IPC - Association Connecting Electronics Circuits

IPC Tin Whiskers Symposium
December 6-7, 2010

Schaumburg (Chicago), Illinois

The Renaissance Hotel-Schaumburg

 

Overview
This important event will focus on practical methodologies that can be deployed today.

Explore the full range of tin whiskers theory and practice in every market sector: military/aerospace, automotive, consumer and telecommunications.

Real-world examples will be used to illustrate causes, testing, mitigation and failure analysis.

Schedule of Events

Monday, December 6
Technical Workshops

Morning Review causes of tin whiskers with a predictive theme: theories of formation and test conditions that promote growth.
Afternoon Focus on risk assessment and mitigation.
Evening Reception for attendees, an opportunity for networking in a professional environment for all event participants.

December 7
Presentations

Slated
  NASA-Goddard
SAIC-CRANE
Benchmark - with CALCE and EMC
ACI
Invited
  RIM
Delphi
Boeing
Hewlitt-Packard

Additional Information
Detailed conference agenda, workshop descriptions, hotel information and registration will be available online by August 12, 2010.
Opportunities for hospitality sponsorship and tabletop exhibitions will be available.

To learn more about conference participation, please contact the IPC Manager of Professional Development at AnneMarieMulvihill@ipc.org  or at +1 847-597-2827.