IPC IPC Conference on Quality, Reliability & Acceptability for Electronics Manufacturing

FEATURING:

Workshops 22 February, 2011
Conference 23–24 February, 2011
Tabletop Exhibits 23–24 February, 2011
Budapest, Hungary
Sponsored by IPC — Association Connecting Electronics Industries and the National Electronics Society of Hungary

This international conference will share the most current knowledge on electronics assembly, including quality and reliability, and offer solutions to your manufacturing challenges.  Learn how industry standards on design, acceptability and process quality can help assure assembly and end product reliability. Get the latest information from international speakers on avoiding defects, preventing moisture, cleaning and screen printing.

Start the event with interactive half-day workshops that drill down into critical industry topics. Learn and network with colleagues from across Europe at the two-day conference. This unique event will help you solve your challenges, get a better understanding of IPC standards and improve your efficiency and reliability.

Conference Agenda

Wednesday, 23 February
7:30 Registration, networking breakfast and exhibits
8:30 The Importance of IPC Standards in Quality and Reliability
Lars Wallin, IPC European Representative
9:00 State of the Hungarian Electronics Industry
Miklos Lambert, National Electronics Society of Hungary
9:30 Design of Printed Circuit Boards for Reliable High Speed Signal Transmission
Hermann Reischer, Polar Instruments GmbH
10:15 Break, exhibits
10:45 Critical Process Steps in Screen Printing
Ferenc Csizmazia, DEK
11:30 The Use of Nano Coated Stencils to Increase Quality and Productivity for Small Outline Devices
Carmina Läntzsch, LaserJob GmbH
12:15 Networking Lunch
13:30 Micro-alloying Effects in Soldering Applications
Han Raetsen,  BalverZinn / Cobar
14:15 Detection of Defects after Soldering by using Ultra Sound (SAM)
Richard Carr, Sonoscan Europe Ltd.
15:00 Break, exhibits
15:30

Technological Advances in X-Ray Inspection
Keith Bryant, Nordson DAGE

16:15 The Use of Modern Automated Optical Systems in the Detection of Solder Defects
Andy Bonner, Nordson Yestech
17:00 Networking reception, exhibits
Thursday, 24 February
7:30 Networking breakfast, exhibits
8:00 3D Inspection Technology:  3D Solder Paste Inspection, Print Process Optimization and 3D AOI Technology
Csaba Berta, Danutek Kft.
8:45 Integrating Cleaning Equipment and Cleaning Agent for Maximum Performance
Serge Tuerlings, Kyzen Corporation
9:30 Preventing Moisture in PCBs, Assemblies and Components
Gábor Ozsváth, ELAS Kft.
10:15 Break, exhibits
10:45 The Rush to Clean No-Clean: Conductive Crystals, White Residues and Decreased Reliability
Kevin Buckner, Aqueous Technologies
11:15 THB and Bono Tests: Solder Paste Residue Corrosivity Assessments
Emmanuelle Guene, Inventec Performance Chemicals
12:15 Adjourn

Workshops

Tuesday, 22 February
9:00–12:00 W-1 Increasing Reliability and Quality in Rigid Board Manufacturing with IPC Standards
Lars Wallin, IPC European Representative

W-2 (Replaced) Reliable Introduction of Lead-Free Design, Assembly & Inspection Workshop
Bob Willis, AskBobWillis.com

W-3 Cancelled

13:30–16:30 W-4 Increasing Reliability and Quality in Flex Circuit and Rigid-Flex Manufacturing with IPC Standards
Lars Wallin, IPC European Representative

W-5 Conformal Coating Applications, Inspection, Rework & Quality Control
Bob Willis, AskBobWillis.com

Tabletop Exhibits

Catch up with new products from leading industry suppliers in the tabletop exhibits!

