This comprehensive event is a thorough review of product verification at each level of the manufacturing process.

Industry experts will present testing methods and equipment with an emphasis on positioning to match customer expectations. There will be additional focus on:

Time is money, and reducing time to market goes right to the bottom line. Rather than simply finding mistakes after the fact, real process improvement translates to improved yield.  Get the research in your hands that will lead to process improvement!

This event saves time and energy for participants with a full range of strategies and equipment - all in one place. A structured framework for presentations adds value, allowing for for "apples to apples" comparisons: every speaker will answer the same questions, from a specific checklist created by the Program Committee.

This is a great opportunity to come up to speed on new applications of established technologies to the printed circuit board: environmental stress screening (ESS), infrared radiation (IR), ultrasound, and thermal imaging.

Setting the stage for the two-day technical conference is the "Future of Test and Inspection Protocols" workshop on Monday afternoon. concluding with supplier presentations on Wednesday and a facility tour, the IPC International Test and Inspection Technology Conference is critical for Engineering Managers and Test Engineers.

Location and Hotel Accommodations

Both the educational course and technical conference will take place at the Embassy Suites, 2885 Lakeside Drive, Santa Clara, California 95054. For reservations, please call +1 408-496-6400 and ask for the special IPC rate of $199 per night. Rate is subject to change after November 1, 2008.

A test plan is written, approved and then implemented to fulfill the validation process. Test development activities follow documented procedures. Processes have been refined to meet relevant standards.

This workshop will give you an overview on each of those test and inspection processes and how to assess proper test protocol strategies within your test and inspection process.

Topics to be covered

Testing Strategy Overview
Provides insight into the many different methods used for verification that the manufacturing process creates product at quality level demanded by the customer. Various techniques – and their pros and cons – will be discussed.

Understanding Electrical Test

Covers a range of opportunities for ensuring that items purchased or produced will function electrically. Basic methods and equipment usage information is provided to illustrate capability and testing cycle-time for each technique.

Boundary Scan 101

Illustrates basic principles of this test methodology, and how concepts must be built into the semiconductor package at time of die development. This section includes IC testing to ensure overall functionality.

Alternative Inspection Methods

Discusses non-electrical testing techniques used to verify product performance & quality assurance. Visual and X-Ray system technology processes are also addressed.

Test Protocol Risk Assessment

Promotes use of sampling plan techniques, and establishes risk level associated with potential on-conforming product escape. Reviews test strategy redundancy for full product testing coverage.

Who Will Benefit

Both manufacturing and test engineers from OEM and EMS companies of all sizes will gain a solid understanding of today's test and inspection technologies. The rules have changed, and test methodologies have become a collaborative activity between the end customer and the assembler. Cost is a major driver, as well as the need to verify quality and integrity of assemblies in NPI and prototype quantities. Quality control professionals and operations management will benefit as these new rules become an integral part of the manufacturing process. Suppliers of inspection and test equipment will contribute as well as benefit from this workshop.

Instructors

Dieter Bergman, IPC Director of Technology Transfer, has instructed PCB designers for more than two decades, and was instrumental in the development of the IPC-2221, as well as many other design-related IPC standards.

John T. (Jack) Fisher has been in the PCB industry for 35 years, having worked at both IBM and most recently at ITRI (Interconnect Technology Research Institute). While at IBM, Fisher held several senior management and staff positions in maintenance, manufacturing and engineering in both Endicott, N.Y. and Austin, TX. Fisher received IPC’s 1996 Chairman of the Board Award for his work to improve PCB interconnect technology and was elected to IPC's Hall of Fame in 2007.

Arden Bjerkeli, Director of Customer Applications Support, ASSET InterTech, has been involved in the electronics industry for over 20 years. At ASSET, Arden manages the engineering group that provides pre- and post-sales support, customer services, and customer training. Before joining the company, he held engineering management positions at Compaq, responsible for test strategy for desktop computers and server products. His R&D team provided the research that introduced new test methods and fixture innovations.

We expect a strong turn-out for the tabletop display area during the conference breaks and lunch on November 11, 2008 and November 12, 2008. Don't miss out on this opportunity to reach your audience. For pricing information and a tabletop application click here(.pdf).

Tabletop Sponsors:

Media Sponsors

Tour at Hunter Technology:

Hunter Technology has graciously agreed to host a tour after Tuesday’s conference sessions. This is for all registrants. Hunter Technology is located at 2941 Corvin Drive, Santa Clara, CA 95051-0705. Please join us in the lobby of the hotel at 5:30 p.m. We will make arrangements to get from the hotel to Hunter Technology. If you would like to attend and haven’t informed us yet, please call an IPC registration representative at 847-597-2861 or send an email to registration@ipc.org.

Welcome to Hunter Technology

A Trustworthy and Reliable Source of Advanced Electronic Manufacturing Services Including PCB Design, Fabrication & Assembly Services 

Hunter Technology provides a full range of Electronic Manufacturing Services (EMS) including: Printed Circuit Board Design & Layout, PCB Fabrication, PCB Assembly, Contract Manufacturing, Test & Systems Integration. Hunter's high reliability new product introduction (NPI) center is located in the heart of the Silicon Valley. Hunter offers a fully integrated solution insuring you a competitive edge. Hunter's breadth of operations provide you with the ability to source everything from quick-turn prototypes to volume production directly from a single manufacturer.