Going Green Header

Registration is closed for this event. If you send in a registration form you
will be put on a waiting list and notified if spaces become available.

To: Electronics Industry Leaders
RE: Intel Halogen Free Symposium Sponsored by IPC

Dear Colleagues:

There is continuing debate on halogen-free products for the electronics industry — from the impact on electronic materials to supply chain readiness to even its very definition.

That’s why IPC is teaming with Intel Corporation to produce a symposium on halogen-free technology, January 15–16, 2008, at the Hilton Scottsdale Resort and Villas, in Scottsdale, Ariz.

Mostafa Aghazadeh, Intel Vice President and Director of Chandler Assembly Technology Development explained “this symposium complements Intel’s effort to eliminate halogenated fire retardants from our product packaging as part of a broader strategy to support an environmentally sustainable future.”

Mr. Aghazadeh is scheduled to present the keynote address on Tuesday, and Mr. FY Lee, Vice President of Nan Ya Materials Division, will provide the keynote on Wednesday. Topics covered at the symposium will include OEM’s environmental positions and roadmaps; supply chain readiness and challenges including material availability, cost and reliability.

Key original equipment manufacturers (OEM), original design manufacturers (ODM), electronics manufacturing services (EMS) companies, PCB manufacturers and material suppliers have agreed to participate in the symposium including Intel Corporation, Dell Inc., HP, Apple, EPA, Nan Ya and Lenovo.

The complete agenda is available below. As you can see, the agenda will not only detail OEM halogen-free roadmaps but will also help you address some of the issues halogen free poses for your company.

Who Benefits from Attending/Registration Information

 

Presidents, CTOs, and senior engineering management of PCB manufacturers, materials suppliers, EMS and ODM companies and OEMs will gain significant value from this symposium. Your customers, suppliers and competitors will be gathering valuable information on halogen-free technology at this symposium. Shouldn’t you attend too?

The symposium will be held at the Hilton Scottsdale Resort and Villas, 6333 North Scottsdale Road, Scottsdale, Ariz., telephone 1-480-948-7750. IPC has blocked rooms at the hotel at $199 for a single or double room. Call the hotel at 800-345-6565 on or before December 14, 2007 and mention the IPC/Intel meeting to receive this room rate. The Hilton Scottsdale Resort and Villas is SOLD OUT during our event.  If you are in need of a sleeping room IPC recommends contacting these nearby properties to check on rates and availability:

            Scottsdale Camelback Resort
            6302 E. Camelback Rd.
            Scottsdale, AZ 85251
            (480) 947-3300
            www.scottsdalecamelback.com

Millennium Resort Scottsdale, McCormick Ranch
            7401 N. Scottsdale Rd.
            Scottsdale, AZ 85253
            (480) 948-5050
            www.millenniumhotels.com

The cost of the symposium is $450. Your registration includes: admittance to presentations, meeting materials, breaks, Tuesday and Wednesday luncheons, and a networking reception on Tuesday evening. To register, we invite you to download the event registration form, compete it and return it to IPC. For more information, contact Tony Hilvers, at tel: + 1 847-597-2837, or Nancy Feaster at IPC registration, tel + 1 847-597-2813.

We hope you will take advantage of this unique learning opportunity and attend the symposium.

Regards

Mostafa Aghazadeh, Vice President and Director of Chandler Assembly Technology Development, Intel Corp.

Tony Hilvers, IPC Vice President of Industry Programs

 

Agenda Day 1, Sonora Ballroom (Download in PDF)

Tuesday, January 15

7:30 am Continental Breakfast
8:00 Introductions
Stephen Tisdale, Packaging Manager, Intel
 

8:15

Halogen-Free... A Global Perspective
Mostafa Aghazadeh, Vice President and Director of Chandler Assembly Technology Development

 
9:00
Symposium Goals/Objectives/Expected Outcome
Stephen Tisdale, Packaging Manager, Intel
 
9:10

IPC Halogen-Free Positioning
Fern Abrams, IPC Director of Government Relations and Environmental Policy, IPC

 
9:40
US EPA Flame Retardants in Printed Circuit Boards Partnership
Kathleen Vokes, Project Manager, EPA
 
10:10 iNEMI HF PCB Project Goals — Status
Jim Arnold, iNEMI Program Management Consultant
10:25
Break
 
10:40
Halogen-Free Projects Within the HDP User Group
Scott O’Connell, Environmental Program Manager, Dell Inc.
 
