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IPC and the Jisso International Council (JIC) are sponsoring a technical seminar, May 21-22, 2008, to provide information on the latest trends in interconnection technologies used in electronic products. The seminar will be held in conjunction with the 2nd Jisso International Forum being hosted by Georgia Institute of Technology. Members of JIC, as well as technology leaders from industry will be speaking on environment—friendly manufacturing, three-dimensional integration, interposer substrates, and standards activities.
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- Overviews of major areas of the total packaging solution
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- The total package solution by Jisso level
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- Printed and embedded electronics
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- SiP, TSVs and 3–D packaging
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- Energy conservation and generation
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Attendees will get a comprehensive view of both integrated electronics development and manufacture, in addition to valuable inputs on interconnect technologies that will impact the electronics industry over the next ten years. If you want to gain a comprehensive understanding of the key issues in electronic interconnections, this seminar is a must.
Who is JIC
The purpose of the Jisso International Council is to promote a strategic partnership among global organizations interested in the total solution for interconnecting, assembling, packaging, mounting, and integrating system design. The Jisso International Council is made up of key personnel from organizations within the electronics industry — EIPC, EECA, JARA, JEITA, JEDEC, JEC, Jisso Japan, JNAC, JPCA, iNEMI and IPC.
Registration Information
In order to secure your registration for this event, we encourage you to pre-register by May 9, 2008. For more information, or if the registration deadline has passed, contact an IPC registration representative at +1-847-597-2861 or send an e-mail to registration@ipc.org.
Cancellation Policy: Cancellations received before May 20, 2008 will be refunded in full. Refunds will not be issued after the start of the program. Individuals failing to cancel will be billed for the registration fee. If you are unable to attend, you may send a coworker in your place.
Location and Hotel Accommodation
Jisso and IPC are grateful to Georgia Institute of Technology for hosting this seminar. The seminar will take place at the Manufacturing Research Center (MARC) on the Georgia Institute of Technology campus located at 813 Ferst Drive N.W., Atlanta, Ga.
To find a hotel listing, directions to MARC, and local area maps, we encourage attendees to visit www.marc.gatech.edu/travel for travel information to Georgia Institute of Technology. |
| Forum Agenda — May 21, 2008 |
| 7:30 am |
REGISTRATION |
| 8:00 am |
Welcome and Introduction to JIF 2008
Denny Fritz, SAIC, Inc. |
| 8:10 am |
Welcome to Georgia Tech
Rao Tummala, Ph.D., Georgia Institute of Technology |
| Session 1: Overview of Major Areas of the TPS — Session Chair, Denny Fritz, SAIC, Inc. |
| 8:30 am |
Current Interconnect & Assembly Technology
Rao Tummala, Ph.D., Georgia Institute of Technology |
| 9:00 am |
Regional Comparison of Existing & Anticipated Electronics Environmental Regulations
Krista Botsford, Botsford Eco-Tech Partners (formerly 5-Trees) |
| 9:30 am |
Markets Driving Interconnect and Assembly Needs
Jan Vardaman, TechSearch International Inc. |
| 10:00 am |
BREAK |
| 10:15 am |
Improved Factory Performance through Standardized Communication
Andy Dugenske, Georgia Institute of Technology |
| Session 2: The Total Package Solution by Jisso Level — Session Chair, Dieter Bergman , IPC |
| 10:45 am |
The TPS: Jisso Level Definitions & Trends
Akikazu Shibata, JPCA |
| 11:15 am |
Module Packages: Technology, Infrastructure, Environment and Standards Issues
Bill Chen, ASE Group |
| 11:45 am |
Unit Packaging
Stanley Bentley, Diversified Systems Inc. |
| 12:15 pm |
How SiP, TSV & 3–D Microelectronic Packaging Yield Price/Performance Improvements & Keep Moore’s Law Viable Longer
Bill Chen, ASE Group |
| 12:45 pm |
LUNCH |
Session 3: Reliability & Quality — Session Chair, Jack Fisher, Interconnect Technology Analysis, Inc. |
| 2:00 pm |
Anisotropic Mechanical Properties of Sn and Sn-Rich Solders for Electronics
Yoshiharu Kariya, Shibaura Institute of Technology |
| 2:30 pm |
Trends in Product Reliability: What is Failing and Why?
