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IPC Logo
CPCA
HKPCA
INNOVATION: DRIVING THE FUTURE OF THE
ELECTRONIC INTERCONNECT INDUSTRY

19—20 September, 2007
Hosted by IPC, CPCA, HKPCA
Official Sponsor
DuPont

Conference Overview

IPC, the CPCA, and the HKPCA have joined together to present this Executive Market and Technology Forum Conference. This conference covers a broad range of market technology and management topics relating to innovation, specifically for decision makers in the electronics industry. This is an unprecedented opportunity to hear from leading experts in the electronics industry, as well as to network with your customers and suppliers. No where else will you gather so much information on the industry in such a short time.

To register download a registration form.

Executives from every industry in your supply chain attend the Executive Market & Technology Forum Conference – from OEMs to materials and equipment suppliers. You will discover where the industry is headed, and how new developments will impact your business.

The first day will begin with a keynote address by Mr. John Grosso, Director of Asian Operations Engineering Dell Incorporated. He will discuss Dell’s vision of the future and what the company will expect from the suppliers in the interconnect industry so the supply chain can plan for the future.

Then, discover where you need to invest for long term growth.  Mr. Nick Pearne, BPA Consulting, will discuss the highlights of IPC’s commissioned study on geographic strategies for global expansion.  Mr. Wang Longji, President of the China Printed Circuit Association, will reveal solutions for sustainable development as manufacturers face new environmental challenges. You will also hear about:

  1. economic forecasts for the electronics industry
  2. important technology innovation challenges and their impact on the supply chain
  3. printable electronics
  4. embedded components
  5. how to achieve standardization in final finishes

The second day will be devoted to management challenges and market opportunities. Shauzab Ladha, IBM global Business Services, will discuss the business side of managing innovation.  Then discover the best practices for global supply chain management from Daniel Chan, Global PCB Council Chairman, Intergraded Supply Chain, IBM.  You will also learn about:

  1. flexible circuit market forecast
  2. making the transition from rigid PCBs to flexible circuits
  3. how Asian companies can overcome the entry barriers in overseas markets and sell products internationally
  4. highlights of IPC 2006 World PCB Production and Laminate Market Report

Agenda

Wednesday, 19 September, 2007

Globalization and the Future

9:00h

Keynote Address – Dell’s Vision of the Future and What the Company will Expect from Suppliers in the Interconnect Industry
John Grosso, Director of Asian Operations Engineering, Dell Incorporated

10:00h

Global and Regional Economic Forecast for the Electronics Industry
Randall Sherman, President, New Venture Research Corp.

10:45h

Break

11:00h

Highlights of IPC’s Commissioned Study on Geographic Strategies for Global Expansion: Where to Invest for Long-Term Business Growth
Nick Pearne, Director, BPA Consulting

12:00h

Lunch

Innovation Challenges

13:30h

Implementing New Technologies: Views from the PCB and EMS Industries
PCB industry
Chris Katzko, CTO, Meadville Technologies
EMS industry
Representative from Celestica (invited)

15:00h

China Printed Circuit Industry, Environment Challenges and Solutions for Sustainable Development
Wang Longji, President, China Printed Circuit Association

15:45h

Break

16:00h

Technology Innovation Challenges and their Impact on the Supply Chain
Printable Electronics
Randall Sherman, President, New Venture Research Corp.
Karen Carpenter, Consultant, TechSearch International

17:30h

Achieving Standardization in Final Finishes
Daniel Chan, Global PCB Council Chairman, Integrated Supply Chain (ISC) Division of IBM

18:00

Adjourn to reception and dinner

Thursday, 20 September

Management Challenges

9:00h

The Business Side of Managing Innovation: What Decision Makers Need to Know
Shauzab Ladha, IBM Global Business Services (invited)

9:45h

Best Practices of Global Supply Chain Management
Daniel Chan, Global PCB Council Chairman, Integrated Supply Chain, Division of IBM

10:30h

Break

10:45h

How Asian Companies Can Overcome Entry Barriers in Overseas Markets and Sell Products Internationally
James Li, President, E.J. McKay Inc.

11:15h

Making the Transition from Rigid PCBs to Flexible and Rigid-Flex Circuits
Ivy Wong, Vice President of Sales & Marketing, Multek Hong Kong Limited

12:00h

Lunch

Market Opportunities

13:30h

Flexible Circuit Market Dynamics and Forecasts
Nick Pearne, Director, BPA Consulting

14:30h

Break

14:45h

Highlights of IPC’s 2006 World PCB Production and Laminate Market Report
Sharon Starr, Director of Market Research, IPC

15:30h

Open Discussion on What the Global PCB Interconnect Industry Will be Like in Five Years

16:00h

Conference adjourned

With questions, please contact:
IPC Sally Cai
Tel: (021) 5497 3435
Fax:(21) 5497 3437
scai@ipc.org
CPCA Lynn Bao
Tel: (021) 5417 8012
Fax: (21) 5417 9002
cpcasha@online.sh.cn
HKPCA Manda Wong
Tel: (852) 2155 5099
Fax:(852) 2155 9099
mandawong@hkpca.org

About the Hotel

Jin Jiang Hotel and map5 floor, Shanghai Jian Gong Jin Jiang Hotel
(上海建工锦江大酒店5楼会议厅)
Address: No. 691 West Jianguo Road, Xuhui District, Shanghai, China
Tel: ++86-21-64155688
地址: 上海市徐汇区建国西路691号. 电话++86-21-64155688
Rate: 75 USD per night

The Jian Gong Jin Jiang Hotel is a modern three-star hotel located in the vibrant Hengshan Road area, within a few minutes' walk of Xujiahui Square—the center of the Xujiahui commerce and entertainment area in the southwestern part of Shanghai.

