.jpg)
IPC Advanced Packaging Webcast Series
Grow your knowledge with IPC’s new webcast series on Advanced Packaging! The IPC Webcast Series “Advanced Packaging” is a convenient, affordable way to gain a solid overview of essential topics. Each webcast is a targeted, one-hour session you can “attend” right from your office — which means there are no travel expenses, and no unnecessary downtime. Plus, each session features a presentation by a respected industry expert, followed by a question-and-answer period. When you register, we will send you a site license for the program. How you use it is up to you! Participate on your own from your office or from home — or reserve a conference room and invite colleagues to join you at no additional cost. Each webcast is just $125 for IPC members. Or, purchase all the package for $225. Register now and take advantage of these informative webcasts! |
Selecting Components for Lead-Free SMT Assembly August 14 , 2008 - 10:00 am - 11:00 am |
Is your company able to accommodate lead-free soldering … and effectively work with lead-free compatible components? With the European Union’s Restriction of Hazardous Substances (RoHS) directive firmly in place, you need to be able to answer “yes.” Even if legislation doesn't’t require you to comply, sweeping change throughout the global marketplace does. Now that component manufacturers worldwide have abandoned lead-containing alloy terminal plating, every assembly company needs to modify its process to accommodate lead-free components. About the webcast: Topics to be covered include:
Be sure to join us for this must-attend session, and gain valuable insights that will help you keep your assembly operation compliant and competitive in the face of RoHS and the shift to lead free. About the webcast Instructor: Vern Solberg is a consultant specializing in surface mount and microelectronic design and assembly. He holds several patents for IC packaging innovations (including the folded-flex 3-D package). He has more than 25 years of experience in design and manufacturing for commercial and aerospace electronic products and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology, published by McGraw-Hill. He is the chairman of a task group for IPC-7094, Design and Assembly Process Implementation for Flip Chip and Chip Size Packaging. |
Assembly Process Guidelines for Wafer Level CSP |
Today’s consumers expect each new generation of personal entertainment and portable handset products to be smaller, thinner, lighter in weight … and loaded with even greater functionality. How can electronics manufacturers offer a product that meets all those functional and performance expectations without increasing product cost? Many companies are turning to IC packages that are no greater than the die element. A wide range of choices exist today for assembly of ultra-fine-pitch wafer level and die-size surface mount devices. Although solder remains the most common method for device attachment, a number of alternative methods — such as the use of conductive polymers and ultrasonic gold-to-gold interface — have been developed to reliably secure the miniature die-sized elements to the circuit structure. About the webcast: Topics to be covered include:
The push for higher density IC packaging will expand with every new generation of consumer electronics. Don’t miss this opportunity to delve into the growing trend toward smaller packages! About the webcast Instructor: Vern Solberg is a consultant specializing in surface mount and microelectronic design and assembly. He holds several patents for IC packaging innovations (including the folded-flex 3-D package). He has more than 25 years of experience in design and manufacturing for commercial and aerospace electronic products and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology, published by McGraw-Hill. He is the chairman of a task group for IPC-7094, Design and Assembly Process Implementation for Flip Chip and Chip Size Packaging. |
| Registration Information: |
Each webcast will begin at 10:00 am (U.S. Central Daylight Savings Time) and conclude at 11:00 am (U.S. Central Daylight Savings Time). Just complete the linked registration form below and return it to IPC's registration department via fax to +1 847-615-5661. If you have any questions regarding the webcasts, please contact Michelle Michelotti at +1 847-597-2822 or via email at MichelleMichelotti@ipc.org. Time Zones: Webcast registrants will receive a link to download the materials along with the call-in telephone number 24 hours prior to the start of each webcast. Please feel free to make copies for all participants attending at your location. Set up a conference room and attend with colleagues, or log in from the convenience of your home. Audio will be provided via a conference call phone number and participants will need Internet access. Remember to check local times to make sure you don't miss a minute. |
IPC Advanced Packaging Webcast Series
Selecting Components for Lead-Free SMT Assembly August 14, 2008 |
Assembly Process Guidelines for Wafer Level CSP August 21, 2008 |
Looking for Savings?
- Early Registration - Register by August 4, 2008 and save an additional 10% off the prices shown below.
Download Registration Form here
| Registration Form | IPC/DC Member |
Nonmember |
||
| Webcast Package: (The package includes 08/14 & 08/21 webcasts) |
$225 (U.S.) |
$250 (U.S.) |
||
Individual Webcast(s):
|
$125 (U.S.) each webcast |
$150 (U.S.) each webcast |
08/14/2008 Selecting Components for Lead-Free SMT Assembly | REGISTRANT’S NAME: | ||||
| JOB TITLE/MAILSTOP: | ||||
| COMPANY: | ||||
| MAILING ADDRESS: | ||||
| CITY/STATE/ZIP(POSTAL)CODE: | ||||
| (AREA CODE) PHONE: | ||||
| EXT: | ||||
| (AREA CODE) FAX: | ||||
| E-MAIL ADDRESS: |
Payment by Mail or Fax: To register by mail: Send check made payable to IPC, 3491 Eagle Way, Chicago, IL, USA 60678-1349. To register by fax, please fax registration form to +1 847-615-5661, along with your credit card information. Cancellation Policy: No refunds will be issued after the login and password have been e-mailed. If you have any questions, please contact IPC’s registration department at registration@ipc.org or call +1 847-597-2861. Charge my credit card (check one): Total to be charged $_____________ Membership status will be verified upon receipt of registration form. Receipts will be sent only upon request. Cancellation Policy: No refunds will be issued after the login and password have been e-mailed. If you have any questions, please contact IPC’s registration department at registration@ipc.org or call +1 847-597-2861. |
|
| Cardholder Name: | |
| Card Number: | Expiration: |
| Signature: | |
Billing Address: |
|