More than 15 suppliers will be on hand during dedicated time throughout the event. Visit these leading suppliers:

Gold Sponsors

Aqueous
Balver Zinn
DEK
ELAS Kft
Inventec Performance Chemicals
Kyzen Corporation
Laser Job GmbH
Nordson Dage
Polar Instruments
Quiptech (Nordson YesTech)
Sonoscan
Danutek

Silver Sponsors

Viscom
Lasertec International Kft.
MicroSolder
ERSA
Etek Europe
Adaptsys

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How to Register

  Standard Industry Rate IPC Member
Conference Package Includes Conference
Plus Two Workshops
€ 425/$595 € 350/$490
Conference Only First Participant € 125/$175 € 100/$140
Conference Only Additional Participant, Same Company € 100/$140 € 75/$105
Individual Half-Day Workshops € 175/$245 € 150/$210

All programs will be in English. Conference registration includes one copy of the conference proceedings.

Payment can be made by wire transfer, credit card or check.
See form for details.

Hotel

This event will take place at the Danubius Hotel Gellért, Szent Gellért tér 1., 1111 Budapest, Hungary. Rates are € 75 single/€ 114 double. Room rates include full breakfast, free entrance to the world famous thermal bath and all applicable taxes.

Reservations: To make reservations at the discounted rate of € 75, complete the reservation form (English)/(Hungarian) and send to Fax: +36 1 889 5505 or E-mail: gellert.reservation@danubiushotels.com. To contact the hotel, call +36 1-889-5501.

Rooms at the discounted rate are available until all rooms are booked or until 25 January.
After 25 January, the hotel may continue to offer discounted rates based on hotel availability.

The credit card of guarantee will be charged 48 hours prior to arrival for one night’s room and tax.

Internet: Wi-Fi is available throughout the hotel for purchase.

Parking: Parking is available 100 metres from the hotel for 250,-HUF/hour (about € 1)

Public Transportation: Szent Gellért tér tram & bus stop is at the front of the hotel. The Metro is 5 min from the hotel by tram.

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Workshops in detail

22 February

W-1 Increasing Reliability and Quality in Rigid Board Manufacturing with IPC Standards
Instructor: Lars Wallin, IPC European Representative
09:00–12:00

This workshop will help production managers, production technicians, designers, CAD staff, PCB manufacturers, purchasers and quality engineers understand IPC standards and training and how they can improve board manufacturing reliability and quality.

The course will summarize IPC design standards, rigid board production and acceptance standards, electronics assembly production and acceptance standards and how components like BGA, CSP, QFN and POP can cause defects.

Topics include:

  • The economic reality of electronic hardware production
  • IPC standards and training in the world of electronic designers and CAD staff
  • Base materials for rigid boards and IPC standards
  • Step-by-step rigid board production and how IPC standards apply
  • Step-by-step board assembly and how IPC standards apply

About the Instructor
Lars Wallin is based in Stockholm, Sweden. He is an instructor at The Royal Institute of Technology in Sweden lecturing in electronic production, industrial marketing and presentation techniques. He has been involved in electronics manufacturing for more than 30 years and serves as IPC's European Representative. Wallin is a renowned speaker and has given lectures in more than a dozen countries. Wallin speaks Swedish, English and German.

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W-2 Reliable Introduction of Lead-Free Design, Assembly & Inspection Workshop
Instructor: Bob Willis, ASKbobwillis.com
09:00–12:00

This workshop is aimed at design, production and quality engineers. It will provide a better understanding of the effect lead free will have on printed board design, assembly and quality control. Layout changes that benefit a lead-free process will be highlighted as well as the subtle changes to improve yields on existing designs. Process modifications that have been successfully used over the last few years to reduce or eliminate fillet lifting, pad lifting, solder short, component lifting will be illustrated along with their apparent success or failure.

Each delegate will receive a free set of inspection posters for lead-free solder joints and common process defects found in assembly.

