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Dr. Lee is vice president of technology of Indium Corporation of America. He has 20+ years of experience in the development of fluxes and solder pastes for SMT. In addition, he is very experienced in the development of high temperature polymers, encapsulants for microelectronics and adhesives. Dr. Lee has a Ph.D. in polymer science from the University of Akron and a B.S. in chemistry from National Taiwan University.

Happy Holden is a PCB technologist for Mentor Graphics’ System Design Division. Holden has spent 36 years in printed circuit engineering, customer support and product development, with five of those years in Taiwan and Hong Kong. Before retiring from Hewlett-Packard after 26 years, Holden was responsible for the creation and startup of the NanYa PCB Division in 1984. Holden has a B.S. in chemical engineering from Ohio State University and an M.S. in computer science.

Werner Engelmaier has more than 42 years experience in electronic packaging and interconnection technology. He is the president of Engelmaier Associates, L.C., a firm providing consulting services on reliability, manufacturing and processing aspects of electronic packaging and interconnection technology. Prior to forming his own company, Engelmaier was a distinguished member of the technical staff at AT&T Bell Laboratories for 24 years. Engelmaier is the author of more than 170 technical publications. He chairs the IPC Committee on Product Reliability, is an IMAPS Fellow, received the IEPS Electronic Packaging Achievement Award and the IPC President’s Award, and is a member of the IPC Hall of Fame.

As a faculty member of the Rochester Institute of Technology (RIT) and director of the Center for Electronics Manufacturing and Assembly in Rochester, NY, Professor Ramkumar teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the CIM and Surface Mount Electronics Manufacturing Laboratory and curriculum at RIT and has been the principal investigator for several applied research projects.
Barry Morris has been in the electronics industry for some 40 years, his career started with the Marconi Company where he was employed in Production, Quality and Management positions. He also spent a number of years as a lecturer in Soldering and PCB repair techniques at the Marconi training college. In 1989 he set up Advanced Rework Technology (ART) this was to become e premier practical training centre for the UK and Europe. In 1996 he became a Master IPC trainer for the IPC-A-610, becoming the first Master Trainer and IPC Certification Centre in the UK. He is also a master trainer for IPC-A-620, J-STD-001 and IPC 7711/7721. He is a member of the IPC tasks groups for Assembly and Soldering series of standards. He is a member of The Institute of Circuit Technology and also sits on a number of BSI committees. He has trained and lectured at many companies and seminars around the UK and Europe and published many technical articles in specialist Electronics publications.