|High-Reliability Cleaning and Conformal Coating Conference
||November 13–15, 2012 | Crowne Plaza Hotel-O’Hare in Chicago, Illinois
This event is focused on electronics assembly reliability and the influence of cleaning and coating on the production of reliable hardware.
“How clean is clean?” is even more challenging to answer: conductors and circuit traces are growing narrower and what is acceptably clean for one industry segment may be unacceptable in others.
A half-day workshop will be followed by a two-day technical conference, that will include tabletop exhibits, luncheons, and a networking reception.
Tuesday, November 13, 8:00 am–12:00 pm
Conformal Coatings: Types, Uses and Specifications
Doug Pauls, Rockwell Collins and Jason Keeping, Celestica
Learn the basics of conformal coating and coating processes. Suitable for anyone new to conformal coating, this workshop introduces the fundamentals and assumes no prior knowledge of coatings. Topics will include popular myths and misconceptions as well as common causes of coating problems. The second half of the workshop is dedicated to discussion about conformal coating in the manufacturing environment.
What You Will Learn
- Conformal coating uses
- Coating types and specifications
- Engineering trade-offs
- Selecting a conformal coating
Doug Pauls is the Rockwell Collins expert-on-call for conformal coatings. He currently serves as Chairman of the IPC Cleaning and Coating Committee and has been involved in these processes for more than 25 years. Pauls has been a part of MIL-I-46058, IPC-CC-830 and the development and revision of the IPC handbook on conformal coating, IPC-HDBK-830.
Jason Keeping is Celestica’s subject-matter expert for all ruggedized electronic processes including underfill, potting, assembly cleaning and conformal coating. He currently serves as the co-chair of the IPC Conformal Coating Handbook Task Group responsible for developing IPC-HDBK-830 and has been involved in the sector for more than 12 years.
Pauls and Keeping also currently serve on several IPC committees responsible for key IPC standards such as IPC-HDBK-850, IPC-CH-65 and J-STD-030 and the qualification and specification of conformal coating materials, IPC-CC-830. Both are humorous and entertaining speakers who deliver technical concepts in easy-to-understand terms.
Technical Conference Agenda
|Tuesday, November 13
|12:50 pm–1:00 pm
Event Chairman: Mike Bixenman, DBA, Kyzen Corporation
|1:00 pm–2:30 pm
Session Leader: Craig Hillman, Ph.D., DfR Solutions
Characterization and Analysis of Plasma Polymers for Protective Films
Tim Von Werne, Semblant Ltd.
Chemically Vapor Deposited Polymer Coatings for the Environmental Protection of Microelectronics
Aleksandr White, GVD Corporation, Inc.
|2:30 pm–3:00 pm
|3:00 pm–4:00 pm
||Increasing the Reliability of Electronic Devices
Stephen Coulson, Ph.D., P2i
Enhancing Water-Blocking Nano Coatings for Telecommunications Devices
Blake Stevens, Ph.D., HzO
|4:00 pm–4:45 pm
||Keynote: PCB Reliability — Design and Assembly Decisions for High-Performance Electronics
Dave Hillman, Rockwell Collins
|5:00 pm–6:30 pm
||Networking Reception sponsored by Kyzen Corporation
|Wednesday, November 14
||7:00 am–8:00 am
||Check-in and Continental Breakfast
|8:00 am–9:30 am
Session Leader: Jeff Kennedy, Celestica
High Temperature Reliability Limits of Silicon Conformal Coatings
Carlos Montemayor, Dow Corning Corporation
Investigation of Adhesive Strength of Conformal Coatings
Rich Kraszewski and Daren Scott, Plexus Corporation
Standardization of Electronic Conformal Coatings in an Aerospace OEM
Hector Valladares, Honeywell International
|9:30 am–10:00 am
|10:00 am–11:30 am
Use of the IPC-B-52 Test Assembly for Conformal Coating Process Characterization
Doug Pauls, Rockwell Collins
A Preliminary Investigation into Enhanced Automated Selective Conformal Coating of Electronic Assemblies by Employing Plasma Treatment Technology
David Foote, Nordson MARCH
Throughput and Yield Improvements via Conformal Coating Process Characterization
Brad Perkins and Hector Pulido, Nordson ASYMTEK; Manuel Fernandez, Celestica
|11:30 am–12:30 pm
||Luncheon sponsored by Zestron
|12:30 pm–3:00 pm
||Cleanliness Assessment & Process Control
Session Leader: Doug Pauls, Rockwell Collins
A ROSE is Still a ROSE? Ionically, It Makes a Difference!
