 This unique event will take you through the assembly process — from materials to test and inspection — and provide you with the latest information so you can increase your reliability.
LEAD-FREE RELIABILITY WORKSHOP
October 31
10:00 am to 5:00 pm
Design for Reliability in the Lead-Free Era
Instructor: Cheryl Tulkoff, Senior Member of Technical Staff, DfR
This workshop provides a focused but comprehensive discussion of all issues that can arise during the transition to lead free. All areas of potential risk will be examined, including:
- popcorning
- tin whiskers
- plating failures associated with various solder materials
- plated-through hole (PTH) barrel cracking
- pad cratering
- thermomechanical wearout
- high-cycle fatigue
For each reliability concern, the latest research will be shared and you will learn the best ways to mitigate risk based on a product's design, materials, complexity, volumes, and customer expectations of reliability. A final summary will provide you with a roadmap for ensuring the reliability of your lead-free product.
Who Should Attend?
This course is designed for engineers and manufacturing personnel who need to fully comprehend the characteristics of design for reliability (DFR) and how it applies to unique applications.
CONFERENCE AGENDA
| November 1
|
|
8:30 am
|
Networking Breakfast and Registration
|
| 9:00 am
|
Welcome and Introductions
|
| Materials
|
| 9:15 am
|
Component Characterization and Reliability Assessment of Lead-Free Solder Joints for Space Electronics Hardware
Jelena Bradic, Principal Member of Technical Staff, COM DEV International, Ltd.
|
| 10:00 am
|
Underfill Selection and the Impact on Reliability
Brian Toleno, Ph.D., Director of Technical Service Engineering, Henkel Corp.
|
| 10:30 am
|
Break
|
| 11:00 am
|
An Assessment of Low Silver Lead-Free Solder Alloys for General Lead-free Assembly
Jasbir Bath, Consulting Engineer, Christopher Associates/Koki Solder
|
| 11:30 am
|
The Effect of Coating and Potting on the Reliability of QFN Devices
Cheryl Tulkoff, Senior Member of Technical Staff, DfR Solutions
|
| Noon
|
Lunch and Exhibits
|
| Process
|
| 1:30 pm
|
New Printing Techniques for Miniaturization and High Yield Processing
Mark Whitmore, Future Technologies Manager, DEK UK
Clive Ashmore, Global Applied Process Engineering Manager, DEK International, GmbH
|
| 2:00 pm
|
Thermal Management: The Key to Solder Joint Reliability
Tom Clifford, Principal, TJB Associates
|
| 2:30 pm
|
ESD Risks Under a Controlled Environment
Diganta Das, Ph.D., Faculty Research Associate, CALCE, University of Maryland
|
| 3:00 pm
|
Break
|
| 3:15 pm
|
BGA Processing for Reliability: Dealing with Dissimilar Solder Alloys and Avoiding Head on Pillow
Jason Fullerton, Senior Product & Applications Engineer, ACI/EMPF
|
| 3:45 pm
|
Simulated Assisted Reliability Assessment
Michael Osterman, Ph.D., Senior Research Scientist, CALCE, University of Maryland |
| 4:15 pm
|
Adjournment |
| 5:30 pm
|
Networking Reception
|
| November 2
|
| Test and Inspection
|
| 7:30 am
|
Networking Breakfast
|
| 8:00 am
|
Effects of Multiple Rework on ATC and Shock Performance of Lead-Free BGA Assemblies
Hongtao Ma, Ph.D., Electronic Packaging Reliability Engineer, Cisco Systems Inc.
|
| 9:00 am
|
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
David Rund, Director of Business Development — Materials, Christopher Associates Inc.
|
| 9:30 am
|
Maximizing the Value of Automatic Inspection Systems in PCB Assembly
Chrys Shea, Owner, Shea Engineering Services
|
| 10:00 am
|
Accelerated Life Test Planning for Lead-Free Circuit Card Assemblies
Vijay Prasad, Program Manager, OPS A La Carte LLC
|
| 10:30 am
|
Break
|
| 10:45 am
|
Assessing Electrical Failure Risk Induced By Tin Whisters
Michael Osterman, Ph.D., Senior Research Scientist, CALCE, University of Maryland |
| 11:15 am
|
Physics Based Test Methods for Reliability Assessment
Dignata Das, Ph.D, Faculty Research Associate, CALCE, University of Maryland
|
| 11:45 am
|
Adjournment
|
|
Registration
| |
IPC Member |
Standard |
| Full-Day Workshop |
$395 |
$495 |
| Technical Conference |
$550 |
$700 |
| Conference Plus Workshop |
$750 |
$1000 |
For more information, contact Susan Filz, IPC director of industry programs, at +1 847-597-2884.
EVENT LOCATION AND HOTEL INFORMATION
Marriott Irvine, 18000 Von Karman Avenue, Irvine, CA 92612
800-228-9290 (U.S. and Canada)
Reservations should be made directly with the Marriott Irvine. Please state you are with IPC to receive the discounted rate of $189. IPC's rate is available until all rooms in the block are booked or until October 12, 2011. Price includes complimentary wireless Internet in guest rooms and self-parking for $5.00 for conference overnight guests.
EXHIBIT aND SPONSORSHIP oPPORTUNITIES
For Exhibit and Sponsorship opportunities, contact Maria Labriola, Manager, Trade Show Sales, at +1 847-597-2866.
MEDIA SPONSORS
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