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The RoHS directive has been in place for over 6 months now. New questions have begun to arise for circuit boards in areas like poor wetting, solderability on different surface treatments, heat resistance at FR4 base material, lead contamination and reliability. The demand for advice and solutions is increasing dramatically.
To give the European electronic industry some answers to the problems caused by implementing lead free processes, IPC and Soldertec Global, in cooperation with the EU projects and organizations ELFNET, GREENROSE, and LEADOUT, will hold an International Lead Free Reliability Conference in San Sebastian, Spain. The one-day Reliability Conference will be held with the ELFNET Dissemination Event.
Registration Information
Advanced registration will only be accepted through Friday, February 9, 2007 due to IPC registration staff attending the IPC Printed Circuits Expo, APEX and Designer Summit. After Friday, February 9, 2007, you must register onsite in order to attend this event. Complete the registration form and fax or mail to IPC. The technical conference and tabletop exhibits will be held 28 February 2007. Please see the conference agenda for specific times. For more information, or if the registration deadline has passed, contact an IPC registration representative at +1-847-597-2861.
Cancellation Policy: Cancellations received before 26 February 2007 will be refunded in full. Refunds will not be issued after the start of the program. Individuals failing to cancel will be billed for the registration fee. If the events are cancelled, participants will receive a full refund. If you are unable to attend, you may send a co-worker in your place.
Hotel Information
The conference will be held at Hotel Maria Cristina, Calle Oquendo 1, San Sebastian E-20004, Spain. A special hotel sleeping room package has been arranged for your convenience. Please fill out a completed booking form and fax it or e-mail it directly to the Hotel Maria Cristina. More information on the Hotel Maria Cristina.
San Sebastian is renowned for its Basque cuisine and its food is some of the best in Europe! A conference dinner will be held on the evening of Wednesday 28th February at 21:00 at the Palacio Miramar resturant, a short walk from the hotel |
Sponsorship Opportunities
Suppliers, manufacturers, and users of lead free technology will attend this conference. Your company can take advantage of this opportunity to sponsor this conference.
View the list of available sponsorship opportunities (.pdf) or contact Michelle Michelotti at +1-847-597-2822.
Tabletop Exhibits
At this conference, we expect over 100 attendees to visit the tabletop displays during the conference break and lunch. For pricing information and to download tabletop application here (.pdf).
Media Sponsors
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| Soldering & Surface Mount Technology |
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| ELFNET |
http://www.europeanleadfree.net
ELFNET (European Lead Free soldering NETwork) is a European research network of the national organizations, technical experts and industry bodies in micro-electronics. It provides a platform to coordinate, integrate and optimize research, enabling electronics producers in the EU to meet an EU directive to introduce lead-free soldering by 1 July 2006. |
| GreenRose |
http://www.green-rose.info
The main technological objective of the GreenRoSE project is to provide European SMEs (Small and Medium Sized Enterprises) of the electronics sector with the knowledge & tools to produce electronic equipment free of hazardous substances (in particular lead-free soldered and halogen free) with guaranteed quality and reliability. This environmentally sound electronic production is the new environmental and business challenge as reflected in European legislation - RoHS (Directive on the Restriction of Certain Hazardous Substances), WEEE (Directive on Waste Electrical and Electronic Equipment), EuE (Directive on establishing a framework for Eco-design of End Use Equipment) - and in the worldwide trend towards "Green Electronics". |
| LEADOUT |
http://www.leadoutproject.com
Project Objectives were the development/implementation of low cost lead-free soldering processes to support SMEs in complying with RoHS; including the establishment of process quality standards, reduction of defect rates, and improvement of reliability to increase competitiveness of SMEs. Also the project looked to increase awareness of health and safety and pollution prevention. |
| Conference Agenda |
| 8:30 |
Registration and Refreshments |
| 9:00 - 11:30 |
Lead Free Solder Joint Reliability: Trends and Plans
Jean-Paul Clech, Ph.D., EPSI
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| 11:30 - 12:00 |
Break |
| 12:00 - 12:30 |
Factors Affecting the Bulk Embrittlement of Pb-Free Solder Alloys
Konstantina Lambrinou, IMEC
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| 12:30 - 13:00 |
Simulation for Reliability Optimization
Bart Vandevelde, IMEC
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| 13:00 - 14:00 |
Lunch |
| 14:00 - 15:00 |
Fatigue Characteristics of Lead Free Solder Alloys Evaluated by
Miniature Testing Method
Yoshiharu Kariya Ph.D., Shibaura Institute of Technology |
| 15:00 - 15:30 |
Conductive Anodic Filament (CAF) Failures
Per-Erik Tegehall, IVF
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| 15:30 - 16:00 |
Board and Component Quality Issues
Eva Hedin, Ericcson |
| 16:00 - 16:30 |
Break |
| 16:30 - 17:00 |
High Cycle Fatigue
Guenter Grossman, EMPA
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| 17:00 - 17:30 |
Low-cycle Fatigue of First and Second Generation Lead Free Solders
Rainer Dudek, Fraunhofer-IZM
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| 17:30 |
Adjourn |
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Registration Form
IPC/Soldertec Global International Conference on Lead Free Components Reliability
28 February 2007 - San Sebastian, Spain
Advanced registration will only be accepted through Friday, February 9, 2007 due to IPC registration staff attending the IPC Printed Circuits Expo, APEX and Designer Summit. After Friday, February 9, 2007, you must register onsite in order to attend this event.
(download the registration form as a pdf here)
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IPC/Soldertec Global Member $500 / €375
ELFNET Founder Member $500 / €375
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 Non-member $750 / €565
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I would like to attend the ELFNET Dissemination Event.
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Payment in U.S. Dollars Only:
Will send $_________________________ via wire transfer to JP Morgan Chase, 120 South LaSalle Street, Chicago, Illinois U.S.A. 60603, SWIFT code CHASUS33, (Acct Name) IPC-Depository Account, (Acct#) 0018231861, (ABA Routing #) 071000013.
Payment in Euros:
Will send € via wire transfer JP Morgan Chase Bank, N.A. London, SWIFT code CHASGB2L, (Acct Name) IPC International, (Acct#) 0077104001, IBAN: GB32 CHAS 6092 4277 1040 01. |
Payment by Mail or Fax:
To register by mail: Send check made payable to IPC, 3491 Eagle Way, Chicago, IL, U.S.A., 60678-1349. To register by fax, please fax registration form along with credit card information to 847-615-5661.
Cancellation Policy: Cancellations received before 26 February 2007 will be refunded in full. Refunds will not be issued after the start of the program. Individuals failing to cancel will be billed for the registration fee. If the events are cancelled, participants will receive a full refund. If you are unable to attend, you may send a co-worker in your place. |
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Your credit card will be debited in U.S. dollars. Our computer will assess the member or non-member price based on your current IPC/Soldertec membership status. No receipt will be sent unless requested. (Please note registration fees must be paid in full prior to admittance into this event.) |
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| Please contact us at registration@ipc.org if you have questions or a disability requiring accommodations. |
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