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High Density Interconnect Webcast Series

September 14-18, 2009

(10:00 am – 12:00 pm Central Daylight time)

PD-05: High Density Interconnect Workshop

October 13-15, 2009 — Crane, Indiana

High Density Interconnect Webcast Series

September 14-18, 2009

(10:00 am – 12:00 pm Central Daylight Time)

This series of five two (2)-hour webcasts will address key technologies for fabricators who want to get into advanced HDI fabrication.

September 14, 2009 - Overview and Design

  • HDI overview and benefits (density, electrical performance and TTM)
  • Manufacturing processes (21 various ‘flavors’ of HDI)
  • Design evolution of board used for the October workshop
    • Evolution from a large 16 layer conventional TH PCB to smaller 12 layer HDI board with embedded capacitance, to 6 layer HDI board incorporating ultra fine line circuits.
    • Methodology for adopting HDI technology in new designs (8 new design strategies required to achieve lower cost and simplification).

September 15, 2009 - Fine-line and Via-Formation

  • Lamination & Via formation — mechanical and laser drilling & lamination of new materials
  • Etching & laser drilling ceramic BC materials for buried capacitors and distributed capacitance
  • Semi-additive processing (SAP) using 5 um copper foil to achieve- 25 um traces and spaces using sacrificial copper foil
  • Semi-additive processing (SAP) using molecular interface technology to achieve 10 micron traces and spaces

September 16, 2009 - Material Control and Lamination

  • Lamination and laser via formation with thin laser drillable prepreg, for power integrity and impedance control
  • Lamination and laser via formation with ultra thin ceramic filled dielectrics for distributed capacitance

September 17, 2009 - Via-Fill

  • Filling and planerizing mechanically drilled buried vias with organic compounds
  • Filling laser formed microvias from 75~150 um in diameter using copper plating processes

September 18, 2009 - Process Control & Reliability

  • Acceptability
    • Performance Specifications – IPC and MIL
    • Process Control – Process Verification
    • Via Structures and Vias
    • Lines and Spaces
    • Planarization
    • Test Methods – Thermal Stress, Electrical
  • Reliability
    • Environmental Test – Thermal Shock, CAF Issues
    • Extended Life Test – IST and HATS

PD-05: High Density Interconnect

October 13-15, 2009 - Crane, Indiana

This HDI fabrication hands-on workshop provides an essential instructive platform for companies interested in learning the advanced fabrication processes of HDI technology. Attendees will be provided a “hands-on” working laboratory event that features informative technical tutorials and an invaluable “hands-on” workshop, where you will actually build these HDI structures.  You will be provided the instructional HDI technology as it relates to advanced HDI fabrication — as needed by numerous aerospace, military, telecom and computer OEMs with an emphasis on high reliability and endurance. Join us for this enlightening series, and discover what you need to know to implement HDI technology in all of its forms.

What You Will Learn:


Tutorial presentations and hands-on exercises cover these topics :

  • Imaging and etching — achieving fine lines and spaces, controlled copper etch
  • Lamination & Via formation — mechanical and laser drilling & lamination of new materials
  • Metallization & Electrodeposition — desmear, electroless copper, direct metalization and semi-additive processing— improved throwing power copper fill, enhancing through hole and microvia reliability, copper thickness requirements for thermal reliability and process controls
  • Process control coupons, DOE, Reliability and testing—in-process coupons for HDI and reliability coupons
  • HDI Exercises at NSWC-Crane Laboratory
  • Fine line Direct Imaging/etching- 25 um traces/25 um spaces (~1 mil lines/spaces) using new sacrificial super-foil “DFF”
  • Lamination of new thin Laser Drillable Prepreg, like 1086LD or 1067LD for power integrity and impedance control
  • Copper “Super-fill” plating to plate up microvias from 75~150 um in diameter
  • Drilled via filling with epoxy to plug buried vias
  • Etching & laser drilling ceramic BC materials for buried capacitors and distributed capacitance
  • HDI process control coupons to monitor the HDI fab process
  • IST coupons to test the reliability of the finished HDI board.
Workshop Instructors for all workshops listed above:
Richard Snogren is the founder of Bristlecone LLC, a technology consulting service. He provides technology support and training to the printed circuit board industry. He was an aerospace materials engineer, managed the electronic packaging and PCB design groups for Martin Marietta Astronautics and spent 25 years in the aerospace sector of the PCB industry. He was co-founder of SAS Circuits, now Coretec Denver. Snogren was a member of the technical staff at Coretec Inc. and was an active member of the recent AEPT (Advanced Embedded Passive Technology Research Consortia), an interdisciplinary research project funded by NIST. He has taught many seminars and authored numerous papers and articles on embedded passives. Snogren has a B.S. in chemistry and biology from Western Michigan University.

