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IPC Summer School Webcast Series:
Back to the Basics
Grow your knowledge of key PCB topics If you’re in the PCB industry, chances are you wear many hats — and that means you need working knowledge of every aspect of the fabrication process. The IPC Summer School Webcast Series, “Back to the Basics” is a convenient, affordable way to gain a solid overview of essential PCB topics. Each webcast is a targeted, one-hour session you can “attend” right from your office — which means there are no travel expenses, and no unnecessary downtime. Plus, each session features a presentation by a respected industry expert, followed by a question-and-answer period. When you register, we will send you a site license for the program. How you use it is up to you! Participate on your own from your office or from home — or reserve a conference room and invite colleagues to join you at no additional cost. Each webcast is just $125 for IPC members. Or, purchase all five for $375 (which is like getting two free). Register now and take advantage of these informative webcasts! |
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July 1, 2008 - 10:00 am - 11:00 am |
About the webcast: To design and manufacture electronics, it is essential to meet cost targets, product introduction windows, process and test yields reliability, environmental and product safety criteria. To achieve this it is imperative to have robust communication between all parties involved in the design and manufacture of the product. The best way to achieve this is to have a well established design For X (DFX) process such as “M” for manufacturing, “A” for Assembly, “E” for Environment, “T” for Testability, “R” for Reliability, “S” for Safety or Simplicity, etc. These and other factors need to be considered during the product design cycle. This webcast will explain a of what makes up an effective DFX process concentrating primarily on Design For Manufacture (DFM) of printed circuit assemblies. It will also discuss how to effectively establish a DFM process in an OEM (Original Equipment Manufacturing) environment where you design and manufacture your own products, an OED (Original Equipment Designer) environment where you design your own products but outsource your manufacturing, and an environment where you outsource both design and manufacturing. About the webcast Instructor: Russell Nowland has a M.S. in Industrial Engineering from the University of Oklahoma. He has worked in the electronics manufacturing industry for 25 years working for Western Electric, AT&T, Lucent Technologies Bell Laboratories, and Alcatel-Lucent. From 1983 to 2000 his primary function was as manufacturing engineer specializing in surface mount assembly and repair. In 1985 he began work on the development of a DFM process for the AT&T Oklahoma City Works. This set of DFM standards later became the basis for the OneLucent corporate DFM Standards. These standards were based on a teamwork approach to DFM between the design and assembly facilities such that all stakeholders were involved in resolution of issues and development of new design and assembly processes. Since 2000, Russ has worked on the development of a DFM process to support Alcatel-Lucent’s multiple EMS providers. This experience has given him a unique insights on the strengths and weaknesses of the OEM/EMS DFM processes. |
Basics of Base Materials |
About the webcast: Gain insight on the many considerations that drive material selection. In one engaging hour, this webcast will explore laminate and prepreg materials, focusing on their manufacture, properties and PCB application. The instructor will review grades of base materials used in printed boards — from low-cost, paper-based (FR-1) to polyimide. In keeping with industry trends, lead-free and halogen-free materials will get special attention. Mark your calendar for this informative webcast, and get better acquainted with the basics of base materials! About the webcast Instructor: Doug Sober has more than 27 years of experience in base materials for printed board applications. He works for Kaneka Texas Corporation, a supplier of high performance toughening agents for thermosetting resin systems. An IPC Hall of Famer, Sober has been chairman of the IPC Base Materials committee since 1992. He is also vice-chairman of the Laminate and Prepreg Materials subcommittee and chairman of IPC’s Halogen-free Task Group. Sober is the U.S.A. Technical Advisor for IEC TC91: Electronic Assembly Technology. He has a B.A. in chemistry from Clarion State College and an M.S. in organic chemistry from Ohio State University. |
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July 17, 2008 - 10:00 -11:00 am |
About the webcast: Find your way through the intricate maze of the printed circuit board fabrication process in this eye-opening webcast. Understanding each step — from surface preparation to electroplating — is critical to minimizing non-conforming defects, especially defects that increase costs and deter customers. In this webcast, the instructor will identify and explain the basics of printed circuit board fabrication with an emphasis on processes and materials. You’ll gain practical knowledge about troubleshooting techniques, plus learn how to identify the effects of upstream and downstream processes in the PCB fabrication process, along with the latest in processing alternatives and quality control. Be sure to join us for this information-packed hour! About the webcast instructor: Michael Carano is with OMG Electronic Chemicals (formerly Electrochemicals), a developer and provider of processes and materials for the electronics industry supply chain, including fabrication of printed wiring boards, solar cell production, electronic packaging and lead-free metallization. A 29-year veteran of the printed board industry, Carano’s primary focus is on metallization technologies, electroplating, solderable finishes, HDI, selective metal finishing, semiconductor packaging and imaging processes. He also looks for new ways to increase the competitiveness of the North American printed wiring board industry, and is involved in strategic planning and technology roadmap formulation and implementation. Carano has published more than 65 technical articles and has presented numerous other papers throughout the world. He holds nine U.S. patents and more than 20 foreign patents. Currently, he is serving his second term on the IPC Board of Directors; he is also the past chairman of the IPC Suppliers Management Council. He holds a bachelor’s degree in Chemistry from Youngstown State University, where he also completed graduate studies in polymer chemistry, and earned an MBA in International Marketing from Baker College. |