11:10
Comparison of Halogen-Free (HF) and Non-HF Printed Circuit Board
(PCB) Laminate Materials Subjected to Pb-free Soldering Conditions

Bhanu Sood, Test Lab Director, CALCE
 
11:40 IPC 4-33a Halogen-Free Standard Task Group Update — J-STD-709
Scott O’Connell, Environmental Program Manager, Dell Inc.
12:00 pm
Lunch: Pavillion
 
1:00
HP Halogen-Free PCB Qualification Protocol
Helen Holder, Corporate Material Selection Manager, Global Engineering Services, HP
 
1:30
Dell Perspectives on Halogen-Free Electronics
Allen Whitley, Marketing Manager, Environmental Programs, Dell Inc.
 
2:00
Implementing the Brominated Flame Retardant and PVC-Free Transition
Rob Guzzo, Environmental Engineer, Environmental Technologies Group, Apple
 

2:30

BFR & PVC Phase-Out
Dr. Nancy Bolinger, Global Program Mgr, Senior Engineer, Lenovo

 

3:00

Going Green — A Look at Halide Free Conversion Challenges
Dr. Keenan Evans, VP and Director, Quality & Continuous Improvement, ON Semiconductor

3:30

Break

 
3:45
IPC Halogen — Foxconn Approach
Mark Wang, Sr. Director, Foxconn NWInG
 
4:15 Challenges of Going HF on the FC FLI
Glenn Rinne, VP of Wafer Level Packaging, Amkor Technology
4:45 Halogen-Free Readiness on BGA Packaging
G.S. Kim, Engineering Director for Emerging Technologies, Stats-Chippac Limited
5:15

Recap on Day 2 Activities
Stephen Tisdale, Packaging Manager, Intel

6:00

Networking Reception: Pavillion

 

 

Agenda Day 2, Sonora Ballroom
Wednesday, January 16
7:30 am

Continental Breakfast

8:00

Agenda Review
Stephen Tisdale, Packaging Manager, Intel

 
8:10
Halogen-Free Materials, Manufacturing and Supply Chain Challenges
Mr. F.Y. Lee, AVP of Electronic Materials Division, Nan Ya
 
8:55
Supply Chain Implementation Challenges for Halogen-Free
Terrance Richesin, Technology Development Q&R Engineer, Group Lead, Systems Materials Quality and Reliability, Intel
 
9:25
Non Environmental Reasons for Evaluating Halogen-Free Laminates in PCBs and Substrates
Brian Nelson, Manager, New Product Introductions, Sanmina-SCI
 
9:55
Halogen-Free Materials for Advanced Substrate & Printed Circuit Board
Mr. Tetsuro Irino, Senior Engineer, Printed Wiring Board Materials R&D Dept., Hitachi Chemical
 
10:25

Break

10:40

Halogen-Free Laminates on a Global Scale — PCB Fabricator’s Readiness to Support OEM’s Green Initiatives
John Stephens, Director of Technical Marketing, Office of the CTO, Merix Corporation

 

11:10

Novel Halogen-Free Materials for Organic Packaging Substrates
Dr. Tim (Minsu) Lee, Manager, Global Marketing, Doosan

 

11:40

Halogen-Free, The Challenges Ahead
Neal Lin, Quality Manager, Fan & Motor Business Group, Delta

 

12:10 pm

Lunch: Pavillion

1:10

Use of Halogens in Connector Products
David Bender, Director Product Compliance, Tyco

 

1:40

Halogen-Free: A PWB Fabricator’s Perspective
Darren Hitchcock, Sr. Field Applications Engineer, Meadville/Multek

 

2:10

Electrical Impact of HF Package Substrate Materials
Kemal Aygun, HSIO Core Competency Manager, Intel

 
2:40

Halogen-Free — What, Why & How
Jim Cronin, Product Ecology Manager, Environmental Monitoring and Technologies, Inc.

 
3:10

Break

3:25

iNEMI — Halogen-Free and Beyond
Jim Arnold, iNEMI Program Management Consultant

3:35

Intel HF Component Key Properties and Reliability Test Results
Roger Stage, ATTD Quality and Relations Manager and Omar Bchir, Senior Packaging Engineer, Intel

4:20

Substrate/PCB
Dr. Tim (Minsu) Lee, Manager, Global Marketing, Doosan

 

Raw PCB Materials/Substrate
FY Lee, Vice President, Electronic Materials Division, Nan Ya

 

Flux/Paste
Tim Jensen, Indium

 

Components (Pkg)
Mr. Roger Stage, ATTD Quality and Reliability Manager, Intel

 

Connectors
Mr. David Bender, Director, Product Compliance, Tyco


OEM
Dr. Nancy Bolinger, Global Program Manager, Senior Engineer, Lenovo


ODM
Mark Wang, Foxconn
Moderator: Ife Hsu, TD Quality and Reliability Engineer, Group Lead, Intel
 
5:25 Closing Remarks
Stephen Tisdale, Packaging Manager, Intel
5:30 Departure