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PD-01: Fundamentals of Classic, HDI, Hybrid, Flex/Rigid Flex Multilayer Printed Circuit Board Technology PD-02: Hands-on PCB Manufacturing 101-Conventional Innerlayer Processing PD-03: Hands-on PCB Manufacturing 102-Conventional Outerlayer Processing
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PD-01: Fundamentals of Classic, HDI, Hybrid, Flex/Rigid Flex Multilayer Printed Circuit Board Technology Classic printed circuit board, high density interconnect (HDI/microvia), and hybrid multilayer, flex and rigid flex printed circuit board technology will be explored. Topics include:
Advanced PCB technologies and exotic interconnection structures, including HDI/microvia, hybrid constructions and materials and, flex and rigid flex, will also be discussed. This training program was created to build a strong foundation of knowledge and understanding for the PCB user community including engineering, design, project management, materials and process, manufacturing, quality, and procurement. It bridges the user’s gap to PCB manufacturing, enabling the users to perform their jobs more effectively and benefit their organizations with quality improvements, cost savings and cycle time reductions. The course is also very beneficial for process engineers new to PCB manufacturing. For a new chemical or mechanical engineer just starting a career as a PCB process engineer, two days of this course is equivalent to two months of OJT. Further, completing the advanced “hands-on” training courses is equivalent to 6 months or more of OJT. The course will more than pay for itself in quality improvements, cost savings and cycle time reductions. First in a series:This course is the first of a multi-part series that will move progressively through advanced and state-of-the-art PCB technologies combining classroom lecture with detailed “hands-on” fabrication experience in a state-of-the-art PCB manufacturing facility. |
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PD-02: Hands-on PCB Manufacturing 101-Conventional Innerlayer Processing This workshop will help you build a broad and in-depth PCB technology foundation by providing focused curricula and learning experiences through lecture and hands-on processing in a state-of-the-art PCB manufacturing facility. The innerlayer processing course is a detailed hands-on PCB fabrication training on classic or conventional multilayer boards. It is built on the foundation of the March 2008 course, Fundamentals of Classic, HDI, Hybrid, Flex/Rigid Flex Multilayer Printed Circuit Board Technology. This workshop covers front end engineering, dealing with customer design inputs through the fabrication of all types of inner layers. The course will show you how to characterize the manufacturing processes in terms of capability, thresholds of through-put, and yields and how to present this information to designers to help them understand cost vs. design characteristics. What you will learn: In addition to that, learn different image methods, (photo and laser direct imaging) and the thresholds of resolution (line width and space) side-to-side layer registration produced by these processes. The effects of copper foil, type, thickness and core material on line and space thresholds and layer registration will be studied. Techniques for scaling photo and drill tools will also be taught. Who will it benefit: The course is designed for PCB process engineers or students wishing to pursue a career in PCB process engineering. Design engineers preparing for the CID exam would also benefit from the course, as well as OEM material and process engineers needing to learn more about PCB manufacturing technology. |
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PD-03: Hands-on PCB Manufacturing 102-Conventional Outerlayer Processing Will your value to the company increase if you have a clearer and more solid understanding of PCB technology? Are you ready to advance your career by expanding your capabilities and background? This workshop will help you build a broad and in-depth PCB technology foundation by providing focused curricula and learning experiences through lecture, hands-on samples, and a virtual tour of a state-of-the-art PCB manufacturing facility. This Outerlayer Processing course is a detailed hands-on PCB fabrication tutorial on classic or conventional multilayer boards. The multilayer boards are built on the foundation of the March course, PCB Training, Fundamentals of Classic, HDI and Hybrid Multilayer Printed Circuit Board Technology. This workshop takes the innerlayers of that workshop and runs them through the balance of the fabrication processes. Both the March and april courses will show you how to characterize the manufacturing processes in terms of capability, and thresholds of through-put, and yields and how to present this information to designers to help them understand cost vs. design characteristics. What you will learn: Similar to the innerlayer workshop, learn the benefits of various image methods for outer layers. Outer-layer finishing, soldermask, solder, lead-free solders and alternative finishes will be taught. Finishing the final board profile and preparing it for final inspection and acceptance is also covered. Finally, all inspection and test methods, electrical, mechanical, visual, microsections, and documentation will be covered. Who will benefit: |
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Workshop Instructors for all workshops listed above:
Richard Snogren is the founder of Bristlecone LLC, a technology consulting service. He provides technology support and training to the printed circuit board industry. He was an aerospace materials engineer, managed the electronic packaging and PCB design groups for Martin Marietta Astronautics and spent 25 years in the aerospace sector of the PCB industry. He was co-founder of SAS Circuits, now Coretec Denver. Snogren was a member of the technical staff at Coretec Inc. and was an active member of the recent AEPT (Advanced Embedded Passive Technology Research Consortia), an interdisciplinary research project funded by NIST. He has taught many seminars and authored numerous papers and articles on embedded passives. Snogren has a B.S. in chemistry and biology from Western Michigan University. Jason Ferguson is the Manager of NAVSEA Crane's Embedded Passives Test Bed Project. Has a B.S. in Electrical Engineering. After serving four years as a commissioned officer in the U.S. army, Ferguson joined NAVSEA Crane where he served as a systems engineer. He subsequently joined Crane’s circuit board fabrication shop and now leads efforts of the ECIT (Emerging/Critical Interconnect Technologies) Embedded Passives Materials Test Bed Project. |
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Location, Times and Hotel Accommodations for workshop PD-01 (March 4-5, 2008): Location, Times and Hotel Accommodations for PD-02 & PD-03 (April 22-24 & May 28-30, 2008): Please be advised that due to the distance to the Indianapolis airport, we recommend scheduling a flight out on the following morning. For out-of-town guests, IPC recommends the following hotels: Fairfield Inn Please contact the hotel directly to make a sleeping room reservation. When calling the hotel, mention NSWC-Crane to get the corporate rate of $84 per night. Combined Bachelors Officers Quarters (BOQ) Please contact the hotel directly to make a sleeping room reservation. For directions, please click here to view the PDF. Since Crane is a military facility, certain security procedures must be followed. Please remember to bring a government-issued ID with you. All attendees will be issued gate passes by Crane. Crane also needs advance notice of non-U.S. citizens who will be entering the facility. If you are a foreign national, please contact our registration department at 1-847-597-2861 or email registration@ipc.org. Note: Your citizenship status will not prevent you from attending. |
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Fundamentals of Classic, HDI, Hybrid, Flex/Rigid Flex Multilayer PCB Technology 03/4-5/2008 - Bannockburn, IL 