The hotel has many leisure and business facilities including: Chinese, Japanese and western restaurants, advanced meeting facilities, a sauna and massage center, games room, karaoke, gymnasium and beauty salon.

Hotel registration :
Venue:
5 floor, Shanghai Jian Gong Jin Jiang Hotel
(上海建工锦江大酒店5楼会议厅)
Address: No. 691 West Jianguo Road, Xuhui District, Shanghai, China
Tel: ++86-21-64155688
地址: 上海市徐汇区建国西路691号. 电话++86-21-64155688

Date:
19—20 September, Executive Market & Technology Forum

Hotel reservation contact:
Mr. Wu Chang Qin (酒店预定联系人: 吴长清)
Tel: ++86-21-64727738            ++86-13801964173
Fax: ++86-21-64726212
E-mail: wuchangqin@hotmail.com

*Please indicate you are the IPC-CPCA-HKPCA Conference for the special rate.
Transportation
The Jian Gong Jin Jiang Hotel has great access to transport links—both internal and inter-city. The Hongqiao International Airport is just 17 minutes drive away and the Pudong International Airport can be reached within one hour. The Shanghai metro underground railway is just a few minute's walk away and can take you to just about all parts of Shanghai in a matter of minutes.

About IPC’s Executive Market & Technology Forum
Membership in the Executive Forum is open to all members of IPC and offers a range of market research services for the entire electronic interconnection supply chain. Members receive in-depth market studies and business reports that help them identify the best opportunities and plan for future growth. Participation in Executive Forum conferences helps members to build a strong network of industry contacts and enhance their competitive position.

For information about Executive Forum membership, please contact:
Sharon Starr
Director of Market Research
IPC
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL 60015, USA
Tel: +1 847 597 2817
Fax: +1 847 597 2845
Email: sharonstarr@ipc.org

Conference Sponsorship Opportunities
Download a sponsorship form (pdf)

Gold Package –
3,300 USD / 25,000 RMB / 26,000 HKD
(maximum of three sponsors at this level)

  • One full-page color advertisement in conference proceedings book (artwork provided by sponsor). Placement assigned on a first come-first served basis:
    • Outside back cover
    • Inside front cover
    • Inside back cover
  • Company name and logo on front cover of proceedings book
  • Company name and logo on official sponsor list
  • Company name and logo on all promotional materials
  • Company name and logo on CD ROM of proceedings
  • Company literature included with conference materials given to all participants.
  • One complimentary registration for the Executive Forum Conference

Silver Sponsorship Package –
2,400 USD / 18,000 RMB / 19,000 HKD
(maximum of three sponsors at this level)

  • One full-page black-and-white advertisement in hard copy of proceedings book (artwork
    provided by company)
  • Company name and logo on front cover of proceedings book
  • Company name and logo on official sponsor list
  • Company name and logo on all promotional materials
  • Company name and logo on CD ROM of proceedings
  • Space to display company literature in registration area at conference
  • One complimentary registration for the Executive Forum Conference

Bronze Sponsorship Package –
1,000 USD / 8,000 RMB / 8,000 HKD

  • Company name and logo on front cover of proceedings book
  • Company name and logo on official sponsor list
  • Company name and logo on all promotional materials
  • Company name and logo on CD ROM of proceedings
  • Space to display company literature in registration area at conference
  • One complimentary registration for the Executive Forum Conference

Promotional Note Pads and Pens at each seat at the conference –
1,300 USD / 10,000 RMB /10,000 HKD
(maximum of one sponsor)
Materials to be provided by sponsor

  • Company name and logo on front cover of proceedings book
  • Company name and logo on official sponsor list
  • Company name and logo on all promotional materials
  • Company name and logo on CD ROM of proceedings

Promotional Conference Bags for each participant at the conference –
1,300 USD / 10,000 RMB / 10,000 HKD
(maximum of one sponsor)
Materials to be provided by sponsor

  • Company name and logo on front cover of proceedings book
  • Company name and logo on official sponsor list
  • Company name and logo on all promotional materials
  • Company name and logo on CD ROM of proceedings

Promotional Badge Cords / Lanyards for each participant at the conference –
1,300 USD / 10,000 RMB / 10,000 HKD
(maximum of one sponsor)
Materials to be provided by sponsor

  • Company name and logo on front cover of proceedings book
  • Company name and logo on official sponsor list
  • Company name and logo on all promotional material
  • Company name and logo on CD ROM of proceedings

Contact person:

IPC Sally Cai
Tel: (021) 5497 3435
Fax:(21) 5497 3437
scai@ipc.org

CPCA Lynn Bao
Tel: (021) 5417 8012
Fax: (21) 5417 9002
cpcasha@online.sh.cn

HKPCA Manda Wong
Tel: (852) 2155 5099
Fax:(852) 2155 9099
mandawong@hkpca.org