IPC Online Education:
Free Webinar: Soldering and Assembly Defects - Causes and Cures

Spend an hour with a lead-free process expert and pick up new knowledge on common lead-free process problems relating to the selection of PCB materials, surface finishes and soldering materials. During this webinar, the instructor will share manufacturing challenges, helpful solutions and ways to investigate root causes. Participants will learn how to use the NPL free online process defect database to solve process problems 24/7. Participants can e-mail their problems and photos to processdefectclinic@ipc.org in advance of the webinar for discussion and resolution.

Following the webinar, instructor Bob Willis will run the free NPL Process Defect Clinic at IPC APEX EXPO (February 28–March 1, San Diego) to solve problems and suggest alternative solutions. This year’s clinic will include mini seminars on free testing and solderability tips.

What you will learn

This session will provide a practical introduction to issues of lead-free process yield improvements and troubleshooting and is suitable for engineers, supervisors and operators looking at lead-free assembly issues on-site or offshore. Equipment suppliers and component manufacturers will gain insights on what to address in future products. Ideal for new and experienced process engineers tasked with process improvements or failure investigations.

View a presentation about some of what you will learn

Topics include:

• Most common defects seen on PCBs, components and assemblies
• Monitoring process defect levels
• Recording defects for investigation
• Coordinating process parameters
• Wave, selective, reflow soldering defects
• Finding defect causes and cures

To participate, you will need a phone line and internet access.

About the Instructor

Bob Willis operates a training and consultancy business based in England and has created one of the largest collections of interactive training materials in the industry. A specialist for companies implementing lead-free manufacture, Willis has provided worldwide consultancy in most areas of electronic manufacture for the last 25 years. He has earned the SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry. He has also won awards from SMTA and IPC.

Mr. Willis has been chairman and technical director of the SMART Group and holds the title of honorary life vice president for his contributions to the group. He supports the NPL team in the operation of the Process Defect Database.