:15 pm

Aspect Ratio Does Not Matter Anymore
Nick Koop, Product Manager, Minco Products, Inc.
3:00 pm BREAK
3:15 pm Reduction of Voiding in Flexible Circuits containing Microvias
Mitch Holtzer, Director, Global R&D Assembly Technology;
Bawa Singh, Ph.D., Vice President & CTO, Cookson Electronics;
Rahul Raut, Global R&D Project Manager, Cookson Electronics

4:00 pm

A New Approach to the Manufacture of Rigid Flex Circuits
Joe Fjelstad, Principal, Verdant Electronics
5:00 pm ADJOURN
Thursday, June 14
8:00 am Continental Breakfast
8:30 am New Guidance for Flexible Printed Boards: the Updated Design Standard IPC-2223
Mark Finstad, Senior Applications Engineer, Flexible Circuit Technologies, Inc., and
Vice Chair of IPC Flex Circuits Design Subcommittee
9:15 am Printed Electronics: an Overview — Basics, Limitations, and what is Achievable
Marc Chason, President, Marc Chason & Associates, Inc.
10:00 am BREAK
10:15 am Advances in Flexible Printed Lighting Technology for High-Growth Markets
Marc Chason, President, Marc Chason & Associates, Inc.
11:00 am Economic and Market Trends for the Flexible Circuits Sector
Sharon Starr, Director, Market Research, IPC
ADJOURN

Questions? Contact IPC Professional Development at +1 847-597-2827.

register

  IPC Member Standard Price
One Workshop, June 12 $250 $350
Technical Conference, June 13-14 $395 $550
Conference plus two Workshops $650 $850

HOTEL

Irvine Marriott
18000 Von Karman Avenue
Irvine, CA 92612-1004

To make your reservations and receive the discounted rate of $179, call the Irvine Marriott at 800-228-9290 or +1 949-553-0100. Rooms are available until all rooms are booked or until May 21, 2012.

Reach the audience focused on flexible circuits and printed electronics. Showcase your products and services as an exhibitor or hospitality sponsor.

Tabletop Exhibits
$1000 member/$1200 Standard rate

• Tabletop Exhibit display on June 13 and 14
• Logo on all electronic communications to this audience
• List of Conference attendees after the event
• One complimentary Conference registration for tabletop staff
• Additional registration at 25% discount

Hospitality Sponsorship
Networking Reception — June 12
$2000 Member/$2200 Standard rate

• Your brief presentation to attendees
• Tabletop Exhibit, with associated benefits
• Your promotional items distributed to attendees
• Signage at the event — your logo, tagline, new products/services featured

Contact IPC Sales at MariaLabriola@ipc.org, or +1 847-597-2866.

HOSPITALITY SPONSOR:

POLAR    

 

 

TABLETOP SPONSOR:

eltek FTG allflex OMG  
POLAR MicroCraft iPC uyemura  


 

MEDIA SPONSORS:

 

FLEX007 PCB DESIGN 007 PCB 007    
PCB magazine Global SMT & Packaging EDA café    
Harwin Quiptech LaserJob Kyzen Nordson Dage Etek Balver Zinn PVA Danutek Ersa FKN Systek Viscom Elektro-net SMT Magazine