IPC Status of Standardization

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Status of Standardization

Published Standards
J-STD-001G Am1 October 2018 Requirements for Soldered Electrical and Electronic Assemblies
IPC-WP-019A October 2018 An Overview on the Global Change in Ionic Cleanliness Requirements
IPC-1791 September 2018 Trusted Electronic Designer, Manufacturer, and Assembler Requirements
IPC-4204B September 2018 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-7095D July 2018 Design and Assembly Process Implementation for BGAs
IPC-HDBK-620 June 2018 Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620
IPC-1754 June 2018 Materials Declaration Standard for Aerospace and Defense

J-STD-001G-DK November 2018 Krav til loddede elektriske og elektroniske produkter (Danish language)
J-STD-001G-NL November 2018 Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten (Dutch language)
J-STD-001GS-JP November 2018 はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格」(Japanese language)
IPC-A-610G-DK November 2018 Godkendelseskrav for elektronikprodukter (Danish language)
IPC-A-610G-NL November 2018 Acceptatie van geassembleerde printplaten (Dutch language)
IPC-7711/21C-FR November 2018 Reprise, Modification et Réparation des Assemblages Électroniques (French language)
IPC-7711/21C-JP November 2018 電子組立品のリワーク、改造およびリペア (Japanese language)
IPC-A-610G-FR November 2018 Acceptabilité des Assemblages Électroniques (French language)
IPC-A-620C-DK November 2018 Godkendelseskrav for kabler og for produkter med wire harness (Danish language)
J-STD-001GS-SP October 2018 Adenda para dispositivos electrónicos utilizados en aplicaciones militares y espaciales, realizada al documento IPC J-STD-001G titulado Requisitos de ensambles soldados eléctricos y electrónicos (Spanish language)
IPC-A-610G-RO September 2018 Acceptabilitatea Ansamblurilor Electronice (Romanian language)
IPC-A-610G-EE September 2018 Elektroonikakoostude vastavusnõuded (Estonian language)
J-STD-075-SP September 2018 Clasificación de componentes electrónicos no-IC para procesos de ensamble (Spanish language)
IPC-1601A-SP August 2018 Guía para el manejo y almacenamiento de tarjetas impresas (Spanish language)
IPC/WHMA-A-620C-NL August 2018 Eisen en acceptatie van kabel en draadboom assemblages (Dutch language)
J-STD-001GS-FR August 2018 Annexe des produits électroniques des applications spatiales et militaires à la norme J-STD-001G, Exigences des Assemblages Électriques et Électroniques Brasés (French language)
J-STD-020E-SP July 2018 Clasificación de la sensibilidad a la humedad / reflujo de dispositivos de montaje superficial no herméticos - (Spanish language)
J-STD-001G-SP June 2018 Provee requisitos para materiales de soldadura y procesos para ensambles electrónicos (Spanish language)
J-STD-001G-DE June 2018 Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen (German language)
J-STD-001G-FR June 2018 Les exigences relatives au brasage d’assemblages électroniques et électriques (French language)
IPC/WHMA-A-620C-IL June 2018 מחליף את IPC/WHMA-A-620B עם שינוי 1 אוגוסט 2013 מפרט בינלאומי שפותח על ידי (Hebrew language)

Proposed Standard for Ballot
IPC-CC-830C Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-2231 DFX Guideline
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-9111 Troubleshooting for Printed Board Assembly Processes
IPC/JEDEC-9301 Reliability and Design Finite Element Analysis Standard

Final Draft for Industry Review
IPC-A-610GC IPC-A-610 Revision G Telecom Addendum
IPC-2591 Connected Factory Exchange (CFX)

Working Draft
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-A-600K Acceptability of Printed Boards
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC/SGIA-5222 Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
IPC-6017A Qualification and Performance Specification for Printed Boards Containing Embedded Passive and/or Active Components
IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7991 Process Guideline for 3D Printed Electronics
IPC-8921 Requirements for Electronic Textiles (E-Textiles), Conductive Fibers and Conductive Yarns
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-9709A Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
IPC-9797 Press-fit Standard for Automotive Requirements and other high-reliability applications

Project Approved
J-STD-003C Am2 Solderability Tests for Printed Boards
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7351C Generic Requirements for Surface Mount Design and Land Pattern Standard


Test Method Proposals

SECTION 2.1 - 2.1 Visual Test Methods
TM Determining a Weave as Spread Glass

SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM Solder Powder Particle Size Distribution - Measuring Microscope Method
TM Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight

SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning

SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test

SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

SECTION 2.6 - 2.6 Environmental Test Methods
TM Surface Insulation Resistance - Fluxes - Telecommunications
TM Surface Insulation Resistance
TM Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux

Test Methods Approved

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