Design for Manufacture
Hosted by Endicott Interconnect Technologies, Inc.
May 15-16, 2008, Endicott, N.Y.
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Designing printed boards is more difficult today than ever before. Printed board designers are faced with continuing design issues of surface mount vs. through hole technology, what materials to use, board size and layer count, how to incorporate electrical testing, what new specifications are being used in the design process and many others. The IPC Design for Manufacture (DfM) workshop will acquaint designers with increasingly sophisticated PCB fabrication technologies. The course will address trade-offs for designs that have both through hole and surface mount components; the differences between rigid and flexible printed boards; and the tolerance characteristics that make sense using the capabilities of today’s manufacturing equipment.
Hosted by Endicott Interconnect Technologies, this intensive workshop will be held on Thursday and Friday, May 15-16, 2008, at the company's facility in Endicott, N.Y. IPC is grateful to Endicott Interconnect Technologies for allowing IPC to present this workshop on-site. Attendees will have a unique opportunity to obtain first-hand information on design issues that affect manufacturing, from information provided during the workshop and the panel discussion at the conclusion of the workshop.
About Endicott Interconnect Technologies, Inc. :
Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions and electro/mechanical equipment. With more than 40 years of experience in providing microelectronics solutions, we bring to market a unique mix of leading edge technology and technical know-how to provide customers with a time-to-market advantage.
Effective vertical integration differentiates EI from any supplier in the electronic packaging industry. We are expert in the fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging and precision equipment manufacturing and integration. EI also provides the unique services that complement these offerings; design and layout, thermal, electrical and mechanical modeling, reliability and environmental testing and physical analysis. EI solutions deliver leading edge technology and best-in-class quality, performance and reliability and are available at any stage of the product life cycle. While uncommon, this offers its clients perfect and seamless extendibility from prototype, preproduction and production phases without the headache of shifting facilities, processes and support personnel.
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| Topics to be covered on Thursday, May 15, 2008: |
Registration and presession coffee at 8:00 am
- Welcome and opening remarks by Endicott personnel
- Introduction to IPC and workshop
- Design parameters (rigid, flex & tolerances)
- Material selection (laminate & platings)
- Small hole technology (through hole, blind, buried and microvias)
- Imaging, conductor definition, and lamination
- Solder mask and legend (plugged vias and surface finishes)
- Final fabrication and quality control (defect verification)
Tour of Endicott Facility Provided by Endicott Personnel at 4:30 pm
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| Topics to be covered on Friday, May 16, 2008: |
Presession coffee at 8:00 am
- Recap of previous day's events
- Panel Discussion (board fabrication processes) by Endicott personnel
- Component requirements (new plating and size restrictions)
- Board design for assembly (components clearances and test nodes)
- Assembly material properties (new material impact on design)
- Land pattern design (mathematical models and library tools)
- Assembly considerations (new process restrictions on materials)
- Electrical testing (techniques and data transfer methods)
- Future characteristics (changes contemplated for IC packaging)
Recap/Questions & Answers at 4:00 pm
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About the Instructor
The workshop leader will be Dieter Bergman, Director of Technology Transfer at IPC. Dieter has instructed PCB designers for more than two decades, and was instrumental in the development of the IPC-2221, as well as many other design-related IPC standards.
Location, Times and Hotel Accommodations:
The workshop will be held at Endicott Interconnect Technologies , 1093 Clark Street (13760), Endicott, N.Y. 13761-0149 . For out-of-town guests, you may contact the hotels listed below. The course will begin at 8:30 am with on-site registration and sign-in beginning at 8:00 am, on Thursday, May 15, and conclude before 5:00 pm on both days.
Hampton Inn & Suites
3708 Vestal Parkway East
Vestal, NY 13850
(607) 797-5000
Holiday Inn University
4105 Vestal Parkway East
Vestal, NY 13850-3551
(607) 729-6371
(800) 465-4329
Howard Johnson
3601 Vestal Parkway East
Vestal, NY 13850-2232
(607) 729-6181
(800) 446-4656
Registration Information
The registration fee for this workshop is $595 for IPC members or $795 for nonmembers. To register for the DfM workshop, complete the registration form and fax or mail as indicated. For more information, or if the registration deadline has passed, contact the IPC registration department at +1 847-597-2861.
Cancellation Policy: Cancellations must be made one business day prior to the workshop in order to be eligible for a full refund. If the workshop is cancelled, participants will receive a full refund. If you are unable to attend, you may send a co-worker in your place. IPC reserves the right to cancel the workshop as late as two weeks before the event due to low registration and is not liable for any costs the registrants incur because of any cancellation.
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Registration
Form
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Design for Manufacture
Hosted by Endicott Interconnect Technologies, Inc.
May 15-16, 2008 - Endicott, N.Y.
(download the registration form as a pdf here) |
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IPC/DC member |
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DfM Workshop - Hosted by Endicott Technologies, Inc. 05/15-16/2008
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$595 (U.S.) |
$795 (U.S.) |
Method of Payment:
Check enclosed in the amount of $________________payable to IPC
P.O. #____________(for IPC members Only) $__________________
Bill my credit card (check one) MasterCard Visa American Express Diners Club |
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* Membership status will be verified upon receipt of registration form. Receipts will be sent only upon request.
• Please call if you have a disability requiring accommodations.
Cancellation Policy: Cancellations must be made one business day prior to the workshop in order to be eligible for a full refund. If the workshop is cancelled, participants will receive a full refund. If you are unable to attend, you may send a co-worker in your place. IPC reserves the right to cancel the workshop as late as two weeks before the event due to low registration and is not liable for any costs the registrants incur because of any cancellation. |
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Return
this form by fax to: +1 847-615-5661,
or mail to: IPC, 3491 Eagle Way
Chicago, IL 60678-1349
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