Special Events

IPC Opening Session: Designing Electronics for Tomorrow and Manufacturing with Sustainability in Mind

Tuesday, September 28, 8:30 am–9:30 am
Carol Handwerker, Sc.D., Reinhardt Schuhmann, Jr. Professor of Materials Engineering, Purdue University

Sustainability is a vital topic for both national and international research activities. Sustainability requirements drive behavior within research and development as well as materials choices and manufacturing. The completive dynamics associated with sustainability can make the difference between companies that survive and thrive and those that die. Dr. Handwerker’s extensive background in materials and metallurgy combined with her experiences throughout the electronics industry makes her uniquely qualified to provide insights and true understanding next generation technologies and beyond.

Prior to joining Purdue, Dr. Handwerker served as Chief of the Metallurgy Division at NIST. She has led and continues to lead activities within the microelectronics industry for the conversion to lead-free solders for printed wiring assemblies and components through electronic industry consortia activities.

FREE FORUMS! Ask the Expert Panels

Get your questions answered by some of the industry’s most noted experts — for free! IPC has assembled two amazing panels to give you access to experts who can help solve your fabrication and assembly problems. This is a rare opportunity to openly discuss solutions to the industry’s common challenges.

FF01    Challenges in Printed Board Fabrication
Tuesday, September 28, 4:00 pm–5:00 pm
Chris Mahanna, Robisan Laboratory, Inc.
Wendi Boger, DDi
Nick Koop, CID, Minco Products

Panelists will answer your questions on printed board fabrication issues, including:

• Via fill, stacked vias and cap plating processes
  
• New requirements in IPC-6012C
  
• Thermal stress methodologies
  
• When should rigid-flex printed boards be used?
  
• How tightly can a flex circuit be bent?
  
• Lot acceptance and conformance testing
  

FF02    Challenges in Printed Board Assembly Technology
Wednesday, September 29, 4:00 pm–5:00 pm
Jennie Hwang, Ph.D., H-Technologies Group
Teresa Rowe, AAI Corporation
Greg Munie, Ph.D., IPC

Panelists will answer your questions on electronics assembly issues, including:

• Electronics manufacturing and EMS market trends
  
• Emerging interconnect technologies
  
• Current assembly issues and remedies
  
• Solder paste technology
•  Lead-free solder joint reliability testing and performance
• Printed board surface finishes

Meet the People You Need to Know

FREE! First-Timers' Welcome Breakfast
Tuesday, September 28, 7:30 am–8:15 am

Get the insider view. Enjoy a continental breakfast while your colleagues share the ins and outs of IPC and this event. Learn how to put IPC’s resources to use for you and your company and find out how to take advantage of everything this event has to offer. Even if you’re not a first-timer, join us for a refresher course on IPC programs and activities.

IPC and Chicagoland Circuit Board Association Annual Golf Outing
Friday, October 1, 2010

• Registration: 7:30 am
• Tee times: 9:00 am
• Shotgun start format: Four person best ball

Swing your clubs on a beautiful fall day with friends and colleagues at Klein Creek Golf Club in Winfield. Dinner, golf, cart and prizes: $100. Sign up today.

Luncheons

Monday and Tuesday, September 27–28, 12:00 pm–1:30 pm

• IPC Committee Awards Luncheons (registration required)

Wednesday, September 29, 12:00 pm–1:30 pm

• IPC Event Luncheon (registration required)

On the Show Floor

EASi-Line

Electronics assembly live and in action! Attendees will follow a product through all steps of the assembly process while learning about the processes and equipment that manufacture the device.