Graham Naisbitt, Gen3 Systems Limited
Localized Extraction Methods for Ionic Analysis
Eric Camden, Foresite, Inc. and Doug Pauls, Rockwell Collins
Cleaning Challenges in an HDI World
Mark Northrup, IEC Electronics Corp., Joe Russeau, Precision Analytical Laboratory, Inc. and Dr. Mike Bixenman, Kyzen Corporation
A Comparison of Extract Solution Composition for Bare Boards
Jennifer Klavon, Rockwell Collins
Updates and Changes to the IPC-B-52 Test Vehicle
Doug Pauls, Rockwell Collins
|3:00 pm–3:30 pm
|3:30 pm–5:30 pm
||Environmental Standards and Regulations
Session Leader: Lee Wilmot, TTM Technologies, Inc.
Regulations and Productive Electronics Assembly – What’s New (OTC, HCFC-225,MIL-SPEC and SCAQMD)
Barbara Kanegsberg, BFK Solutions
GreenScreen for Chemical Hazard Assessment in Spot Cleaning Applications
Curtis Wray, Hewlett-Packard Company
Reduction of VOC Emissions and Alternatives to Toxic Conformal Coatings
Emmanuelle Guene, Inventec Performance Chemicals
RoHS 2 / REACH / SVHC
Ron Lasky, Ph.D., Indium Corporation of America
|Thursday, November 15
|7:00 am–8:00 am
||Check-in and Continental Breakfast
|8:00 am–10:00 am
||Electronics Assembly and PCB Failure Mechanisms & Reliability
Session Leader: Dave Hillman, Rockwell Collins
Influence of Ionic Contamination on Tin Whiskers
Stephan Meschter, Ph.D., BAE Systems Platform Solutions and Polina Snugovsky, Ph.D., Celestica
Creep Corrosion of PCB Assemblies: Effects of Surface Contamination
Martin Anselm, Universal Instruments
How Conformal Coating Can Kill
Craig Hillman, Ph.D., DfR Solutions
Achieving the Lowest Cost per Assembly within an Environmentally Responsible Defluxing Process
Mike Konrad, Aqueous Technologies
|10:00 am–10:30 am
||Break and Box Lunch
|10:30 am–1:30 pm
||Assembly Cleaning & Challenges
Session Leader: Dale Lee, Plexus Corporation
Process Optimization and Customer Requirements
Ken Van Zill, Ducommun LaBarge Technologies, Inc.
Cleaning No-Clean Flux Residues
Michael Havener, Benchmark Electronics Inc.
Electronics Effects of Cleaning Agents on Adhesives and Conformal Coating
Tana Soffa, L.W. Nusbaum, P.A. Panackal and K.F. Schoch, Jr., Northrop Grumman Corporation
Improvement of Cleaning Lead-Free Flux Residues for HDI Assemblies by Reduction of Oxygen Levels During Reflow
Dr. Mike Bixenman, Kyzen Corporation; Maeva Tureau, Ph.D.; Chris Han-Adebekun, Ph.D. and Greg Arslanian, Air Products & Chemicals
Determining Critical Cleaning Process Parameters for QFNs
Umut Tosun, Naveen Ravindran and Michael McCutchen, ZESTRON America
Assembly Cleaning Process Characterization — Utilizing Repeatable Chemistry Solution Control
Dave Adams, Rockwell Collins; Dave Lober and John Williamson, Kyzen Corporation
|1:30 pm–1:45 pm
Event Chairman: Dr. Mike Bixenman, Kyzen Corporation
Contact the SMTA Director of Education at +1 952-920-7682 or
the IPC Professional Development Manager at +1 847-597-2827.
Eric Camden, Foresite, Inc.; Steve Stach, Austin American Technology; Randy Barkley, Sealevel Systems Inc.; Lee Wilmot, TTM Technologies, Inc. and Hector Pulido, Nordson ASYMTEK.
Advance registration is strongly recommended. Seating and materials cannot be guaranteed for on-site registrants.
Registration fee for the two-day Conference, November 13–15, includes a copy of the proceedings, roster with attendee contact information, networking reception and luncheons:
$575 IPC or SMTA member or $675 Industry Rate.
Registration fee for the half-day workshop session of classroom instruction on November 13:
$275 SMTA or IPC Member or $300 Industry Rate.
If four employees from the same company register for the conference, the fourth registrant is free.
Registration fees will be refunded (less a $50 processing fee) if written notice is received by November 1. Without advance notice, registration fees must be used to cover expenses incurred. Please send a replacement if you cannot attend.
Crowne Plaza Hotel-Chicago O’Hare
5440 North River Road — near the airport
Rosemont, IL 60018
Reserve your room online or call 877-337-5793 (toll- free) and state that you are with IPC or SMTA to receive the discounted rate of $162 per night. Make your reservations early: rooms are only available at the discounted rate until all rooms in the Conference block are booked or until October 13.
Note: Failure to cancel a guaranteed reservation at least 72 hours prior to arrival date will result in one night’s room and tax billed to the guest credit card.