White Paper Simplifies Comparison of Lead-free Alloys

Changing from one lead-free solder alloy to another currently requires a lot of effort to ensure that quality and reliability goals are met. A white paper from the Solder Products Value Council will help manufacturers compare alloys.

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New IPC Group Focuses on Inexpensive Protection Technologies for Electronics Assemblies

Low pressure molding technology provides protection from harsh environments, yet it's less expensive and easier to work with than some alternatives. IPC has formed a committee that's creating a standard that should help bring this solution into the mainstream.

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Implementation of High Speed Plating for Copper Pillar Fabrication

Presentation by Lynn Michaelson, Senior Materials Scientist at Technic Inc. This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

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IPC APEX EXPO®
February 24-26, 2015 San Diego, Calif., USA

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20 August – Penang, Malaysia

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December 3-5, 2014 Shenzhen, China
 
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