IPC Status of Standardization

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Status of Standardization


Published Standards
IPC-6013D September 2017 Qualification and Performance Specification for Flexible Printed Boards
IPC-4552A August 2017 Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
IPC-A-640 July 2017 Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-4921A June 2017 Requirements for Printed Electronics Base Materials
IPC-1755-WAM1&2 May 2017 Conflict Minerals Data Exchange Standard - with Amendments 1 & 2
IPC-7530A April 2017 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-4101E April 2017 Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-1401 April 2017 Supply Chain Social Responsibility Management System Guidance
IPC-1072 Am 1 March 2017 Intellectual Property Protection in Electronic Assembly Manufacturing - Amendment 1


Translations
IPC/WHMA-A-620C-DE August 2017 Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen
IPC-7525B-RU August 2017 Руководство по конструированию трафаретов
IPC-6012DS-CN August 2017 刚性印制板的鉴定及性能规范航天和军事航空电子应用补充标准
IPC-7711/7721C-CN July 2017 电子组件的返工、修改和维修
J-STD-001F-AM1-FR June 2017 Exigences des Assemblages Électriques et Électroniques Brasés (French language)
IPC-A-610F-AM1-FR June 2017 Acceptabilité des Assemblages Électroniques (French language)
IPC/WHMA-A-620C-FR June 2017 Exigences et Critères d’Acceptabilité pour l’Interconnexion des Faisceaux de Fils et de Câbles
IPC-1401-CN April 2017 供应链社会责任管理体系指南
IPC-7095C-CN April 2017 BGA设计与组装工艺的实施 (Chinese Language)
JSTD001F-WAM1-CN April 2017 焊接的电气和电子组件要求修订版F附修订本1 (Chinese language)
IPC/WHMA-A-620B-S-CN April 2017 IPC/WHMA-A-620B航天应用电子部件补充标准 (Chinese Language)
IPC-A-610F-TH March 2017 มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์ (Thai language)
IPC-SM-785-CN March 2017 表面贴装焊接连接加速可靠性测试指南 (Chinese Language)


Proposed Standard for Ballot
J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610G Acceptability of Electronic Assemblies
IPC-2226A Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
IPC-7091 Design and Assembly Process Implementation of 3D Components


Final Draft for Industry Review
IPC-1754 Materials Declaration Standard for Aerospace and Defense
IPC-9111 Troubleshooting for Printed Board Assembly Processes


Working Draft
IPC-HDBK-005A Guide to Solder Paste Assessment
J-STD-006C AM 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-HDBK-620 Cable and Wire Harness Design Guideline
IPC-CC-830C Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-2221C Generic Standard on Printed Board Design
IPC-2231 Design for Manufacturing (DFM) Guideline for the Printed Board Design Cycle
IPC/JPCA-4591A Requirements for Printed Electronics Functional Materials
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7095D Design and Assembly Process Implementation for BGAs
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7621 Low Pressure Molding Design, Selection, and Application Guidelines


Project Approved
IPC-7621 Low Pressure Molding Design, Selection, and Application Guidelines
J-STD-003C Am2 Solderability Tests for Printed Boards
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292 Sectional Design Standard for Printed Electronics (Additive Circuitry)
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC/SGIA-5222 Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-6903A Terms and Definitions for Design, Production and Performance of Printed Electronics
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7094A Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-7351C Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC/JEDEC-9301 Reliability and Design Finite Element Analysis Standard


Withdrawn
 


Test Method Proposals


SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.7.2 Determining a Weave as Spread Glass


SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM 2.2.14.1A Solder Powder Particle Size Distribution - Measuring Microscope Method
TM 2.2.14.2A Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM 2.2.14.3A Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight


SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM 2.3.20.1 Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM 2.3.35.1B Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning
TM 2.3.44 August 2015 Determination of Thickness and Phosphorus content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry


SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.34.1A Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM 2.4.34.2A Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM 2.4.34.3A Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test


SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests


SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.3.6A Surface Insulation Resistance - Fluxes - Telecommunications
TM 2.6.3.7A Surface Insulation Resistance
TM 2.6.14.1A Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux


Test Methods Approved


SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.53 August 2017 Dye and Pull Test Method (Formerly Known as Dye and Pull)


SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.27A August 2017 Thermal Stress, Convection Reflow Assembly Simulation
 
 
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