TECHNICAL WORKSHOPS
Wednesday, November 3
10:00 am–1:00 pm
Thermal Management in PCB Design from Concept to Manufacturing
This workshop will address how to develop an effective thermal management strategy and methodology, using real-world examples. Students will develop an understanding of how thermal analysis and modeling requirements change during the course of the design cycle, from conceptual to final thermal design and manufacturability. Some specific considerations covered in this session include:
- Heat sink optimization at varying stages
- Weighing the pros and cons of discrete versus monolithic heat sink cooling strategies
- Copper distribution capturing
- The integration with board layout tools and how they benefit the designer as the cycle progresses
About the Instructor
Nate Hanlon is a consultant engineer with the Mechanical Analysis Division engineering team at Mentor Graphics. He uses CFD tools to perform thermal and airflow analysis on a wide range of engineering problems, including electronic systems, data centers and clean rooms. Previously with the Mechanical Analysis Division, Nate specialized in the application of CFD to the design of the built environment and electronic equipment. He has a mechanical engineering degree from San Jose State University.
3:00 pm–5:00 pm
PCB Material Options and Properties Relative to Thermal Management
Designing for thermal management requires a thorough understanding of the materials available today. There are many different materials for thermal management PCB fabrication and they vary in thermal performance, electrical performance, and cost. Some designs may require high performance thermal materials; others may be able to utilize a more standard and economical option. This workshop will cover
- Standard and lead-free compatible dielectrics (prepregs)
- Epoxy and polyimide films
- Metallic substrates (copper and aluminum)
- Formulas to help calculate which materials are necessary for your design
- Thermal and electrical characteristics as well as cost considerations
- How your material selection affects reliability of the components in your design
About the Instructors
Chris Hunrath has 28 years experience in the PCB industry starting in PCB manufacturing. The last 17 years has been in chemistry and materials supply. Chris is currently the technical director for Integral Technology, a developer of new materials for the PCB industry.
Terry Staskowicz has been involved in the PCB industry for 14 years. He has held various positions including operator, R&D technician to process engineering. For the last five years, he has been a technical account manager for Insulectro. He is also involved market research and development of thermal management materials in partnership with Integral Technologies.
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| CONFERENCE |
| Wednesday, November 3 |
| 6:00 pm–7:00 pm |
Reception |
| Thursday, November 4 |
7:30 am |
Networking Breakfast, Registration and Tabletop Exhibits |
| 8:00 am |
| Keynote: Thermal Management Requirements |
- Greg Smith, Director of Sales & Marketing, Milplex Circuit (Canada) Inc.
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| 8:45 am |
| Thermal Management of HDI and Microvias |
- Gareth Parry, Consultant, GP Consulting
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| 9:15 am |
| Thermal Management in End Applications: Dissipating the Heat Away from the Base of LEDs |
- Yash Sutariya, Vice President Corporate Strategy,
Saturn Electronics Corporation
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| 9:45 am |
Break/Tabletop Exhibits |
| 10:00 am |
| Thermal Management in End Applications: Automotive |
- Bruce Myers, Principal Technical Fellow, Delphi
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| 10:30 am |
| Advancements in Heat Sinks for PCB Applications |
- Dr. Sukhvinder Kang, CTO, Aavid Thermalloy
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| 11:00 am |
| Advancements in Thermal Gels |
- Jason Brandi, Global Product Manager and My Nguyen, Sr. Scientist, Henkel Corporation
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| 11:30 am |
| Package Thermal Management |
- Jared Beres, Senior Materials Engineer, Intel
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| 12:00 pm |
Lunch/Tabletop Exhibits |
| 1:30 pm |
| The Influence of Copper Planes in Printed Board Thermal Management |
- Ken Bahl, President, Sierra Circuits
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| 2:15 pm |
| Military Platform Thermal Management and Electronics Cooling: Global and Local Optimization vs. COTS |
- Gerald Janicki, Director for Programs and Business Development, Meggitt Defense Systems
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| 2:45 pm |
Break/Tabletop Exhibits |
| 3:00 pm |
| New Materials and Their Impact on Thermal Management |
- Solder Mask: Dave Vaughan, Marketing Manager, Taiyo America
- Thermally Conductive Substrates: Bruce MacDonald, Technical Sales Manger, Global Laminates
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| 5:00 pm |
Adjournment |
Please contact Susan Filz, IPC director of industry programs, at SusanFilz@ipc.org or at +1 847-597-2884 for more information.
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