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CALL FOR PARTICIPATION
IPC Midwest Conference & Exhibition
September 26-28, 2007
Schaumburg, IL
A New Technical Conference is Here!
IPC has launched a new conference and exhibition in the heart of the Midwest and you are invited to get in on the ground floor of this inaugural industry event.
Take part in the Midwest’s premier technical conference on all aspects of electronics manufacture — board design and manufacture, electronics assembly, and test.
Presentations from technical experts are sought on all relevant subjects, including
Lead Free Implementation
- Printed Board Solderability
- Solder Joint Reliability
- Tin Whiskers
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Board Materials
- New Laminates
- Materials Testing
- High Frequency Laminates
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Assembly Technology
- BGA Attachment Reliability
- Rework and Repair
- No Clean Processes
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Board Design
- Embedded Passives
- Advances in CAD/CAM
- Fine Pitch Design
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Board Fabrication
- Advances in Plating Technology Advances in Flex and Rigid-Flex
- Via Fill Technology
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Benefits of Participating
Increase your visibility in the industry, and that of your company, by participating in the IPC Midwest Conference & Exhibition 2007 technical conference. Many industry leaders use the research and findings from conference proceedings when they develop industry standards and guidelines.
Technical Papers and/or Presentations
The Technical Conference will be held Wednesday, September 26 through Friday, September 28, 2007. Abstracts for unpublished work should be submitted detailing case histories, field data, new technologies or innovations or research and findings. In addition, abstracts should summarize the problems and resolutions, methods used, results of experiments and benefits to the industry.
Presentations at the conference may be thirty minutes in length. They may be grouped together in a forum or panel discussion. Presentations must be non-commercial in nature, focusing on technology rather than a company’s product. Those deemed commercial by the Technical Program Committee will not be accepted. Abstracts must be submitted by April 18, 2007.
Professional Development Courses
Professional Development Courses will be held September 25 through September 28, 2007. Proposals are solicited from individuals interested in teaching full-day (six hours) or half-day (three hours) Professional Development Courses on design, printed circuit board and electronic manufacturing processes and materials.Proposals including course descriptions must be submitted by April 18, 2007. A master copy of the course workbook must be submitted by August 29, 2007. An honorarium is offered to Professional Development Instructors. Contact Alexandra Curtis at +1 847-597-2877 for more information. |