Jason Ferguson is the manager of NAVSEA Crane's Embedded Passives Test Bed Project. He has a B.S. in Electrical Engineering. After serving four years as a commissioned officer in the U.S. army, Ferguson joined NAVSEA Crane where he served as a systems engineer. He subsequently joined Crane’s circuit board fabrication shop and now leads efforts of the ECIT (Emerging/Critical Interconnect Technologies) Embedded Passives Materials Test Bed Project.

Michael Carano is with OMG Electronic Chemicals Inc. Carano has been involved in the printed board industry for more than 29 years. Carano has published more than 65 technical articles and has presented numerous other papers throughout the world. He is the holder of nine U.S. patents and more than 20 foreign patents covering a variety of technologies including plating, metallization processes and PCB fabrication techniques. He is the past chairman of the IPC Suppliers Management Council. Carano holds a Bachelor’s degree in Chemistry from Youngstown State University where he has also completed two years of graduate school in polymer chemistry and has earned an MBA in International Marketing from Baker College.

Happy Holden is the senior PCB technologist for Mentor Graphic’s System Design Division in Longmont, CO. He is responsible for advanced and next generation printed circuit technology consulting for Mentor’s customers and MGC engineering. The 10 years prior to joining Mentor, he was the Advanced Technology Manager at Westwood Associates and Merix Corporations. He retired from Hewlett-Packard after over 28 years. Holden formally managed Hewlett-Packard's application organizations in Taiwan and Hong Kong. His prior assignments with HP had been as director of PCB R&D and printed circuits engineering Manager. He holds degrees in Chemical Engineering and Computer Science.

Location, Times and Hotel Accommodations for all workshops

All workshops will be held at NSWC-CRANE, 300 Highway 361, Building 3287 E., Crane IN 47522-5001. Courses will begin at 8:30 am (with onsite registration and sign-in beginning at 8:00 am on the first day) and conclude by 5:00 pm each day.

Please be advised that, due to the distance to the Indianapolis airport, we recommend scheduling a flight out on the following morning.   For out-of-town guests, IPC recommends the following hotels:

Fairfield Inn
120 S. Fairfield Dr.
Bloomington, IN 47404
($84 per night)
+1 812-331-1122

Please contact the hotel directly to make a sleeping room reservation. When calling the hotel, mention NSWC-Crane to get the corporate rate of $84 per night.

Combined Bachelors Officers Quarters (BOQ)
Building 3319
300 Highway 361
Crane, IN 47522-5001
($35 per night)
+1 812-854-1176

Please contact the hotel directly to make a sleeping room reservation. Directions

Since Crane is a military facility, certain security procedures must be followed. Please remember to bring a government-issued ID with you. All attendees will be issued gate passes by Crane. Crane also needs advance notice of non-U.S. citizens who will be entering the facility. If you are a foreign national, please contact our registration department at 1-847-597-2861 or email registration@ipc.org. Note: Your citizenship status will not prevent you from attending.

The deluxe package (all three workshops) is $2,100 for IPC members and $2,660 for nonmembers; an individual workshop is $895 for IPC members and $1,195 for nonmembers. To register, complete the registration form and fax it in. For more information please contact the PD Coordinator at +1 847-597-2827 or via e-mail at pd_coordinator@ipc.org.