Myra Torres, CALCE |
| 3:00 pm |
Effect of Process-Induced Voids on Isothermal Fatigue Resistance of Solder Joints
Qiang Yu, Yokohama National University
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| 3:30 pm |
BREAK |
| Session 4: Thermal Management Solutions: Energy Conservation & Generation — Session Chair, Dick Otte, PROMEX Industries, Inc. |
| 3:45 pm |
Thermal Management of Microsystems: From Chips to Data Centers
Prof. Yogi Joshi, Georgia Institute of Technology |
| 4:15 pm |
Recent Advances in Organic Solar Cells
Dr. Benoit Domercq |
| 4:45 pm |
Leveraging FPGA Features to Address Power Management Challenges
Dieter Bergman, IPC
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| 5:15 pm |
NETWORKING RECEPTION & Casino Night
Sponsored by Georgia Institute of Technology |
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| Forum Agenda — May 22, 2008 |
| 8:30 am |
Welcome to JIF 2008 Day 2
Denny Fritz, SAIC, Inc. |
| Session 5 Nano Materials — Session Chair, David Norton, NanoDynamics Inc. |
| 8:35 am |
Nanotechnology and Electronics Standards
David Norton, NanoDynamics Inc. |
| 9:05 am |
Current & Anticipated Electronics Applications of Nano Materials
Kristin Abkemeier, Lux Research |
| 9:35 am |
Nano HSE and Worker Protection
Vladmir Murashov, Ph.D., National Institute for Occupational Safety and Health |
| 10:05 am |
BREAK |
| 10:30 am |
Progress and Prospects for Nano HSE
Vicki Colvin, RICE |
| Session 6: Printed & Embedded Electronics — Session Chair, Michael Weinhold, EIPC |
| 11:00 am |
Printed Electronics: Current and Anticipated Capability and Costs
Michael Weinhold, EIPC |
| 11:30 am |
Printed Board Technology Pressure
Henry Utsunomiya, Interconnect Technologies, Inc. |
| 12:00 am |
Current & Anticipated Printed Electronics Applications
Joe Fjelstad, SiliconPipe, Inc |
| 12:30 pm |
LUNCH |
| 1:00 pm |
Emerging Applications and Material Issues for Embedded Components
Karen Carpenter, TechSearch International Inc. |
| Session 7: SiP, TSVs & 3–D Packaging — Session Chair, Jürgen Wolf, Fraunhofer–Institut für Zuverlaessigkeit und Mikrointegration |
| 2:00 pm |
Facility Tour of PRC and MARC Laboratory
Dean Sutter, Georgia Institute of Technology |
| 3:00 pm |
Ultra Miniaturized Embedded Actives and Passives Research at Georgia Tech
Venky Sundaram, Georgia Institute of Technology |
| 3:30 pm |
3D System integration on Wafer Level - Requirements and Solutions
Jürgen Wolf, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration |
| 4:00 pm |
Future Systems Packaging Beyond Organic Chip Carries and Organic Boards — All Silicone Systems Module (3D ASSM)
Ritwik Chatterjee, Georgia Institute of Technology |
| 4:30 pm |
Adjourn |
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Registration Form
Implementing Advanced Interconnect Technology Solutions
2nd Jisso International Forum
May 21-22, 2008
Hosted by Georgia Institute of Technology — Atlanta, Georgia
(download PDF file of the registration form) |
| Looking for Savings?
- Early Registration - Register by April 30, 2008, and save an additional 10% off the prices shown below.
- Group Discount - Register three individuals from your company at the same time and receive the fourth
registration FREE. * Note: The discount will apply to the lowest cost registration.
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| Registrant's Name |
Job Title/Mail Stop |
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 IPC, JEDEC, iNEMI, JPCA, JEITA, EIPC Member $450
Nonmember $550
(Includes: Admittance to presentations, meeting materials, Wednesday and Thursday luncheons, and Wednesday networking reception.) |
Charge my credit card (check one): Amex Master Card Visa Diners Club
Your credit card will be debited for your registration fee. Member or nonmember price will be assessed based on current membership status. No receipt will be sent unless requested. |
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Payment by Mail, Wire Transfer or Fax:
To register by mail: Send check made payable to IPC to: 3491 Eagle Way, Chicago, IL, USA, 60678-1349. If you would like to send a wire transfer, please contact IPC's registration department at registration@ipc.org for banking information. To register by fax, please fax registration form along with credit card information to +1 847-615-5661.
Cancellation Policy: Cancellations received before May 20, 2008 will be refunded in full. Refunds will not be issued after the start of the program. Individuals failing to cancel will be billed for the registration fee. If you are unable to attend, you may send a coworker in your place. |
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| Please contact us
at registration@ipc.org if you have questions or if you a have disability requiring accommodations. |
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