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ADVANCE YOUR TECHNICAL SKILLS
Design and Build a PCB with Embedded Passive Components and HDI/Microvia
An Interactive Workshop Hosted by NSWC - Crane
June 3-4, 2008 - Crane, IN

Take a giant leap forward in advancing your technical skills. Join others in this unique opportunity to learn the benefits of HDI/microvia and embedded passive components.

Learn how and why embedded passives technology, in combination with HDI/microvia technology, will improve signal integrity of circuits and lower common mode noise that often leads to EMI. You will also learn how these technologies improve performance of even the most sensitive analog circuit and why gains in digital performance are always realized when either embedded or HDI/microvia technology are employed. Experience designing and fabricating a PCB with HDI/microvia and embedded passives. Participants will work at a CAD workstation, design a PCB with HDI/microvia and embedded passive components, and then build the PCB in NSWC Crane’s state-of-the-art PCB manufacturing facility.

The course begins with discussions on the state-of-the-art of embedded passive technology and HDI/microvia technology: definitions and applications, drivers and barriers, how they fit into the classic printed circuit board matrix, and what composite structures can be made to reduce layer count,and improve routing and electrical performance. Information on current commercially available materials for embedded resistors, capacitors and HDI/microvia structures will be provided.

The course includes instructions on how to use virtually any PCB CAD system for embedded passive and HDI/microvia design. Following this, Mentor Graphics will provide workstations and instructions for the participants to go through the design processes for a hands-on experience incorporating embedded passives and HDI/microvia using an automated tool set.

"Considering technological advances in all types of electronics and higher circuit density needs, embedded passives and HDI are going to be a key element to utilize PWB surface area effectively. This workshop will guide you to develop and utilize embedded passives in an effective and efficient manner." - Mahendra Gandhi, Northrop Grumman Space Technology

Workshop Agenda

Discussion Leaders:
Jason Ferguson, NSWC-Crane
Richard Snogren, Bristlecone LLC
Rick Hartley, L3 Electronic Systems
Happy Holden, Mentor Graphics

Tuesday, June 3, 2008
8:00 am - 8:30 am Coffee and Introductions  
8:30 am - 9:00 am Introduction to NSWC Crane Jason Ferguson
9:00 am - 10:15 am

Embedded Passives Today

  • What are they? Drivers and Barriers
  • EPs in the classic PCB matrix
  • Materials Sets Available Now
  • Design for Manufacture
Richard Snogren
10:15 am - 10:30 am BREAK  
10:30 am - 11:30 am

HDI Today

  • HDI Principles
  • Materials and Manufacturing Processes
  • PCB Structures
  • Channel Routing and Other Design Techniques
Happy Holden
11:30 am - 12:15 pm Signal integrity of embedded passives and HDI Rick Hartley
12:15 pm - 1:00 pm LUNCH  
1:00 pm - 1:45 pm Manual Design Process Trick the System Rick Hartley
1:45 pm - 3:450 pm Automated Design Process Hands-on-Design Happy Holden
3:45 pm - 4:00 pm BREAK  
4:00 pm - 5:30 pm Hands-on-fabrication Jason Ferguson

Wednesday, June 4, 2008

7:00 am - 12:00 pm Hands-on-fabrication Jason Ferguson
12:00 pm - 1:00 pm LUNCH  
1:15 pm - 2:30 pm Embedded Passives Case Studies Industry Experts (TBD)
2:30 pm - 2:45 pm BREAK  
2:45 pm - 4:45 pm Problem Solving Exercise Richard Snogren
4:45 pm - 5:00 pm Questions & Answers/Adjournment  

Kurt Peister, Lockheed Denver, attended the October 2006 workshop and said,"It was invaluable to physically experience fabricating an embedded passives printed board from the ground up. Being taught verbally is good, putting that instruction to use really helped to understand the concepts."

What You Will Learn

• The state-of-the art of embedded passives and HDI/microvia technologies
• How to use both capacitor and resistor materials in combination with HDI structures
• How to manufacture a finished PCB and take home the board and parts you actually built
• Case studies presented by industry specialists
• How to solve your design density problems

Who Will Benefit

This course is intended for designers, material and process engineers, manufacturing engineers or project managers.  Anyone needing to refine their knowledge and skills in preparation for adopting embedded passive technology into their PCB process will find this course very beneficial.