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July 24, 2008 - 10:00 am - 11:00 am |
About the webcast: Get practical guidance on how to identify and prevent costly defects in printed circuit boards during this helpful webcast. Whether the defect is interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting or hole-wall pull-away, its root cause (or causes) may not be readily apparent. In this webcast, you’ll get an overview of common defects, and find out where they tend to originate — often several process steps before they appear. Solderability and assembly-related issues such as outgassing and blow holes will also be reviewed. The webcast will conclude with an overview of imaging, including liquid-photoimageable solder masks. Also on the agenda are strategies to solve solder mask peeling, poor circuit trace coverage, skips, bubbles and poor adhesion in nickel-gold plating. An exploration of mask equipment and its effect on solder mask quality is also planned. Don’t miss this opportunity to discover key troubleshooting strategies that can help you reduce scrap product and improve yield. (Note: It is recommended that participants have some knowledge of the PCB fabrication process.) About the webcast instructor: Michael Carano is with OMG Electronic Chemicals (formerly Electrochemicals), a developer and provider of processes and materials for the electronics industry supply chain, including fabrication of printed wiring boards, solar cell production, electronic packaging and lead-free metallization. A 29-year veteran of the printed board industry, Carano’s primary focus is on metallization technologies, electroplating, solderable finishes, HDI, selective metal finishing, semiconductor packaging and imaging processes. He also looks for new ways to increase the competitiveness of the North American printed wiring board industry, and is involved in strategic planning and technology roadmap formulation and implementation. Carano has published more than 65 technical articles and has presented numerous other papers throughout the world. He holds nine U.S. patents and more than 20 foreign patents. Currently, he is serving his second term on the IPC Board of Directors; he is also the past chairman of the IPC Suppliers Management Council. He holds a bachelor’s degree in Chemistry from Youngstown State University, where he also completed graduate studies in polymer chemistry, and earned an MBA in International Marketing from Baker College. |
Printed Circuit Board Test and Inspection August 7, 2008 - 10:00 - 11:00 am |
About the webcast: Printed circuit board test and inspection serve as an essential line of defense against faulty product getting out of your facility and into the hands of your customers. This targeted webcast will focus on different test and inspection methodologies and where they can be deployed, as well as what drives the need for test and inspection. You’ll also get insights on the tradeoffs you need to consider when choosing your inspection strategy. Make an investment in the success of your assembly operation by discovering how to best put test and inspection to work for you. About the webcast instructor: Stacy Kalisz Johnson’s first entry into the electronic packaging arena was with the Interconnect Systems Laboratory at Motorola, where she was a package development engineer. In 2000, Johnson transitioned to the test and measurement equipment world: she joined MV Technology as a senior applications specialist, where she developed the flux and paste inspection product portfolio in the electronic packaging industry. Johnson transitioned to the Product Manager/Product Marketing Engineer role for the Medalist SP50 solder paste inspection system for the Ireland Imaging Operation at Agilent Technologies (formerly MV Technology); and later took on responsibility for the SJ50 and the automated X-ray. Most recently, Johnson has served as the Americas Marketing Development Manager. This new role expands her responsibility to include all the previously mentioned imaging products as well as In-Circuit Test. Johnson holds a B.S. and M.S. in mechanical engineering from the Rochester Institute of Technology and a Master’s Certificate in Project Management from George Washington University. |
| Registration Information: |
Each webcast will begin at 10:00 am (U.S. Central Daylight Savings Time) and conclude at 11:00 am (U.S. Central Daylight Savings Time). Just complete the linked registration form below and return it to IPC's registration department via fax to +1 847-615-5661. If you have any questions regarding the webcasts, please contact Michelle Michelotti at +1 847-597-2822 or via email at MichelleMichelotti@ipc.org. Time Zones: Webcast registrants will receive a link to download the materials along with the call-in telephone number 24 hours prior to the start of each webcast. Please feel free to make copies for all participants attending at your location. Set up a conference room and attend with colleagues, or log in from the convenience of your home. Audio will be provided via a conference call phone number and participants will need Internet access. Remember to check local times to make sure you don't miss a minute. |
IPC Summer School Webcast Series:
Back to the Basics
Download Registration Form here
| Registration Form | IPC/DC Member |
Nonmember |
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| Webcast Package: (The package includes all 5 webcasts) |
$375 (U.S.) |
$450 (U.S.) |
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Individual Webcast(s):
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$125 (U.S.) each webcast |
$150 (U.S.) each webcast |
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Payment by Mail or Fax: To register by mail: Send check made payable to IPC, 3491 Eagle Way, Chicago, IL, USA 60678-1349. To register by fax, please fax registration form to +1 847-615-5661, along with your credit card information. Cancellation Policy: No refunds will be issued after the login and password have been e-mailed. If you have any questions, please contact IPC’s registration department at registration@ipc.org or call +1 847-597-2861. Charge my credit card (check one): Total to be charged $_____________ Membership status will be verified upon receipt of registration form. Receipts will be sent only upon request. Cancellation Policy: No refunds will be issued after the login and password have been e-mailed. If you have any questions, please contact IPC’s registration department at registration@ipc.org or call +1 847-597-2861. |
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