Before and After Cleaning (images submitted by Kyzen Corporation)

Schedule of Events

October 28, 2008

continental Breakfast

7:30AM–8:00AM

welcome

8:00AM
Mike Bixenman, Ph.D., Kyzen Corporation, Conference Chair

keynote presentation

8:00AM–8:45AM
The Evolution of Manufacturing Residues and Their Effects on Electronics Assembly
Jim Raby, STI Electronics

break

8:45AM–9:00AM

session 1

Introduction, Standards and Regulations
9:00AM–11:00AM
Chair: Dale Lee, Plexus Corporation
IPC Cleaning and Coating Update —
Doug Pauls, Rockwell Collins, Inc.

• IPC Cleaning Handbooks (IPC-CH-65A; IPC-SC-60A;
  IPC-SA-61A; & IPC-AC-62A) Task Group —
  Bill Kenyon, Ph.D., Global Centre Consulting
• REACH, WEEE, & RoHS —
  Ron Lasky, Ph.D., Indium Corporation
• VOC Waste and Water Municipalities —
  Lee Wilmot, TTM Technologies, Inc.

panel discussion 1

Electronic Cleaning Fluid Designs
11:00AM – 12:00PM
Moderator: Bill Kenyon, Ph.D., Global Centre Consulting
Panelists: Tom Tattersall, MicroCare Corporation; Karl Manske, 3M Company; Harald Wack, Ph.D., ZESTRON America; Ken Dishart, Ph.D.; Mike Bixenmann, Kyzen Corporation; Jay Soma, Ph.D., Petroferm, Karl Manske, 3M

lunch

12:00PM–1:00PM

session 2

Cleanliness Assessment
1:00PM–3:00PM
Chair: Laura Turbini, Ph.D., Research In Motion

• Test Board Selection for Cleaning Evaluations —
  Doug Pauls, Rockwell Collins
• Utilizing and Understanding the Various Methodologies for
  Evaluating Cleanliness of Printed Wiring Assemblies —
  Joe Russeau, Precision Analytical Laboratory, Inc.
• Spot Cleaning Assessment Under Components Following
  Inline Aqueous Cleaning —
  Steven Perng, Cisco Systems
• IPC Technology Roadmap Future of Interconnection
  Technology and Its Impact on Cleaning for Reliability —
  Jack Fisher, Interconnect Technology Analysis, Inc.

break

3:00PM–3:30PM

session 3

Building to Customer Reliability Standards in Class 2 and Class 3
3:30PM–5:30PM
Chair: Joe Russeau, Precision Analytical Laboratory, Inc.

• Component Cleanliness —

          Bev Christian, Ph.D., Research In Motion

• Reduced Cleaning of Printed Wiring Assemblies: The Science of Leaving Flux Residues Alone —
  Dave Hillman, Rockwell Collins
• Simplifying Building Complex No Clean Assemblies Using Solid Solder Deposits —
  Matt Kehoe, Sipad Systems, Inc.
• Cleaning Process Development in a High-Mix,
  Medium-Volume, Class 3 Electronics Manufacturing System —
  Doug Schueller, AbleConn, LLC

October 29, 2008

continental breakfast

7:30AM–8:00AM

keynote presentation

8:00AM–8:45AM
Nozzle Design and Implementation for Cleaning Residues from High Density, Low Profile Component Assemblies
Linda Woody, Lockheed Martin

panel discussion 2

Cleaning Machines
8:45AM–9:45AM
Moderator: Dave Torp, IPC
Panelists: Steve Stach, Austin American Technology;
Jim Timler, Stoelting, LLC; Mike Konrad, Aqueous Technologies; John Neiderman, Speedline Technologies ; Roger Travato, Technical Devices Company; Eric Larson, Crest Ultrasonic

break

9:45AM–10:00AM

session 4

Lead-Free Cleaning
10:00AM–12:00PM
Chair: Dave Adams, Rockwell Collins

• Cleaning Technique Testing as Part of Manual
  Soldering Rework/Repair Process Development —
  Lee H. Flasche, Delphi Electronics Group
• Lead-Free Flux Technology and the Influence on Cleaning —
  Ning-Cheng Lee, Ph.D., Indium Corporation
• Qualifying Lead-Free Medical Electronics —
  Steve Hugh, Philips Medical
• Using Hansen Solubility Parameters to Match the Cleaning Material to the Lead-Free Flux Residue —
  Ken Dishart, Ph.D.

lunch

12:00PM–1:00PM

panel Discussion 3

Cleaning Process Integration
1:00PM–2:00PM
Moderator: Steve Stach, Austin American Technology
Panelists: Dave Adams, Rockwell Collins; Jerry Purnell, Philips Medical; Jeff Kennedy, Celestica Inc.; Jim Raby, STI Electronics; Dale Lee, Plexus Corporation; and Linda Woody, Lockheed Martin

break

2:00PM–2:30PM

session 5

Conformal Coating
2:30PM–4:30PM
Chair: Harald Wack, ZESTRON America

• Critical Considerations for Selecting a Conformal Coating Process —
  Jason Keeping, Celestica Inc.
• Cleaning for Conformal Coating —
  Barry Richie, Dow Corning Corporation
• The Impact of Process Residues on Conformal Coating
  Performance —
  Phil Kinner, Humiseal
• Cleaning Effects on Conformal Coating Adhesion —
  Lamar Young, Specialty Coating Systems

Hotel Information:

Crowne Plaza Chicago O’Hare
5440 North River Road
Rosemont, IL 60018
888-233-9527
Room Rate: $159/night

A room block has been reserved at the event hotel for conference attendees. Please reference IPC/SMTA when making your reservation to ensure receipt of the discounted rate. The room block rate will expire on September 27, 2008.

Sponsorship Opportunities:

Suppliers, manufacturers, and users will be in attendance at this conference. Your company can showcase its services and products as a tabletop exhibitor, or take advantage of one of the many sponsorship opportunities available for this conference. Download the application form at www.ipc.org/CleaningConfSponsorshipApp.

Luncheon Sponsored by: Zestron America

Tabletop Exhibit Space:

We expect a strong turn-out for the tabletop display area during the conference breaks and lunches on October 28-29, 2008. Don’t miss out
on this opportunity to reach your audience. Download the application form at www.ipc.org/CleaningConfTabletopApp.

Contact Michelle Michelotti at 847-597-2822 or via e-mail at MichelleMichelotti@ipc.org for more information or download the sponsorship and tabletop exhibit applications from the links listed above.

Tabletop Exhibitors:

3M Electronics

Zestron America

Seika Machinery, Inc.

Kyzen Corporation

InsulFAB PCB Tooling
Austin American Technology, Corp.
BFK Solutions, LLC

Petroferm, Inc.

Aqueous Technologies Corporation