Companies participating in the EASi-Line include:

EMS services by Aimtron Corporation Aimtron Corporation is a full-service contract manufacturing solutions provider for the electronics industry. Electronics assembly, wire harness, and full box build projects are supported in their metro Chicagoland factory and headquarters. Global partnerships spanning from China to India support offshore projects as needed. “Process obsessed” for first article success, Aimtron focuses on engineering excellence, bringing wide industry experience to your needs. Projects ranging from simple through IPC Class 2 & Class 3 devices are supported domestically. Current clients span medical, military, gaming green tech, automotive, and mixed high-technology markets.     Design services by Freedom CAD Services, Inc. Freedom CAD Services is one of North America’s largest PCB design service bureaus, specializing in electronic design engineering and layout services for complex high-speed and large electronic systems.  With 30+ talented designers, Freedom CAD uses leading PCB CAD tools including Cadence Allegro, Mentor Expedition and PADS, as well as mechanical design tools: SolidWorks and Pro/ENGINEER.  Freedom CAD also provides quick-turn printed circuit boards and assemblies through strategic relationships with world-class manufacturers to provide one-stop shopping from design concept through turnkey assemblies.   Printed Circuit Boards provided by Bare Board Group, Inc. Bare Board Group offers the benefits of offshore pricing with ease of domestic purchasing for quality, on-time, printed circuit boards. With offices in the U.S. & Taiwan, BBG's ISO-9001 approved infrastructure allows for on-site expediting, source inspection and around-the-clock communication. Visit BBG on the Web at www.bareboard.com for more information.   Components provided by TopLine The original "one-stop-shop" for low-cost dummy components, TopLine has helped thousands of customers define and refine their SMT assembly processes. Applications for dummy components include machine evaluation, acceptance testing, solder training, temperature profiling, re-certification, prototype design and demonstrations. TopLine offers off-the-shelf delivery for 1,000 different dummy component packages and practice kits. The company’s application engineers are ready to assist with complex requirements.     Stencils provided by Microscreen MicroScreen offers laser cut and electroformed stencils for printing solder paste. Options for lead-free stencils include high nickel-content metal for improved paste release and "green" identification for isolation of lead-free stencils. All stencils are 100% inspected for integrity using ScanCheck AOI. The company is a distributor of Wizard Frame System and Space Saver.     Nitrogen generator supplied by On Site Gas Systems A leader in gas generating technology, On Site Gas Systems designs and builds oxygen and nitrogen gas generating systems that function on-site at physical plants. They will provide high purity nitrogen 99.999% for the lead-free selective solder applications of the EASi-Line. Their systems are used in mission-critical applications, across dozens of industries.     Laser Marker and Conveyors supplied by FlexLink Based on its unique application experience and global network, FlexLink provides innovative, profitable and quality automation solutions to demanding world-leading customers. FlexLink’s specialty is Production Logistics, defined as ensuring that each machine and workstation is fed with the right product, quantity and quality at the right time. The solution considers intelligent value-adding processes and elimination of nonvalue-adding ones. FlexLink offers custom solutions, standard modules and software that allow for efficient, variable and progressive production flow throughout the assembly, testing and packaging process.     Printer supplied by MYDATA automation MYDATA automation designs and manufactures SMT process equipment for the electronics industry. They will feature the MY500 Jet Printer in the EASi-line. Using a revolutionary new technology for solder paste application, the MY500 Jet Printer shoots solder paste and SMT adhesive on the fly without touching the PCB. Jet printing is a stencil-free process that offers many advantages over screen printing, such as PCB design freedom and virtually no changeover or lead times. Solder paste deposits can be adjusted on-the-spot in three dimensions.     