Registration Information

The registration fee for this two-day workshop is $595 for Designer Council/IPC members or $795 for nonmembers. Class size is limited to 12 attendees, so please register as soon as possible. To register for this workshop, complete the registration form and fax or mail as indicated. For more information, or if the registration deadline has passed, contact the IPC registration department at +1 847-597-2861.

Cancellation Policy: Cancellations must be made one business day prior to the workshop in order to be eligible for a full refund. Individuals failing to cancel will be billed for the registration fee. If the workshop is cancelled, participants will receive a full refund. If you are unable to attend, you may send a co-worker in your place.

Location, Times and Hotel Accommodations

The workshop will be held at NSWC-CRANE, 300 Highway 361, Building 3287 E., Crane IN 47522-5001. The course will begin at 8:30 am (with on-site registration and sign-in beginning at 8:00 am on the first day) and conclude by 5:00 pm on both days.

Please be advised the course may end later than 5 pm on the second day of the workshop. Due to the distance to the Indianapolis airport, we recommend scheduling a flight out of Indy on the following morning. For out-of-town guests, IPC recommends the following hotels:

Fairfield Inn
120 S. Fairfield Dr.
Bloomington, IN 47404
($84 per night)
+1 812-331-1122
Please contact the hotel directly to make a sleeping room reservation. When calling the hotel, mention NSWC-Crane to get the corporate rate of $84 per night.

Combined Bachelors Officers Quarters (BOQ)
B
uliding 3319
300 Highway 361
Crane, IN 47522-5001
($25 per night)
(812) 854-1176
Please contact the hotel directly to make a sleeping room reservation.  For directions, please click here to view the file.

Since Crane is a military facility, certain security procedures must be followed.  Please remember to bring a government-issued ID with you.  All attendees will be issued gate passes by Crane. Crane also needs advance notice of non-U.S. citizens who will be entering the facility.  If you are a foreign national, please contact our registration department at +1 847-597-2861 or e-mail registration@ipc.org.  Note: Your citizenship status will not prevent you from attending.

About the Instructors

Richard Snogren is the founder of Bristlecone LLC, a technology consulting service. He provides technology support and training to the printed circuit board industry. Snogren was an aerospace materials engineer, managed the electronic packaging and PCB design groups for Martin Marietta Astronautics and spent 25 years in the aerospace sector of the PCB industry. He was co-founder of SAS Circuits, now Coretec Denver. Snogren was a member of the technical staff at Coretec Inc. and was an active member of the recent AEPT (Advanced Embedded Passive Technology Research Consortia), an interdisciplinary research project funded by NIST. He has taught many seminars and authored numerous papers and articles on embedded passives. Snogren has a B.S. in Chemistry and Biology from Western Michigan University.

Jason Ferguson is the Manager of NAVSEA Cranes Embedded Passives Test Bed Project. He has a B.S. in Electrical Engineering. After serving four years as a commissioned officer in the U.S. army, Mr. Ferguson joined NAVSEA Crane where he served as a systems engineer. He subsequently joined Crane’s circuit board fabrication shop and now leads efforts of the ECIT (Emerging/Critical Interconnect Technologies) Embedded Passives Materials Test Bed Project.

Happy Holden is a senior technologist for Mentor Graphics. Since his retirement from Hewlett-Packard in 1996, Holden was with Asian Pacific Materials, Westwood Associates, TechLead Corp., and Merix Inc. in various technology leadership positions. He has been a leader in advancing PCB technology and has conducted numerous advanced technology workshops. Happy holds a BS in Chemical Engineering and an MS in Computer Science both from Oregon State University.

Registration Form

ADVANCE YOUR TECHNICAL SKILLS
Design and Build a PCB with Embedded Passives Components and HDI/Microvia:
An Interactive Workshop
Hosted by NSWC-CRANE

June 3-4, 2008 — Crane, IN

(download the registration form as a pdf here)

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Membership status will be verified upon receipt of registration form. Receipts will be sent only upon request.
• Please circle here if you have a disability requiring accommodations.

Cancellation Policy: Cancellations must be made one business day prior to the workshop in order to be eligible for a full refund. Refunds will not be issued after the start of a program. Individuals failing to cancel will be billed for the registration fee. If the workshop is cancelled, participants will receive a full refund. If you are unable to attend,you may send a co-worker in your place.

ipc

Return this form by fax to: +1 847-615-5661,
or mail to: IPC, 3491 Eagle Way, Chicago, IL 60678-1349