IPC Status of Standardization

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Status of Standardization


Published Standards
IPC-1791 Am1 April 2019 Trusted Electronic Designer, Fabricator and Assembler Requirements – Amendment 1
IPC-9111 February 2019 Troubleshooting for Printed Board Assembly Processes
IPC/JEDEC-9301 January 2019 Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
IPC-CC-830C January 2019 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-6012DA-WAM1 December 2018 Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
J-STD-001G Am1 October 2018 Requirements for Soldered Electrical and Electronic Assemblies
IPC-WP-019A October 2018 An Overview on the Global Change in Ionic Cleanliness Requirements


Translations
IPC-WP-024-CN April 2019 IPC 智能织物结构的可靠性和可洗性白皮书——为市场做好准备 (Chinese language)
IPC/WHMA-A-620C-KR March 2019 케이블 및 와이어 하네스 어셈블리들에 대한 요건들 및 수용 (Korean language)
IPC/WHMA-A-620C-VN March 2019 Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây và Bộ Cáp Dẫn Điện (Vietnamese language)
IPC-6012D-AM1-JP March 2019 リジッドプリント板の認定および性能仕様-改定1 (Japanese language)
J-STD-001G-TH March 2019 ข้อกำหนดสำหรับการบัดกรีอิเล็กทรอนิกส์และงานประกอบอิเล็กทรอนิกส์ (Thai language)
IPC-6012D-JP March 2019 リジッドプリント板の認定および性能仕様 (Japanese language)
J-STD-001G-AM1-SP March 2019 Provee requisitos para materiales de soldadura y procesos para ensambles (Spanish language)
J-STD-001G-AM1-DE March 2019 Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen (German language)
J-STD-001G-AM1-FR March 2019 Les exigences relatives au brasage d’assemblages électroniques et électriques (French language)
J-STD-001G-IT February 2019 Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici (Italian language)
J-STD-001G-PL February 2019 Wymagania dla lutowanych zespołów elektrycznych i elektronicznych (Polish language)
IPC-6013D-PL February 2019 Specyfikacja Zdolności i Osiągów dla Elastycznych / Sztywno-Elastycznych Płyt Drukowanych (Polish language)
IPC/JEDEC-J-STD-033D-SP February 2019 Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso (Spanish language)
IPC-A-620C-PL February 2019 Wymagania i akceptacje dla montażu kabli i wiązek przewodów (Polish language)
J-STD-001G-KR January 2019 솔더링된 전기 및 전자 어셈블리들에 대한 요건들 (Korean language)
J-STD-001G-RU January 2019 Требования к электрическим и электронным сборкам, изготавливаемым с помощью пайки (Russian language)
IPC-6012D-TR January 2019 Sert Baskı Devre Kartları İçin Kalifikasyon ve Performans Spesifikasyonu (Turkish language)
IPC-6012D-AM1-TR January 2019 Sert Baskı Devre Kartları İçin Kalifikasyon ve Performans Spesifikasyonu (Turkish language)
IPC-A-610G-IT January 2019 Accettabilità degli Assemblaggi Elettronici (Italian language)
IPC-A-610G-CZ January 2019 Kritéria přijatelnosti elektronických sestav (Czech language)
IPC-A-610G-KR January 2019 전자 어셈블리들의 허용 가능성 (Korean language)
IPC-A-610G-TH January 2019 การยอมรับของงานประกอบอิเล็กทรอนิกส์ (Thai language)
IPC-7711/21-HU January 2019 Az elektronikai szerelvények újramunkálása, módosítása és javítása (Hungarian language)
IPC-7711/21C-KR January 2019 전자 어셈블리들의 리웤, 변경 및 수리 (Korean language)
IPC-A-600J-TR January 2019 Baskı Devre Kartlarının Kabul Edilebilirliği (Turkish language)
IPC-4591A-CN December 2018 印刷电子功能导电材料要求 (Chinese language)
J-STD-002E-CN December 2018 元器件引线、焊端、焊片、端子和导线的可焊性测试 (Chinese language)
J-STD-033D-CN December 2018 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用 (Chinese language)
IPC-6903A-CN December 2018 印刷电子设计与生产的术语及定义 (Chinese language)
IPC-9121-CN December 2018 印制板制造工艺问题解答 (Chinese language)
IPC-4101E-CN December 2018 刚性及多层印制板用基材规范 (Chinese language)
J-STD-001G-DK November 2018 Krav til loddede elektriske og elektroniske produkter (Danish language)
J-STD-001G-NL November 2018 Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten (Dutch language)
J-STD-001GS-JP November 2018 はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格」(Japanese language)
IPC-A-610G-DK November 2018 Godkendelseskrav for elektronikprodukter (Danish language)
IPC-A-610G-NL November 2018 Acceptatie van geassembleerde printplaten (Dutch language)
IPC-7711/21C-FR November 2018 Reprise, Modification et Réparation des Assemblages Électroniques (French language)
IPC-4556-CN November 2018 印制板化学镍/钯/浸金(ENEPIG)规范 (Chinese language)
IPC-6013D-CN November 2018 挠性和刚挠印制板的鉴定及性能规范 (Chinese language)
IPC-7711/21C-JP November 2018 電子組立品のリワーク、改造およびリペア (Japanese language)
IPC-A-610G-FR November 2018 Acceptabilité des Assemblages Électroniques (French language)
IPC-A-620C-DK November 2018 Godkendelseskrav for kabler og for produkter med wire harness (Danish language)
J-STD-001GS-SP October 2018 Adenda para dispositivos electrónicos utilizados en aplicaciones militares y espaciales, realizada al documento IPC J-STD-001G titulado Requisitos de ensambles soldados eléctricos y electrónicos (Spanish language)


Proposed Standard for Ballot
IPC-2231 DFX Guideline
IPC-2591 Connected Factory Exchange (CFX)
IPC-7526A Stencil and Misprinted Board Cleaning Handbook


Final Draft for Industry Review
IPC-A-610GC IPC-A-610 Revision G Telecom Addendum
IPC-6012E Qualification and Performance Specification for Rigid Printed Boards


Working Draft
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-A-600K Acceptability of Printed Boards
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC/SGIA-5222 Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6017A Qualification and Performance Specification for Printed Boards Containing Embedded Passive and/or Active Components
IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7991 Process Guideline for 3D Printed Electronics
IPC-8921 Requirements for Electronic Textiles (E-Textiles), Conductive Fibers and Conductive Yarns
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-9709A Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
IPC-9797 Press-fit Standard for Automotive Requirements and other high-reliability applications


Project Approved
J-STD-003C Am2 Solderability Tests for Printed Boards
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7351C Generic Requirements for Surface Mount Design and Land Pattern Standard


Withdrawn
 


Test Method Proposals


SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.7.2 Determining a Weave as Spread Glass


SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM 2.2.14.1A Solder Powder Particle Size Distribution - Measuring Microscope Method
TM 2.2.14.2A Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM 2.2.14.3A Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight


SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM 2.3.20.1 Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM 2.3.35.1B Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning


SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.34.1A Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM 2.4.34.2A Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM 2.4.34.3A Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test


SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests


SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.3.6A Surface Insulation Resistance - Fluxes - Telecommunications
TM 2.6.3.7A Surface Insulation Resistance
TM 2.6.14.1A Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux


Test Methods Approved
 
 
Knowledge

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