Fundamentals of Printed Circuit Board Fabrication
Tuesday, July 15, 2008 - 8:30 am-5:00 pm
Maple Plain, Minni.

Advanced PWB Troubleshooting: Identification, Analysis and Prevention of Critical PWB Defects
Wednesday, July 16, 2008 - 8:30 am-12:00 pm
Maple Plain, Minni.

Via Hole Filling Technology and Processes: An Overview

Wednesday, July 16, 2008 - 1:30 pm-5:00 pm

Maple Plain, Minni.

Hosted by OMG Electronic Chemicals, Inc.

Fundamentals of Printed Circuit Board Fabrication

Tuesday, July 15 - 8:30 am-5:00 pm

Maple Plain, Minni.

About the course:

Will your job will benefit if you have a clear and solid understanding of PCB technology? Are you ready to advance your career by expanding your capabilities and background? This course will help you build that foundation.

Classic printed circuit board, high density interconnect (HDI/microvia), and hybrid multilayer, flex and rigid flex printed circuit board technology will be explored.

What you will learn:

• PCB history
• Process types
• Common construction issues
• Front-end engineering
• MLB fabrication
• Materials: conventional, advanced high performance, and hybrid

Advanced PCB technologies and exotic interconnection structures, including HDI/microvia, hybrid constructions and materials and flex and rigid flex, will also be discussed.

This training program was created to start building a foundation of knowledge and understanding for the PCB user community including engineering, design, project management, materials, manufacturing, quality and procurement. It bridges the user’s gap to PCB manufacturing, enabling the users to perform their jobs more effectively and benefit their organizations with quality improvements, cost savings and cycle time reductions.

Your Instructor:
Richard Snogren is the founder of Bristlecone LLC, a technology consulting service providing technology support and training to the printed circuit board industry. Prior to Bristlecone, Snogren was an aerospace materials engineer, managing the electronic packaging and PCV design groups for Martin Marietta Astronautics; he spent 25 years in the aerospace sector of the PCB industry. Snogren was cofounder of SAS Circuits, now Coretec Denver, and was a member of the technical staff at Coretec Inc. Snogren was an active member of the AEPT (advanced embedded passive technology Research Consortia), an interdisciplinary research project funded by NIST.

Advanced PWB Troubleshooting: Identification, Analysis and Prevention of Critical PWB Defects

Wednesday, July 16 - 8:30 am-12:00 pm

Maple Plain, Minni.

About the course:

This intense workshop will provide tools for advanced problem solving for printed circuit boards manufacturing. Defects such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away carry significant costs. Root cause of yield-reducing defects may not be readily apparent and multiple factors may contribute to them. This course will explore the most intricate of these factors and how they originate several process steps back, contributing to scrap product. Participants will learn how to recognize problems and take corrective action before it is too late. Solderability and assembly related issues such as outgassing and blow holes will also be reviewed. Participants should have some knowledge of the PCB fabrication process.

The course will conclude with a discussion on imaging, including liquid-photoimageable solder masks. Strategies to solve solder mask peeling, poor circuit trace coverage, skips, bubbles, and poor adhesion in nickel gold plating will be discussed in detail. Solder mask equipment and its effect on soldermask quality will also be explored.

What you will learn:

• Lamination and other multiple layer related defects
• Electrodeposition defects: mouse bites, pitting, nodules, crown or dome plating, dog bone defects
• Copper plating reliability: how to improve plating distribution and throwing power
• Metallization
• High performance resins, wedge voids
• Solderability and assembly issues
• Black pad phenomenon: new details on cause and elimination
• Issues affecting solder hole fill and solder paste spreadability
• Effect of reflow profile and flux on solderability
• Imaging: defects, surface preparation, process control

Your Instructor:

Michael Carano is with OMG Electronic Chemicals (formerly Electrochemicals), a developer and provider of processes and materials for the electronics industry supply chain including fabrication of printed wiring boards, solar cell production, electronic packaging and lead-free metallization. He has been involved in the printed board industry for over 29 years. Carano primary focus is on metallization technologies, electroplating, solderable finishes, HDI, selective metal finishing, semiconductor packaging and imaging processes. He also looks for new ways to increase the competitiveness of the North American printed wiring board industry. Mike is also involved in strategic planning and technology roadmap formulation and implementation. Carano has published over 65 technical articles and has presented numerous other papers throughout the world. He is the holder of nine U.S. patents and over 20 foreign patents covering a variety of topics including plating, metallization processes and pwb fabrication techniques. He is the past chairman of the IPC Suppliers Management Council and is serving his second term on on the IPC Board of Directors and is serving second term.

He holds a Bachelor’s degree in Chemistry from Youngstown State University where he has also completed two years of graduate school in polymer chemistry and has earned an MBA in International Marketing from Baker College.

Via Hole Filling Technology and Processes: An Overview

Wednesday, July 16 - 1:30 pm-5:00 pm

Maple Plain, Minni.

About the course:

The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and processes that will enable the move towards sequential lamination, blind and buried vias, and via-in-pad technology.

Circuit board fabricators need to adopt techniques such as via filling capability for both blind and buried vias. The problem, of course, is that with many new technologies, fabricators and end-users are faced with a myriad of process technologies that they must choose from. This IPC workshops describes the technological drivers behind the need for via filling in a highly effective and reliable fashion for high density, high aspect ratio printed wiring boards. Close attention is paid to the use of these via filling materials for highly complex circuit designs.

