"Will You Be Ready?: An Endicott Technology Interchange"

What technological advances are on the horizon? More importantly, how will you meet future industry demands? “Will You Be Ready?: An Endicott Technology Interchange” will be held May 14, 2008, in Endicott, NY. Endicott Interconnect Technologies, Inc. has opened up their headquarters to the industry for a day of information exchange and networking. Not only will Endicott Interconnect Technologies, Inc. present a vision of the future, but you will hear from a panel of major industry suppliers on projections for materials, imaging, design and test with a focus on advanced packaging and substrates. You will walk away with a complete picture of supply chain requirements.

What You Will Learn

Begin the day with “Leading Edge Technology: What Will Be Expected of the Supply Chain?,” a keynote address by Voya R. Markovich, Senior Vice President and Chief Technology Officer of Endicott Interconnect Technologies, Inc. He will reveal the company’s customer-driven roadmap and future product requirements. Markovich will also outline the future demands on equipment manufacturers and material suppliers.

Then, a lineup of top technologists will discuss their expectations of the electronics industry supply chain. Rajinder Rai, Endicott Interconnect Technologies, Inc., will discuss the assembly industry’s point of view, emerging technologies, roadmap requirements and challenges. PWB level integration from the OEM’s perspective, challenges and roadmap requirements will be presented by Endicott Interconnect Technologies, Inc.’s Jim Fuller. Jan Vardaman, Techsearch International, will reveal emerging packaging technologies, roadmap requirements and challenges from the semi-conductor industry. Together, they will clearly identify underlying issues and develop strategies to overcome challenges and meet customer needs.

In the afternoon, four of the industry’s leading suppliers will address the industry’s readiness to meet these expectations. Gap analyses, focused on advanced packaging and substrates, will be presented in the areas of:

Materials by Mark Hauge, Raytheon El Segundo — OEM challenges for current and future material needs.
Imaging by Karl Dietz, E.I. du Pont de Nemours and Co. — Fineline imaging in advances in substrates and packaging.
Design by Happy Holden, Mentor Graphics — Substrate issues with high density interconnect.
Test by Jim Axton, DDI — Challenges of test and inspection for advanced packaging.

Don’t miss this rare opportunity to experience the synchronization of the industry, where it is headed and where you need to be.

Agenda
May 13
5:00 – 6:00 pm	Endicott Interconnect Technologies, Inc. Tour
6:00 – 8:00 pm	Networking Reception
May 14
8:15 am	Welcome and Introductions David Rund, President, Taiyo America Chairman, New Technology Subcommittee, IPC PCB Suppliers Counci
8:45 am	Keynote Address Leading Edge Technology: What Will be Expected of the Supply Chain Voya R. Markovich, Senior VP and Chief Technology Officer, Endicott Interconnect Technologies, Inc.
9:30 am	The View From the Assembly Industry: Emerging Technologies, Challenges, & Roadmap Requirements Rajinder Rai, Vice President of R&D and General Manager of ICAS, Endicott Interconnect Technologies, Inc
10:30 am	The OEM View: PWB Level Integration, Challenges, & Roadmap Requirements Jim Fuller, Vice President and General Manager of PCB/SCP Fabrication, Endicott Interconnect Technologies, Inc
11:30 am	The View from the Semiconductor Industry: Emerging Packaging Technologies, Challenges, & Roadmap Requirements Jan Vardaman, Founder and President, Techsearch Internation
12:30 pm	Lunch
1:45 pm	Abilities and Gaps: A Panel Presentation Materials — Mark Haue, Raytheon El Segundo Imaging — Karl Dietz, Senior Industry Manager, E.I. du Pont de Nemours and Co. Design — Happy Holden, PCB Technologist, Mentor Graphics Test — Jim Axton, Managing Director, DDi Transition Services and Program Manager, DDi R&D
4:00 pm	Abilities and Gaps: Question and Answer Segment
4:30 pm	Wrap-up David Rund, President, Taiyo America Chairman, New Technology Subcommittee, IPC PCB Suppliers Council

Who Should Attend

Any representative from a company that manufactures or assembles printed circuit boards, produces electronic assemblies or supplies these companies will benefit. Please register early, as seating is limited.

To Register

Download a registration form (.pdf). For more information, contact Miranda Tully at +1 847-597-2879 or MirandaTully@ipc.org.

Interchange Location and Hotel Information

"Will You Be Ready? An Endicott Technology Interchange" will be held at Endicott Interconnect Technologies, Inc. headquarters, located at 1093 Clark Street, Endicott, NY 13760. Main phone: 866-820-4820. IPC has reserved a block of sleeping rooms at the Comfort Inn Binghamton at the special event rate of $89 per night (available until April 13, 2008). The Comfort Inn Binghamton is located at 1000 Front St., Binghamton, NY. Call +1 607-724-3297 for reservations.

Tour and Networking Reception

Networking is a primary benefit of IPC events. For those who arrive early, there will be a tour of Endicott Interconnect Technologies, Inc. on the evening of May 13 from 5:00 pm to 6:00 pm. Directly following the tour will be a networking reception from 6:00 pm to 8:00 pm. Please indicate on the registration form if you plan to attend.

Transportation

IPC will provide transportation between the Comfort Inn and Endicott Interconnect Technologies, Inc. on May 13 for the tour and reception and May 14 for the event. Please indicate on the registration form by May 1 if you need transportation.