|
TECHNICAL WORKSHOPS
TUESDAY, JUNE 15
10:00 am to 1:00 pm
Desmear, Metalization and Electroplating for Rigid Flex and Flexible Printed Circuits
Mike Carano, Vice President, OMG Electronic Chemicals
This workshop will address critical process parameters required for proper desmear, metallization and electrodeposition for flexible and rigid-flexible substrates. The ultimate goal is to prevent defects associated with inadequate adhesion of the deposited metal, issues related to interconnect defects and hole-wall pullaway. Insuring long-term reliability of the plated via is of utmost importance. Additional defects such as delamination, wedge voids, plating folds, microvoids and surface pitting carry significant costs and will be presented from a root cause analysis perspective. Specific issues addressed include:
- Desmear Technology
- Metalization of Flex and Rigid Flex
- Direct Metalization and Direct Metalization Process
- Acid Copper Electrodeposition
- Solderable Surface Finishes for Flex and Rigid Flex
Your Instructor
Michael Carano is vice president of technical operations for OMG Electronic Chemicals, Inc. He holds 29 patents covering a variety of technologies including plating, metallization processes and PCB fabrication techniques. Mr. Carano has published and presented numerous articles in the areas of copper plating, tin plating, PCB technologies, and analytical control of electroplating baths. He serves on the IPC Board of Directors.
TUESDAY, JUNE 15
2:00 pm to 5:00 pm
Test Issues in Flex
Brent Sweitzer, Senior R&D Engineer,
Multek Flexible Circuits, Inc.
What should you be discussing with your customers and vendors regarding flexible circuit materials to ensure your testing strategy is correct? This workshop will address the questions you should be asking, and, more importantly, how to proceed with the answers you are given. You will discover:
- What you need to know about your customer’s requirements
- What you need to know about supplied test data to make materials decisions
- How to determine the correct material and the appropriate test strategy
Your Instructor
Brent Sweitzer has worked in R&D at Sheldahl (Multek Flexible Circuits) for 29 years, developing new adhesiveless copper-polyimide materials, and leading a team that was awarded a grant by the USDC to develop a roll-to-roll patterning process for FPD materials on plastic. Mr. Sweitzer holds two patents. He graduated with honors from Caltech, earning a degree in chemistry, and attended graduate school at UCLA.
Top |
CONFERENCE
TUESDAY, JUNE 15 |
6:00 pm to
8:00 pm |
Networking Reception |
WEDNESDAY, JUNE 16 |
| 7:30 am |
Registration and Networking |
| 8:00 am |
Welcome and Introduction |
| 8:15 am |
Business Opportunities for Flex Manufacturers
- Al Wasserzug, Director of Business Development,
Vulcan Flex Circuit Corporation
- Jay Desai, Director of Marketing, M Flex
|
| 9:15 am |
Embedded Passives and Flex:
It is Happening
- Joel Peiffer, Advanced Applications Engineering Specialist, 3M Company
|
| 10:15 am |
Break |
| 10:30 am |
Impedance in a Flex Application: What Happens to the Signal?
Panel Presentations and Debate
- Happy Holden, Chief Technical Officer, Foxconn
- Robert Sheldon, Applications Engineering Manager,
Pioneer Circuits, Inc.
|
| Noon |
Luncheon |
| 1:30 pm |
Packaging on Flex
- Zach Gaubert, Mechanical Engineer, Raytheon
|
| 2:15 pm |
Reliability Requirements for Flex
- John Bauer, Senior Material and Process Engineer,
Rockwell Collins
|
| 3:15 pm |
New Applications for Liquid Polymer Crystal
- John Coonrod, Marketing Development Engineer, Rogers Corporation
|
| 4:00 pm |
Solving the Challenges of Materials Performance Issues
Impedance, Dimensional Stability, Advance Structures, Thermal Management
- Mark Verbrugge, Flex Circuit Applications Engineer, Minco Products
- Sidney Cox, Research Associate, DuPont
|
| 5:00 pm |
Adjourn |
Contact IPC Professional Development Manager
at +1 847-597-2827 for more information.
Top |
