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Technical Conference on Electronics Sustainability

September 28–30

This conference has been created to meet the needs of the electronics manufacturing industry in the Midwest. Today’s focus on reliable, sustainable products that meet customer needs without failure during the product’s life cycle brings new challenges to the supply chain. Sessions on advances in printed board design and fabrication focusing on HDI/microvia technology and surface finishes, the latest assembly processes and materials, end-product sustainability, and design for reliability through failure analysis will help you assure quality throughout your product’s manufacture and use.

Sign up by August 27 and take 20% off your registration. Registration will be open by June 30.

View all of the special discount packages and other registration options.

Session Descriptions
S01     Printed Board Fabrication Solutions
Tuesday, 9/28/20109:45 AM - 12:00 PM
Moderator:
How do you measure moisture content in printed boards? How difficult is it to convert a standard printed board design into an HDI printed board design? How does the concept of sculpted flex circuits provide a simple interconnect alternative between printed boards? Learn how to master advances in printed board fabrication processes in this comprehensive session.
 
Sculpted Flex Circuits as an Electronics Packaging Solution
  • Al Wasserzug, Vulcan Flex Circuit Corporation
Weigh/Bake/Weigh Testing for Moisture Content in Printed Boards
  • Joseph Kane, BAE Systems Platform Solutions
HDI Training & Implementation
  • Ron Evans, Eagle Test Systems
  • Todd Henninger, DDi Corp
S02     Minimizing Defects in Assembly Processes
Tuesday, 9/28/20101:30 PM - 4:00 PM
Moderator:
Discover ways to minimize defects in your assembly processes. Industry experts will present the latest research to help you understand critical issues that influence defect levels, including: isolating sources of head-on-pillow defects; the impact of solder voids on product reliability; and utilizing IPC stencil design rules to address fine pitch components.
 
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly
  • Mario Scalzo, Indium Corporation
To Void or Not To Void? - That Is the Question
  • Beverley Christian, Ph.D., Research In Motion Limited, Canada
  • David Hillman, Rockwell Collins
Drop Testing of a Pb-Free Board After Assembly and SnPb-Rework
  • Eva Kosiba, Celestica
S03     Product Sustainability: Managing Tin Whiskers and Product Lifecycle Analysis
Wednesday, 9/29/20108:00 AM - 12:00 PM
Moderator:
Tin whiskers are a threat to product sustainability. Session speakers will identify fundamental mechanisms causing whisker growth and provide insight into processing steps that reduce the potential for damage by whiskers.
 
Management and Mitigation of Tin Whiskers for Lead-Free Electronics
  • Samuel Platt, Delphi Electronics & Safety
Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
  • Aaron Pedigo, NSWC Crane
Using IPC 1752 v2 for attaining Product Environmental Performance data
  • Jørgen Vos, PTC
Reliability and Quality Planning in the Product Development Cycle
  • Santanu Roymoulik, PTC
S04     Tackling Lead Free Solder Alloys
Wednesday, 9/29/20101:30 PM - 4:00 PM
Moderator:
A must for anyone looking to characterize lead-free alloys and maintain reliability in their soldering processes, the session will tackle how to: enhance SAC composite solders through nano particle additions; identify degrees of tin corrosion under devices based on solder flux chemistry, solder alloy and printed board metal finish; and implement new test protocols to evaluate new lead-free alloys on the basis of their physical properties.
 
Effects of Nano-TiO2 Particles Additions on Microstructure Development and Hardness of Sn3.5Ag0.5Cu Composite Solder
  • Lung-Chuan Tsao, National Pingtung University
Tin Corrosion under QFN Packages at Elevated Temperature and Humidity
  • Karen Tellefsen, Cookson Electronics
Analytical Procedures for Portable Lead-Free Allow Test Data
  • Greg Munie, Ph.D., IPC
S05     Design for Reliability (DfR) and Failure Analysis
Thursday, 9/30/20108:00 AM - 12:00 PM
Moderator:
Turn on the news these days and see how quality recalls can detrimentally affect the confidence and loyalty customers have for a company’s product. This session will cover various failure modes, identify high risk assembly processes, and outline physics of failure (PoF) principles and other critical prevention strategies in DfR that need to be implemented to product a defect-free quality product.
 
ESD Control for the Automotive Electronics Industry
  • Gerry Pedone, Delphi Electronics & Safety
Strategies for the Prevention of Board Strain and Cracked Chips in Automotive Electronics
  • Steve Davidson, Delphi Electronics & Safety
Reliable Solder Identification by X-ray Fluorescence Spectroscopy
  • Ronald Glaser, CMG Sales/Fischer Technology, Inc.
Design for Reliability: The Next Generation
  • Randy Schueller, DfR Solutions
Die Attach Solder and Solder Alternatives
  • Brian Toleno, Ph.D., Henkel Corporation
S06     Cleaning Challenges for Electronics Assemblies
Thursday, 9/30/20101:00 PM - 4:00 PM
Moderator:
The growing complexity of electronics assemblies increases the cleaning challenges due to miniaturization, lower component gaps and improved flux designs. Ironically, the increasing use of hand-sanitizer solutions in today’s world of influenza outbreaks poses a new threat for the potential transfer of solutions/agents to electronics assemblies as contaminant material. Session experts will provide operational data for integrating aqueous cleaning equipment/agents, and discuss common methods to determine cleanliness.
 
Integrating Cleaning Equipment and Cleaning Agent for Maximum Performance
  • Mike Bixenman, D.B.A., Kyzen Corporation
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
  • Douglas Pauls, Rockwell Collins
Understanding Cleanliness and Methods of Determination
  • Joseph Russeau, Precision Analytical Laboratory, Inc.
Look out SIR! SIR Test Results and Misleading Data
  • Graham Naisbitt, Gen3 Systems Limited, UK
 
 

 

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