IPC Professional Development Online brings industry experts to you. Your registration fee includes all individuals participating with one log-in, so gather the team and discover answers to your pressing questions. IPC Professional Development Online: 2011 Fall Semester Webinars Is Cleaning Critical to PoP Assemblies? Umut Tosun, ZESTRON Tuesday, November 8 10:00 am-11:00 am, Central time This webinar will provide detailed information about the importance of cleaning PoP assemblies and insight on how to best achieve required cleanliness levels. Package on package (PoP) assemblies are increasingly utilized for applications that require small footprint technology. Typically, this integrated circuit design stacks and integrates logic and memory packages, thereby increasing board density and substantially expanding functionality within the same footprint of a single BGA. Effective cleaning improves product reliability by ensuring optimal surface resistance and preventing current leakage that can lead to PCB failure. This webinar will address the cleanliness levels of PoP assemblies, including underneath components and in between packages. This information was originally presented at the SMTA International Conference 2011. What you will learn The importance of effectively cleaning PoP assemblies A roadmap for achieving critically clean PoP assemblies About the Instructor Umut Tosun, M.S.Chem.Eng., is the application technology manager at ZESTRON. As an active member of SMTA and IPC, Tosun has authored and presented numerous technical papers and studies. View the other webinars in the Fall Webinar Series Calculate your start time. All sessions will run from 10:00 am to 11:00 am, Central time (Chicago).