IPC Status of Standardization

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Status of Standardization

Published Standards
IPC-7095D-WAM1 August 2019 Design and Assembly Process Implementation for Ball Grid Arrays (BGAs), with Amendment 1
IPC-HERMES-9852 June 2019 The Global Standard for Machine-to-Machine Communication in SMT Assembly
IPC-2231 May 2019 DFX Guidelines
IPC-1754 WAM 1 April 2019 Materials and Substances Declaration for Aerospace and Defense and Other Industries
IPC-2591 April 2019 Connected Factory Exchange (CFX)
IPC-1791 Am1 April 2019 Trusted Electronic Designer, Fabricator and Assembler Requirements – Amendment 1

IPC-2221B-JP September 2019 プリント基板設計に関する共通基準 (Japanese language)
IPC-2591-FR September 2019 Échanges au sein d’une usine connectée (CFX) (French language)
IPC-7095D-WAM1-CN September 2019 BGA设计与组装工艺的实施 (Chinese language)
IPC-9703-CN September 2019 焊点可靠性的机械冲击测试指南 (Chinese language)
IPC-2591-CN September 2019 互联工厂数据交换(CFX)(Chinese language)
IPC-2591-SP September 2019 Intercambio en fábricas conectadas (CFX) (Spanish language)
IPC-6018CS-CN September 2019 6018C高频(微波)印制板的鉴定及性能规范航天和军事航空电子应用补充标准 (Chinese language)
IPC-A-600J-ZH August 2019 印製板的可接受性 (Chinese (Zhōngwén) Language)
IPC-2591-DE August 2019 Datenaustausch in der vernetzten Fabrik (CFX) (German language)
IPC-4202B-CN August 2019 挠性印制板用挠性基底电介质 (Chinese language)
IPC-6012DS-PL August 2019 Dodatek do Aplikacji Kosmicznych i Awioniki Wojskowej dla dokumentu IPC-6012D - Specyfikacji Zdolności i Osiągów dla Sztywnych Płyt Drukowanych (Polish language)
IPC-6012D-PL August 2019 Specyfikacja Zdolności i Osiągów dla Sztywnych Płyt Drukowanych (Polish language)
J-STD-001G Am 1-CN July 2019 焊接的电⽓和电⼦组件要求 修订本1 (Chinese language)
J-STD-001G Am 1-JP July 2019 はんだ付される電気及び電子組立品に関する要件事項 改訂1 (Japanese language)
IPC-A-610G-ZH July 2019 電子組件的可接受性 (Chinese-Zhōngwén language)
IPC/WHMA--A-620C-ZH July 2019 線纜及線束組件的要求與驗收 (Chinese-Zhōngwén language)
IPC-9204-CN June 2019 印刷电子柔性与可拉伸性能测试指南 (Chinese language)
IPC-6012DA-JP June 2019 IPC-6012D リジッドプリント板の認定および性能仕様車載用途向け追加規格 (Japanese language)
IPC-6012DS-JP June 2019 リジッドプリント板の認定および性能仕様宇宙・軍用アビオニクス用途向け追加規格 (Japanese language)
IPC-CC-830C-CN May 2019 印制线路组件用电气绝缘化合物的鉴定及性能 (Chinese language)
IPC-7530A-CN May 2019 群焊工艺温度曲线指南(再流焊和波峰焊)(Chinese language)
IPC-A-610G-PL May 2019 Dopuszczalność Zespołów Elektronicznych (Polish language)
IPC-A-640-CN May 2019 光纤,光缆和混合线束组件的验收要求 (Chinese language)
IPC-AJ-820A-CN May 2019 组装和连接手册 (Chinese language)
IPC-7711/21C-PL May 2019 Wprowadzanie Poprawek, Modyfikacja i Naprawa Zespołów Elektronicznych (Polish language)
IPC-A-610G-VN April 2019 Tiêu Chuẩn Chấp Nhận Các Sản Phẩm Lắp Ráp Điện Tử (Vietnamese language)
IPC-1601A-PL April 2019 Wytyczne dla obsługiwania i przechowywania płyt drukowanych (Polish language)
IPC-7711/21C-NL (Chapter 1) April 2019 Rework, modificatie en repair van elektronische assemblages (Dutch language)
J-STD-001G-VN April 2019 Các Yêu Cầu Cho Các Sản Phẩm Điện và Điện Tử Hàn Lắp Ráp (Vietnamese language)
IPC-A-600J-PL April 2019 Kryteria Dopuszczenia Płyt Drukowanych (Polish language)
IPC/WHMA-A-620C-HU April 2019 Kábel- és huzalköteg-szerelvények követelményei és elfogadása (Hungarian language)
IPC-HDBK-005-CN April 2019 电子产品的制造和供应链可追溯性标准 (Chinese language)
IPC/WHMA-A-620C-S-CN April 2019 IPC/WHMA-A-620C航天应用电子部件补充标准 (Chinese language)
IPC-1601A-CN April 2019 印制板操作和储存指南 (Chinese language)
IPC-4921A-CN April 2019 印刷电子基材(基板)要求 (Chinese language)
IPC-J-STD-001GS-CN April 2019 焊接的电气和电子组件要求航天和军事应用电子部件补充标准 (Chinese language)
IPC-1782-CN April 2019 电子产品的制造和供应链可追溯性标准 (Chinese language)
IPC-6018C-CN April 2019 高频(微波)印制板的鉴定及性能规范 (Chinese language)

Proposed Standard for Ballot
IPC/WHMA-A-620D Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-4552B Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-9121 Am2 Troubleshooting for Printed Board Fabrication Processes - Amendment 2

Final Draft for Industry Review
IPC-A-610GC IPC-A-610 Revision G Telecom Addendum
IPC-1755A Responsible Sourcing of Minerals Data Exchange Standard - Revision A
IPC-6012E Qualification and Performance Specification for Rigid Printed Boards

Working Draft
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-A-600K Acceptability of Printed Boards
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC/SGIA-5222 Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6017A Qualification and Performance Specification for Printed Boards Containing Embedded Passive and/or Active Components
IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7991 Process Guideline for 3D Printed Electronics
IPC-8921 Requirements for Electronic Textiles (E-Textiles), Conductive Fibers and Conductive Yarns
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-9709A Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
IPC-9797 Press-fit Standard for Automotive Requirements and other high-reliability applications

Project Approved
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
IPC/WHMA-A-620DS Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620D.
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4101E WAM1 Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-4412B Am 3 Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards - Amendment 3
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7351C Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes


Test Method Proposals

SECTION 2.1 - 2.1 Visual Test Methods
TM Determining a Weave as Spread Glass

SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM Solder Powder Particle Size Distribution - Measuring Microscope Method
TM Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight

SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning

SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test

SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

SECTION 2.6 - 2.6 Environmental Test Methods
TM Surface Insulation Resistance - Fluxes - Telecommunications
TM Surface Insulation Resistance
TM Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux

Test Methods Approved

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