What you will learn:

• Introduction to via filling
• What is via filling
• Technology drivers for via filling
• Different types of via structures
• Overview of via filling processes
• Filling via polymer materials
• Filling via plating
• Via fill by electroplating
• Theoretical considerations
• Plating additive design
• Plating process parameters
• Plating cell design
• Reliability
• Why use polymer based materials
• Conductive versus non-conductive via fills
• Material considerations
• Electrical/physical properties
• Methods of via filling
• Hand screening
• Roller coating
• Vacuum plugging equipment
• Over metallization considerations

Your Instructor:

Michael Carano is with OMG Electronic Chemicals (formerly Electrochemicals), a developer and provider of processes and materials for the electronics industry supply chain including fabrication of printed wiring boards, solar cell production, electronic packaging and lead-free metallization. He has been involved in the printed board industry for over 29 years. Carano primary focus is on metallization technologies, electroplating, solderable finishes, HDI, selective metal finishing, semiconductor packaging and imaging processes. He also looks for new ways to increase the competitiveness of the North American printed wiring board industry. Mike is also involved in strategic planning and technology roadmap formulation and implementation. Carano has published over 65 technical articles and has presented numerous other papers throughout the world. He is the holder of nine U.S. patents and over 20 foreign patents covering a variety of topics including plating, metallization processes and pwb fabrication techniques. He is the past chairman of the IPC Suppliers Management Council and is serving his second term on on the IPC Board of Directors and is serving second term.

He holds a Bachelor’s degree in Chemistry from Youngstown State University where he has also completed two years of graduate school in polymer chemistry and has earned an MBA in International Marketing from Baker College.

About OMG Electronic Chemicals, Inc.:

OMG Electronic Chemicals is a developer, manufacturer and supplier of specialty chemicals used in the manufacturing of printed circuit boards, memory disk, semiconductor packages as well as functional and decorative coatings for the general metal finishing, connectors and aerospace industries. With manufacturing and technical centers located in key geographic regions, OMG Electronic Chemicals serves its customers in a wide variety of surface finishing applications. The seminar site is located at 5630 Pioneer Creek Drive, Maple Plain, Minnesota 55359. OMG Electronic Chemicals is part of the OM Group (NYSE:OMG), headquartered in Cleveland, Ohio.

Hotel Information:

The workshops will be held on-site at OMG Electronic Chemicals, Inc., 5630 Pioneer Creek Drive, Maple Plain, Minnesota 55359. For out-of-town guests, we recommend the following hotels:

AmericInn® of Long Lake, MN
521 North Willow Drive, Long Lake, MN 55356
Toll Free Reservations: 888-205-3488
Front Desk: 952-475-4422

(OMG has a preferred rate at this hotel)

Sheraton Minneapolis West (Ridgedale)
12201 Ridgedale Dr.
Minnetonka, MN 55305
United States
Phone: 952-593-0000

Registration Information
The registration fee for each half day workshop is $225 for IPC members or $325 for nonmembers. For the full-day workshop on Tuesday, the member fee is $450 and nonmember fee is $550 To register for these workshops, complete the registration form and fax it in. For more information please contact Michelle Michelotti at

+1 847-597-2822 or via email at MichelleMichelotti@ipc.org.

Cancellation Policy: Cancellations must be made one business day prior to the workshop in order to be eligible for a full refund. If the workshop is cancelled, participants will receive a full refund. If you are unable to attend, you may send a co-worker in your place.

Registration Form Early Registration - Register by June 27, 2008, and save an additional 10% off the prices shown below. Group Discount - Register three individuals from your company at the same time and receive the fourth registration FREE. Fundamentals of Printed Circuit Board Fabrication Tuesday, July 15, 2008 - 8:30 am-5:00 pm Maple Plain, Minni. Advanced PWB Troubleshooting: Identification, Analysis and Prevention of Critical PWB Defects Wednesday, July 16, 2008 - 8:30 am-12:00 pm Maple Plain, Minni. Via Hole Filling Technology and Processes: An Overview Wednesday, July 16, 2008 - 1:30 pm-5:00 pm Maple Plain, Minni. Hosted by OMG Electronic Chemicals, Inc. (download the registration form as a pdf here) Name Title/Mail Stop Company Mailing Address City/State/ZipCode Area Code/Phone Ext. Fax E-Mail   IPC/member Nonmember Fundamentals of Printed Circuit Board Fabrication 07/15/2008 8:30 am - 5:00 pm $450 (U.S.) $550 (U.S.) Advanced PWB Troubleshooting: Identification, Analysis and Prevention of Critical PWB Defects  07/16/2008 8:30 am - 12:00 pm $225 (U.S.) $325 (U.S.) Via Hole Filling Technology and Processes: An Overview 07/16/2008 1:30 pm - 5:00 pm $225 (U.S.) $325 (U.S.) Register me for both days (all THREE workshops): $750 (U.S.) $1075 (U.S.) SUBTOTAL: $______________ 10% Early Registration (Must be received by June 27, 2008) $_________ GRAND TOTAL: $______________ Method of Payment: Check enclosed in the amount of $________________payable to IPC P.O. #____________(for IPC members Only) $__________________ Bill my credit card (check one)  MasterCard  Visa   AMEX   Diners Club Card Number Expiration Date Billing Address Cardholder Signature

Cancellation Policy: Cancellations must be made one business day prior to the workshop in order to be eligible for a full refund. Refunds will not be issued after the start of a program. Individuals failing to cancel will be billed for the registration fee.