What a PCB Manufacturer Needs to Know about Photovoltaics

November 25, 2008 — 10:00 am - 11:00 am

(Central Standard Time)

Presented by:

Donald Cullen, Managing Director — Photovoltaics, MacDermid, Inc.

Photovoltaics is the electronics industry's younger brother. Each industry shares some DNA — imaged conductors on dielectric material, layered substrates, severe cost pressures, high dependence on innovation and rapidly evolving electrical designs. But of course, the sibling industries are enticingly different.

There are major changes in store for PV's adolescence, such as the emergence of thin-film and organic photovoltaics, the efficiency gains of chemical metallization, and the huge transition soon to come from achievement of grid-parity. Who will win? Silicon, thin-film, or organic? Germany, China, or the USA? IC, PCB, or green-field PV makers? Cast away your preconceived notions and uncover the real opportunities for next generation PV.

About Donald Cullen:

Don Cullen is the managing director of Photovoltaics at MacDermid in Waterbury Conn. His business unit is responsible for interacting with the worldwide photovoltaic manufacturing supply chain to ensure the correct development, deployment, and use of chemical processes for those industries. Don helped found the Final Finish business group in MacDermid Electronics Solutions, and held the positions of Technology Manager and Director for that group. Most recently, Don directed the OEM & Assembly Applications group for MacDermid, working with large electronics companies to innovate, implement, and service enabling technologies for next generation electronics circuitry. Starting in MacDermid’s Central R&D group 20 years ago, Don holds three patents and has been published in more than 100 magazines, journals, webinars, and industry technical conferences. He’s authored the latest edition of Coombs’ PCB Handbook chapter on Surface Finishes. Don is a chemist from Rensselaer Polytechnic Institute in New York.

Recent Developments in Optoelectronic Data Transfer

December 2, 2008 — 10:00 am - 11:00 am

(Central Standard Time)

Presented by:
Richard Otte, President, PROMEX Industries, Inc.

The presentation addresses the use of optical methods to transfer data and focuses on the continuing displacement of copper by optical technology. The basic differences in the two media are addressed as are the drivers for replacing copper with optical technology. Recent product introductions resulting from these trends as well as some of the key, long term possibilities are discussed.

Advances in Embedded Component Technology -

Both Formed and Placed

December 9, 2008 — 10:00 am - 11:00 am

(Central Standard Time)

Presented by:
Dennis Fritz, Technology Consultant, MacDermid, Inc.

Embedded components are traditionally recognized as formed resistors on internal layers or laminate-like capacitance layers in a multilayer board. However, there are other technologies, including the placement of active silicon chips inside boards.

The largest driver for embedding components is increasing interconnection density. But, system performance or total system cost of manufacture can be drivers in some situations. Finally, some features of a soon-to-be released IPC White Paper on embedded formed resistors and capacitors will be previewed.

About Dennis Fritz:
Since April, 1998, Dennis has been an Independent technology consultant to MacDermid, Inc. Dennis is MacDermid’s principal representative to the IPC. He was editor of the Organic Board Fabrication section of the 2007 IPC Roadmap. Also, Dennis is now leader of the JISSO North America council. He is principally involved with market and technology research at MacDermid. Dennis held other MacDermkid assignments from 1978 to 1997, including sales and marketing management in both printed circuit consumables and semiconductor photoresist. He also now consults with Crane Naval Weapons Depot on the impact of lead-free components being used to repair DoD printed circuit assemblies. Dennis started in the printed circuit industry in 1972 as a technical service representative with duPont’s Riston™ division. He holds a BS degree in chemical engineering from Rose Hulman Institute of Technology and an MBA degree in Marketing from the University of Delaware.