Lay the groundwork to compete in the growing HDI market
at IPC’s HDI Technology Conference.

HDI technology represents the fastest growing segment of the global PCB market. Yet the use of high density interconnects in North America has lagged behind the rest of the world — putting North American PCB companies at a competitive disadvantage.

IPC’s HDI Technology Conference provides an essential forum for companies interested in exploring the possibilities of HDI technology. This three-day event features an informative technical conference and valuable workshops, all led by industry experts who will address HDI technology as it relates to all aspects of the supply chain — from design to boards and assemblies — with an emphasis on high reliability and endurance.

HDI technology was introduced more than 25 years ago, and its continued growth proves that this popular technology is here for the long haul. Join us for this enlightening conference, and discover what you need to know to implement HDI technology in all of its forms.

Who Should Attend
Product managers and program managers from OEMs, as well as technologists from any organization along the PCB supply chain (suppliers, fabricators, assemblers and OEMs) will benefit from attending this event.

Location and Hotel Accommodation

The technical conference and workshops will be held at the Wyndham DFW Airport North, 4441 W. John Carpenter Freeway, Irving, TX 75063. To reserve your sleeping room, please contact the hotel directly at +1 972-929-8181 and ask for the IPC special rate of $149 per night. Rooms and rate are subject to change after September 15, 2008.

Developed for PCB fabricators as well as designers, this full-day workshop covers key technologies for fabricators who want to get into HDI fabrication, as well as key design recommendations and stackups for designers and hardware engineers who want to know what HDI can do for their next printed circuit board. Fabricators will get insights into how HDI board designers select stackups, design rules and features; designers will learn about issues and cautions that arise when fabricating an HDI-microvia board.

What You Will Learn

Who Should Attend
PCB fabricators, designers and hardware engineers will all benefit from this workshop.

About the Instructors
Michael Carano is with OMG Electronic Chemicals (formerly Electrochemicals), a developer and provider of processes and materials for the electronics industry supply chain including fabrication of printed wiring boards, solar cell production, electronic packaging and lead-free metallization. He has been involved in the printed board industry for over 29 years. Carano’s primary focus is on metallization technologies, electroplating, solderable finishes, HDI, selective metal finishing, semiconductor packaging and imaging processes. He also looks for new ways to increase the competitiveness of the North American printed wiring board industry. He holds a bachelor’s degree in chemistry from Youngstown State University, where he has also completed two years of graduate school in polymer chemistry, and has earned an M.B.A. in international marketing from Baker College.

Happy Holden is a PCB technologist for Mentor Graphics’ System Design Division. Holden has spent 36 years in printed circuit engineering, customer support and product development, with five of those years in Taiwan and Hong Kong. Before retiring from Hewlett-Packard after 26 years, Holden was responsible for the creation and startup of the NanYa PCB Division in 1984. Holden has a B.S. in chemical engineering from Ohio State University and an M.S. in computer science.

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Material selection plays a critical role in the ultimate quality and performance of every PCB. This workshop, designed for both the PCB designer and fabricator, will explore existing and future materials suitable for incorporating into HDI product. These materials include resins, reinforcements and metallic foils that are currently available, as well as promising new materials that are under development. The important characteristics of these materials as they relate to HDI production will be emphasized. In addition, the workshop will cover materials for embedded passives and high frequency operation.

What You Will Learn

Who Should Attend
This workshop is designed for PCB designers, fabricators and others interested in implementing HDI.

About The Instructor
John Andresakis, vice president of strategic technology for Oak-Mitsui Technologies, has more than 28 years of experience in the manufacture of printed circuit boards. Before joining Oak-Mitsui, he was engineering manager for Hadco Corporation (now part of Sanmina-SCI Corporation) at its Owego, N.Y. and Hudson, N.H. facilities. In addition to Hadco, Andresakis was in technical management at Nelco, Digital Equipment and IBM. He holds a master’s degree in chemical engineering from the University of Connecticut and a bachelor of engineering degree from Cooper Union. He has received eight U.S. (and several foreign) patents related to PCB production. Andresakis is a member of the IPC Suppliers Technology Council and the various IPC committees developing specifications for embedded passives.

HDI is rapidly becoming the most widely used emerging technology for high-performance electronics, fine-pitch and high I/O BGAs. These are particular applicable to FPGA, LGAs and large CCGA. But “Getting Started” can be formidable! This workshop walks you through a successful program used by a number of large aero/military and telecom OEMs to successfully implement HDI technologies in their printed circuit board programs. The session is divided into four phases that follow the implementation program: 1) education, planning and vendor audits; 2) test-vehicle creation and testing; 3) redesigning a current board to HDI and 4) putting it all together.

What You Will Learn

About the Instructors
Happy Holden is a PCB technologist for Mentor Graphics’ System Design Division. Holden has spent 36 years in printed circuit engineering, customer support and product development, with five of those years in Taiwan and Hong Kong. Before retiring from Hewlett-Packard after 26 years, Holden was responsible for the creation and startup of the NanYa PCB Division in 1984. Holden has a B.S. in chemical engineering from Ohio State University and an M.S. in computer science.

Andrew Palczewski has over 17 years of printed circuit board design experience in telecommunications and industrial products. He has a strong background in advanced technology and manufacturability. Palczewski has worked for Corning Inc., International Game Technology and a multitude of other progressive companies. In his current role at Harris RF Communications, he is a PCB technologist involved in strategic planning and development for high reliability printed circuit boards.