09:00-17:00 FULL DAY |
S-01: Achieving High Reliability for Lead-Free Solder Joints — Materials Consideration
Ning-Cheng Lee, Ph.D.
Indium Corporation of America |
This session addresses how multiple factors contribute to failure modes, and how proper solder alloys and surface finishes are selected to achieve high reliability. Material considerations, joint mechanical properties and the role of intermetallic compounds (IMC) will be discussed, along with failure modes, thermal cycling reliability and solder joint fragility. Electromigration, corrosion and tin whiskers will also be discussed. |
09:00-12:00 HALF DAY |
S-02: Designing PCBs for Lowest Cost-Reducing Layers and Other DfM Principles
Happy Holden, Mentor Graphics |
One of the secrets to “low cost boards” has been manufacturability. This session will highlight the issues, choices, alternatives and conditions that designers need to consider in order to make a printed circuit board manufacturable at the lowest cost. Explanation of the IPC-9151 capability benchmarking program will also be provided. |
| 14:00- 17:00 HALF DAY |
S-03: Updating Rework and Repair for Lead Free
Barry Morris , ART Advanced Rework Technology |
Lead-free manufacturing brings new challenges in achieving satisfactory production results. Many myths have evolved regarding the lead-free process — particularly the high costs of rework and repair, and potential replacement of equipment. This seminar presents the opportunity for manufacturers and repair organizations to upgrade lead free soldering and rework. It will assist in implementation of work skills and inspection habits to carry through the next generation of manufacturing requirements. |
09:00-17:00 FULL DAY |
S-07: What is HDI? Do You Need HDI? How to get Started
Happy Holden, Mentor Graphics |
Developed for PCB fabricators as well as designers, this full-day session addresses key technologies for fabricators who want to get into HDI fabrication. Key design recommendations and stackups for designers and hardware engineers who want to know what HDI can do for their next printed circuit board will be explored. Fabricators will get insights into how HDI board designers select stackups, design rules and features; designers will learn about issues and cautions that arise when fabricating an HDI-microvia board. |
09:00-12:00 |
S-10: Stencil Printing Process for Solder Paste Application: An In-Depth Look
S. Manian Ramkumar, Ph.D.
Rochester Institute of Technology
|
This session will provide a thorough understanding of the print process for solder paste print applications. Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. A brief discussion on using this process for adhesive print applications is also included. |
S-12: Reliability Issues with Lead-Free Soldering Processes
Werner Engelmaier,
Engelmaier Associates L.C. |
The switch to lead-free solder raises issues on the manufacture, processing and reliability of lead-free electronic products. Adequate reliability of surface mount solder attachments can only be assured with a “Design for Reliability” based on solder joint behavior and the underlying fatigue damage mechanisms. In this workshop, appropriate testing to assess the extent of the various reliability threats will be discussed. Strategies to assure the reliability of solder attachments, printed circuit boards (PCBs), and components in electronic product subjected to lead-free soldering will be explained. |
| 14:00-17:00 |
S:11 Advanced Component Packages— An Introduction Including Lead-Free Implementation
S. Manian Ramkumar, Ph.D.
Rochester Institute of Technology |
This session will introduce SMT users to the terminology, classifications, construction and assembly process for advanced component packages. Packages discussed in this session include BGAs, CSPs, flip chip, wafer level CSPs, COB, TAB and MCMs. A thorough comparison of the advantages and disadvantages of each component type, as well as their implementation requirements, will be presented. |
S-13: Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias (PTHs/PTVs) Including Lead-Free Soldering Impact
Werner Engelmaier
Engelmaier Associates L.C. |
The topic of whether or not lead free is reliable enough for harsh environment electronics will be rationalized by addressing 20 key questions. Based on the sustained development effort, testing data and manifold evaluations, this workshop dissects what it takes to perform in a harsh environment. The question on whether a life-prediction model can assure reliability will be discussed. A relative reliability ranking among viable systems, as well as the scientific, engineering and manufacturing reasons behind the ranking will be outlined. |
