Meeting the requirements of RoHS compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the industry. Find new strategies for implementation at IPC and JEDEC’s conference on Transitioning to Lead Free — Strategies for Implementation, December 8-10, 2008 in Dallas, Texas.

The event features a full-day technical conference with an outstanding roster of speakers on a host of lead-free topics. Two full days of informative half-day workshops will be offered as well.

A variety of registration options are available to meet every need. Register by November 21, 2008 and SAVE 10%.

Location & Hotel Accommodations

The technical conference and workshops will be held at the Fairmont Dallas, 1717 N. Akard Street, Dallas, Texas 75201. To reserve your sleeping room, please contact the hotel directly at +1 214-720-2020 and ask for the JEDEC/IPC Lead-Free special rate of $159 per night.  Rooms and rate are subject to change after November 23, 2008.

The threat to the reliability of electronic products comes from three sources: solder joint reliability, printed circuit board survival during soldering (and long-term reliability) and component survival of soldering processes. This course will examine each of these threats in detail. (Solutions will be offered in the afternoon workshop, PD-01.) , and explore solutions that can help assure the survival and reliability of electronic assemblies.

What You Will Learn
• Failure modes, their underlying damage mechanisms and possible solutions
• Processing issues associated with lead-free solders, particularly SAC solders
• Impact of processing issues on solder joint quality and assembly damage
• Design, material choice and processing steps to assure survival of PCBs and components
• PCB and component resin systems
• The risk of latent defects and how to prevent them
• Design-for-Reliability (DFR) measures

Who Should Attend
The course is recommended for anybody concerned with the quality and reliability of electronic products in light of the significantly higher soldering temperatures required for the solders meeting the RoHS mandate. The tutorial is especially important for managers and engineers involved with the design, manufacture and assembly of printed circuit boards. It is of special significance for high-reliability applications, as well as for those involved in the production of high-density electronic assemblies, and applications requiring reliable operation in severe use environments and/or for long product lives.

A continuation of the morning's workshop, this course will provide solutions to the problems associated with the switch to a lead-free soldering process, regarding the manufacture, processing and reliability of electronic products using lead-free solders.

About the Instructor

Werner Engelmaier has more than 42 of years of experience in electronic packaging and interconnection technology. He is the president of Engelmaier Associates, L.C., a firm providing consulting services on reliability, manufacturing and processing aspects of electronic packaging and interconnection technology. Prior to forming his own company, Engelmaier was a distinguished member of the technical staff at AT&T Bell Laboratories for 24 years. Engelmaier is the author of more than 170 technical publications. He chairs the IPC Committee on Product Reliability, is an IMAPS Fellow, received the IEPS Electronic Packaging Achievement Award and the IPC President’s Award, and is a member of the IPC Hall of Fame.

Get an in-depth understanding of failure mechanisms unique to lead-free electronics, and the tools and techniques to identify those mechanisms. Mechanisms will be addressed for component packaging, discrete components, printed circuit boards and interconnects. A physics of failure (PoF) based approach will be taken, identifying drivers such as defect-driven, overstress and wearout, and how an understanding of these stress-strength interactions can provide guidance on the appropriate corrective and preventative action. A wide variety of case studies will be presented, including red phosphorus in epoxy encapsulants, creepage corrosion in immersion silver and solder joint failures.

What You Will Learn
• Changes prerequisite with lead-free electronics
• Other “green” materials
• Identifying lead-free materials failure analysis
• Packaging (die attach, epoxy encapsulant)
• Component plating
• Conductive anodic filaments caused by lead-free reflow soldering
• Plated-through hole fatigue
• Electrochemical migration
• Interconnects
• Solderability issues
• Overstress (mechanical shock, bending)
• Intermetallic formation
• Wearout (thermal cycling, vibration)

Who Should Attend
This course is intended as an introductory- to intermediate-level course for board-level designers, component engineers, quality engineers, reliability engineers and their managers.