Topics will include:

  • Laminate changes, options and industry trends
  • Through hole pad sizes & fillet lifting
  • Design and process requirements for BGA, LGA/QFN, PoP components
  • PCB Supports – Eliminating Warp and sag
  • Solder alloy options for reflow, wave and selective soldering
  • Via hole plating and reliability with lead-free processes
  • Copper thickness and Lead-Free copper erosion
  • Solder finish selection, storage life and process compatibility
  • Eliminating wave soldering with intrusive reflow
  • CAF and reliability in lead-free
  • Optimising hole fill with lead-free intrusive reflow
  • Multilayer thermal break design
  • Through hole solder thieve designs
  • Modification of paste stencil apertures

A question & answer session on production process issues will be included during the workshop. Delegates can pose questions prior to the workshop to guarantee a detailed answer; these can be emailed prior to the workshop to processdefectclinic@ipc.org

About the Instructor
A specialist in implementing lead-free manufacturing, Bob Willis has provided worldwide consulting in most areas of electronic manufacture for more than 25 years. He has created one of the largest collections of interactive training material in the industry. Based in England, Willis has been chairman and technical director of the SMART Group and holds the title of honorary life vice president for his contributions to the group. He recently earned the SOLDERTEC/Tin Technology Global Lead-Free Award for his contributions to the industry. He has also received awards from IPC and SMTA.

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W-3 Cancelled

W-4 Increasing Reliability and Quality in Flex Circuit and Rigid-Flex Manufacturing with IPC Standards
Instructor: Lars Wallin, IPC European Representative
13:30–16:30

This workshop will help production managers, production technicians, designers, CAD staff, PCB manufacturers, purchasers and quality engineers understand IPC standards and training and how they contribute to flex circuit and rigid-flex manufacturing reliability and quality.

Topics Include:

  • Introduction to flex circuits and rigid-flex boards, an underestimated resource for manufacturing electronic products.
  • Quality, reliability and strength factors for making the decision to use flex and rigid-flex
  • Design and CAD of flex circuits and rigid-flex boards with the assistance of IPC standards
  • Base material options for flex circuits and rigid-flex boards with the assistance of IPC
    standards
  • Flex circuit and rigid-flex board manufacturing
  • Tips for assembling and soldering flex circuits and rigid-flex boards

About the Instructor
Lars Wallin is based in Stockholm, Sweden. He is an instructor at The Royal Institute of Technology in Sweden lecturing in electronic production, industrial marketing and presentation techniques. He has been involved in electronics manufacturing for more than 30 years and serves as IPC's European Representative. Wallin is a renowned speaker and has given lectures in more than a dozen countries. Wallin speaks Swedish, English and German.

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W-5 Conformal Coating Applications, Inspection, Rework & Quality Control
Instructor: Bob Willis, ASKbobwillis.com
13:30–16:30

Conformal coating has provided benefits to industry for many years in high reliability applications, in extreme environmental conditions and in consumer applications. This workshop will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. This practical session will also allow delegates to examine coated boards using different materials and to inspect the coating application.

Each delegate will also receive a free set of color inspection wall charts covering coating application and common defects to use on the manufacturing floor. During the workshop, attendees offering the "best questions" can win some of Willis' interactive CD ROMs.

Topics Include:

  • Why conformal coat
  • Clean or no clean
  • Coating material options
  • Coating process options
  • Cost of coating assemblies
  • Surface insulation resistance and cleanliness testing
  • Cleanliness testing methods
  • Reliability of coating
  • Testing and evaluation of coatings
  • Correct design for coating
  • Masking options and methods
  • Inspection and quality control of coating
  • In-house or contracting services
  • Inspection of coatings & methods
  • Rework and repair of board assemblies

About the Instructor
A specialist in implementing lead-free manufacturing, Bob Willis has provided worldwide consulting in most areas of electronic manufacture for more than 25 years. He has created one of the largest collections of interactive training material in the industry. Based in England, Willis has been chairman and technical director of the SMART Group and holds the title of honorary life vice president for his contributions to the group. He recently earned the SOLDERTEC/Tin Technology Global Lead-Free Award for his contributions to the industry. He has also received awards from IPC and SMTA.

Each workshop requires separate registration or may be purchased as part of a package. Registration information is available here.

register now



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Gold Sponsors
POLAR Inventec Performance Chemicals Kyzen LaserJob
Balver Zinn Aqueous ELAS DEK
Sonoscan Nordson Dage Quiptech Danutek
Silver Sponsors
Lasertec Etek Europe ERSA Adaptsys
Microsolder Viscom
Media Sponsors
EPP Elektronet