The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Laminate suppliers, component fabricators, and electronics assembly operations are engaged in numerous investigations to determine what lead-free material choices best fit their needs.

The complexities of lead-free soldering process implementation insure a transition period in which lead-free and tin-lead solder finishes will be present on assemblies. Rework and repair processes have not escaped the impact of the RoHS implementation.

This webcast will highlight a number of technical rework and repair topics:

• Copper dissolution in hole repair
• BGA package replacement
• High temperature soldering fluxes
• Impact on lead-free surface finishes
• Copper dissolution and plated-through hole rework
• Solder iron degradation and lead-free solder alloys
• Flux wire core management with lead-free rework
• Rework fluxes and mixed chemistries
• Topical cleaning of flux residues
• Impact on conformal coating

These represent an undergoing evolution as the implementation of the RoHS directive continues across the electronics industry.

When you register, we will send you a site license for the program. Set up a conference room and attend with colleagues, or log in from the convenience of home or a hotel room. It's easy and it's inexpensive!

About the Webcast Instructors:
Doug Pauls holds a B.A. in Chemistry and Physics, and a B.S. in Electrical Engineering. His career has been centered on materials science and its relation to electronics manufacturing materials and processes. He has worked for the US Navy, Contamination Studies Labs, and Rockwell Collins. Doug is a leader in the IPC cleaning, coating, and materials test fields.

Dave Hillman holds a B.S. in Metallurgical Engineering and a M.S. in Material Science & Engineering from Iowa State University. His career has been centered on materials and processes for military, avionics and high performance equipment applications. He has worked for General Dynamics Convair and Rockwell Collins. Dave is a leader in the IPC solderability task groups and a member of the JCAA/JGPP Pbfree solder project consortia team which won the 2005 Soldertec Lead Free Solder Award.

Registration Information

This webcast will begin at 10:00 am (US Central Daylight Savings Time) and conclude at 11:00 am (US Central Daylight Savings Time). Just complete the linked registration form below and return it to IPC's registration department via fax to +1-847-615-5661.

Webcast registrants will receive a link to download the materials along with the call-in telephone number 24 hours prior to the start of the webcast. Please feel free to make copies for all participants attending at your location. Set up a conference room and attend with colleagues, or log in from the convenience of home or a hotel room. Audio will be provided via a conference call phone number and participants will need internet access. Remember to check local times to make sure you don't miss a minute.

Unable to attend the webcast?
There is still time to view the webcast, please contact Michelle Michelotti at 1-847-597-2822 or email at MichelleMichelotti@ipc.org for further information.

Payment by Mail or Fax:

To register by mail: Send check made payable to IPC, 3491 Eagle Way, Chicago, IL, U.S.A. 60678-1349. To register by fax, please fax registration form to +1-847-615-5661, along with your credit card information.

Cancellation Policy: No refunds will be issued after the login and password have been e-mailed. If you have any questions, please contact IPC’s registration department at registration@ipc.org or call +1-847-597-2861.