IS BLACK PAD STILL AN ISSUE FOR ENIG?
Wednesday, March 10 10:00 am–11:00 am (central)
One of the consequences of ROHS compliance and lead-free soldering is a marked increase in the use of electroless nickel immersion gold (ENIG) as a solderable final finish. The nickel layer protects the copper from dissolution in the lead-free solder and maintains the reliability of the finished product. In addition, boards with an ENIG surface finish exhibit higher reliability values when subjected to accelerated stress testing like IST and HAST.
However, ENIG is also associated with the phenomenon known as black pad, where the nickel under the immersion gold layer becomes corroded and turns black.
This presentation will give you tools and information to help you manage the challenges associated with this troublesome issue.
What You Will Learn
What is the mechanism for black pad formation? How common is black pad today? Is a phosphorous enriched layer an indicator of nickel corrosion? What do you need to do to mitigate the occurrence of black pad? The webinar will answer these and other questions pertaining to black pad.
Your Instructor
George Milad has 25 years of experience in printed board manufacturing. He is the national accounts manager for technology at Uyemura International Corporation. He was formerly technical marketing manager at RHEM, director of applications at Atotech and engineering manager at Automata PWB.
He authored chapters on plating and surface finishing in Clyde Coomb’s Printed Circuit Handbook Fifth Edition, 2001. The 2009 recipient of IPC’s President’s award, Milad chairs the IPC Plating Committee and is a permanent member of the Technical Activities Executive Committee.
LIVING LEAD FREE: A COMPARISON OF LEAD-FREE ALLOYS
Thursday, March 11 10:00 am–11:00 am (central)
With the passage of RoHS in 2006, lead-free alloys have become the main alloys in electronics assembly. Unfortunately no single alloy has replaced tin-lead eutectic solder. With multiple choices, which solder should you chose?
This presentation will provide a strengths vs. weaknesses comparison of the main alloy families that have replaced tin-lead solder. Get the facts you need to make the right decision for you.
Your Instructor
Ronald C. Lasky, Ph.D., PE is an instructional professor, Thayer School of Engineering, Dartmouth College, and serves as director of the Cook Engineering Design Center. A senior technologist at Indium Corporation, Dr. Lasky is also a Six Sigma master black belt Instructor, Thayer School of Engineering.
COUNTERFEIT ELECTRONICS I: Strategies for Fighting Counterfeit Electronics
Wednesday, March 17 10:00 am–11:00 am (central)
Counterfeiting in electronics is widely recognized as a global problem. What can you do about it? In this first of two sessions, Dr. James Williams will discuss the key elements required for building strategies to alleviate this epidemic, especially as it pertains to electronics manufacturing. The scope of the global problem will be briefly reviewed, but the focus of this first session is to provide a framework for problem definition for electronics manufacturers.
What You Will Learn
Specific examples will be reviewed, with recommendations for implementation of strategies into existing manufacturing operations.
Your Instructor
Jim Williams is chairman and founder of Polyonics, Inc. He previously founded and headed Imtec, Inc. His primary focus has been on product identification technologies for the electronics/SMT industries. Polyonics develops, manufactures and markets specialty coated films, tags, and pressure sensitive label materials which withstand high temperatures, harsh chemicals, industrial manufacturing processes, and other "hostile environments."
HDI: DESIGN DECISION-MAKING
Thursday, March 18 10:00 am–11:00 am (central)
According to IPC data, in 2007, Japan, Taiwan and China produced $4.1 billion in HDI production. Yet, in North America, HDI production for the same year was $203 million, representing only 3.4 percent of the world market for HDI. Conventional wisdom suggests that with the size and the growth of the HDI market, if the North American PCB industry is going to survive, manufacturers need to significantly penetrate the HDI market.
The truth is that the North American PCB industry has yet to adopt HDI. Although designing with HDI technology has been mainstream in the PCB industry for more than 25 years, only a limited number of US companies and PCB designers have actually used HDI microvias in their designs. This session will provide essential knowledge of the design process, focusing on how and when using HDI design methodologies is both practical and financially necessary.
What You Will Learn
- When should a board be routed with HDI (or not)?
- Why you should create three routing strategies at the start of the design
- How to create channels and boulevards to increase routing density
- General fanout methodologies and exceptions
- Interactive autorouting strategy
- Methodologies for “thinking outside the box”
Your Instructor
Dan Smith has been involved in all aspects of the PCB design process for over 30 years, from concept through manufacturing. He has over 24 years of experience using a variety of EDA tools to design PCBs, flex, thick film and ICs . He has worked as a librarian, designer, and programmer at Motorola, US Robotics, and Shure Brothers.
Smith is the author of several US software patents that have reduced design process bottlenecks. He has taught internationally, has co-written training materials, industry articles and several internal company standards and contributed to IPC standards.
COUNTERFEIT ELECTRONICS II: Technologies for Fighting Counterfeit Electronics
Friday, March 26 10:00 am–11:00 am (central)
In this continuation of Counterfeit Electronics I, Williams will discuss the technology tradeoffs necessary when mitigating the effects of counterfeiting in electronics manufacturing. Concepts discussed in the first session will provide the basis for this analysis. A decision tree structure will be introduced to help organize technology planning for brand protection programs.
Your Instructor
Jim Williams is chairman and founder of Polyonics, Inc. He previously founded and headed Imtec, Inc. His primary focus has been on product identification technologies for the electronics/SMT industries. Polyonics develops, manufactures and markets specialty coated films, tags, and pressure sensitive label materials which withstand high temperatures, harsh chemicals, industrial manufacturing processes, and other "hostile environments.
Back to top
All sessions will run from 10:00 am to 11:00 am central time (Chicago).
Calculate your start time.
|