About the Instructor

With the ever-changing landscape of eco-compliance, companies need a quick and reliable way to gather, track and report environmental compliance data for the electronic products they manufacture and distribute. From certificates of compliance to materials declarations, every company needs to be prepared to respond to a governing agency inquiry or a customer request for proof of compliance. This workshop will cover the basics of a data management system, and explain what data should be available for an audit based on existing eco-compliance legislation. There will also be some discussion of emerging eco-compliance legislation.

What You Will Learn
• Strategy for eco-compliance data management systems; as well as general eco-compliance programs
• Best practices for small to medium-sized enterprises (SME)
• Requirements for existing and expected international eco-compliance requirements – such as design, recycling, production and manufacturing

Who Should Attend
Project managers, engineering managers, CFOs, CIOs and environmental compliance managers will benefit from this session.

Is lead free reliable enough for harsh environment electronics? Based on sustained development efforts, testing data and manifold evaluations, this course dissects what it takes to perform in a harsh environment, and the rationale behind it. The course will also explore whether a life-prediction model can assure reliability. A relative reliability ranking among viable systems — as well as the scientific, engineering and manufacturing reasons behind the ranking — will also be outlined.

What You Will Learn
• What it takes to perform in harsh environments
• What constitutes reliability — philosophy, principle, practice, cost factor
• The most hazardous elements to electronics performance and reliability
• How lead free and SAC compare to SnPb in terms of reliability
• How to assess and maximize solder joint reliability and the assembly’s integrity for harsh environments
• Which lead-free systems are viable in harsh environments

Who Should Attend
The course provides a higher level of working knowledge to all who are involved with or interested in the reliability of lead-free packaging and assembling. This course is also designed for those who desire the broad-based information, as well as the reasons behind the performance and the test data versus performance.

About the Instructor

The electronics industry is moving rapidly to lead-free soldering, with a new emphasis on the solderable finishes that protect the bare copper prior to assembly. In addition to coplanarity, these surface finishes provide the optimum lead-free solder paste spreadability and lead-free solder through hole fill for optimum joint strength. Higher temperature melting points for lead-free solders will add additional heat stress and aging. How will this impact solderability and long term reliability? Learn what printed circuit board manufacturers must do to be successful with lead-free finishes.

The attendees of this half-day workshop will be able to study and discuss the potential impact of lead-free components, review a number of component manufacturers’ specifications, consider a number of compatible surface finishes for the circuit boards and better understand the assembly process variables for the lead-free solder compositions currently in use for SMT.

About the Instructor

Lead-free board assembly and the accompanying higher reflow temperatures has increased the moisture/reflow sensitivity of plastic/organic components. Proper classification, handling, shipping, and usage of moisture sensitive components are critical for reliable products. This course addresses the impact lead-free assembly has on moisture sensitivity classification and provides background information on moisture/reflow effects. J-STD-020 and J-STD-033, the leading industry specifications for detailing proper moisture/reflow sensitivity procedures and classification will be reviewed in detail.

Sponsorship Opportunities

Suppliers, manufacturers and users will be in attendance at this conference. Your company can showcase its services and products as a tabletop exhibitor, or take advantage of one of the many sponsorship opportunities available for this conference.

View the list of available sponsorship opportunities here (.pdf) or contact Tina Nerad at +1 847-597-2826 or via e-mail at TinaNerad@ipc.org.

Media Sponsors

Tabletop Exhibitor

We expect a strong turnout for the tabletop display area during the conference breaks and lunch on December 9, 2008. Don't miss out on this opportunity to reach your audience. Get pricing information and a tabletop application here (.pdf).

LOOKING FOR SAVINGS?

• Early Registration Discount — Register by November 21, 2008, and save an additional 10%
  

• Group Discount — Register three individuals from your company at the same time and receive the fourth registration FREE. (Note: The discount will apply to the lowest-cost registration.)
  

Registration Form (.pdf)