Assembly Equipment (Pick & Place) provided by Juki Automation Systems Juki manufactures high quality SMT Placement Systems for use in the electronics manufacturing industry. Renowned for producing reliable, flexible placement equipment that is very easy to use and maintain, Juki has recently emerged as a significant player in the high-speed market. Juki will showcase the KE1080 flexible placement machine in the EASi-Line. The KE1080 is built on the topology of the popular KE2080 and features an IPC9850 speed of 14,100CPH and has a very wide component placement range from 01005 (0402 metric) to 74mm squared to 50mmx150mm. The KE1080 features the LNC60 optical centering unit that is built into the head to easily measure components while moving from the pick to the placement site. This eliminates having to move to a stationary or line scan camera creating a very efficient method of component measurement centering. The LNC60 is not affected by the color of a part and can easily transfer a part profile back to the database. Other important features of the LNC60 laser include detecting the exact height of the nozzle tip, bent nozzle detection, and a tombstone pick check. Additionally, it ensures that a component is present before placement, and that the component has been placed successfully.     Reflow Oven provided by Heller Industries Heller Industries will display their Model 1809 Reflow Soldering Oven in the EASi-Line. This 100% forced hot air convection reflow system showcases Heller's leading edge thermal technology with the best heat transfer and lowest Delta T on the PCB. Additionally, Heller has achieved breakthroughs in cost of ownership and energy conservation with a 40% reduction in electrical consumption and a 50% reduction in nitrogen consumption. As a result of these advances, Frost and Sullivan has named Heller the recipient of the 2010 "Global Company of the Year Award."     Through hole selective soldering provided by ACE Production Technologies ACE will be performing selective soldering with their KISS-104 system, fully configured with internal pre-heater, spray and drop-jet fluxing systems. Operating in the line, The SMEMA-compatible and fully programmable KISS 104 uses ACE's proven ‘traveling mini–solder wave. This system overcomes the limitations of operator-dependent soldering with a truly flexible molten solder delivery system. It is designed to deliver repeatable soldering performance without the expense of robotic selective soldering machines. The KISS 104 provides a generous 26" x 19" work area that does not require any special user intervention or additional setup steps. With the 104, the user can place more boards in the work area and take advantage of the Step-and-Repeat feature of the system's unique operating program and automated capability as an in-line or stand-alone system.     Cleaning chemistries provided by Kyzen Corporation Kyzen provides award-winning precision cleaning chemistries for electronics, advanced packaging, metal finishing and aerospace applications. The company offers a broad range of process solutions ranging from bench top and sprayable aqueous cleaning formulations to engineered vapor degreasing solvents. All of Kyzen's products are environmentally friendly, offer low cost of ownership and are effective in all cleaning systems in use on the production floor. The company operates two fully equipped cleaning applications centers where it tests nearly 300 soldering materials from the world's leading suppliers. Kyzen's applications lab is staffed with technical experts and is available to help with customer process development. Kyzen's goal is to provide unmatched customer service and integrated cleaning SOLUTIONS!     Cleaning equipment provided by Aqueous Technologies Corp. The Trident is a fully automatic defluxing and cleanliness testing system designed to remove all flux residues from post-reflow circuit assemblies. The Easi Line will feature the multiple award winning Trident III, equipped with a closed-loop wash solution recirculation system, automatic chemical dosing and management system, SPC data capturing software with barcode scanner, and a powerful drying system.     Depanelizer supplied by FKN Systek Inc. Depanelizing skip routed PCB panels up to 24" long is made simple and easy with FKN Systek’s K4000 PCB singulator. Just place the bottom scoreline of the PCB onto the linear blade and step on a guarded foot switch to bring the circular blade across the top scoreline for clean separation of the PCB panels. Right and left blade guards assure operator safety. The front and back support and take up table are height adjustable. All K4000 models are available with optional light beam safety curtain across the front of the blades for additional operator safety, and a conveyor belt to bring singulated PCBs to the side for easy removal. An infrared sensor on the end of the conveyor will stop the belt for PCBs with components on them. Scrap pieces will pass underneath the sensor beam into a discard bin.

IPC Bookstore

Informational resources to enhance the work you do, help train your staff and support your company’s strategic planning efforts are waiting for you in the IPC bookstore on the show floor.

• Browse industry standards on design, board fabrication and assembly. 
• Check out IPC training and certification programs.
• Review IPC’s catalog of multimedia training resources, including DVDs, online video resources, training and reference guides, wall posters and image archives.
• Learn about IPC’s management programs, market research reports and technology roadmaps.
• Member prices will be extended to all attendees on-site, even if you aren’t one! While you’re at the bookstore, pick up a new IPC publications catalog.