IPC-Association Connecting Electronics Industries

As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains offices in Bannockburn, Ill. (headquarters); Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.

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IPC Certification Aids Differentiation Companies, graduates can quantify their knowledge and improve performance Read more IPC Opposes Canada’s Rosin Ban Ban would impact many manufacturers without improving public health, IPC told regulators Read more		Constitutive and Failure Behavior of SnAgCu Solder Joints Presentation by Dr. Ganesh Subbarayan, Purdue University View the presentation

Storage life of rigid flex Are polyimide rigid materials and pre-pregs better than FR-4 for a 20-year life in storage? Silver epoxy as part of an EMC/ESD shield Change in resistance after testing against ESD		Recovery Continues in Electronics Supply Chain Market Data Update for Autumn 2009 is now available to IPC Members. Nonmembers can subscribe here.

Connections

IPC Blog

A Brightening Outlook for Solar Standards

2/8/2010 9:56 AM by Kim Sterling

After decades of promise, the solar industry may finally be heading into a decade of relative prosperity driven by the instability of fuel pricing and the global effort to reduce greenhouse gas. The industry is also moving toward using standards in manufacturing as a way to improve efficiency and drive costs down. Solar development has gotten [...]

Materials Committees Report Cool Progress from Sunny Phoenix

2/5/2010 7:00 AM by Kim Sterling

IPC Director of PCB Programs, Standards and Technology Tom Newton reports on his January standards meetings: The 3-12a Metallic Foil Task Group met on Monday, Jan. 11. The group heavily modified a proposed optical test method as used by Gould Electronics in their German research facility. This modified document in Track Changes format is now posted [...]

Can quality and innovation coexist?

2/3/2010 2:04 PM by Terry Costlow

Improving quality is often viewed as a “mom and apple pie” issue; it’s fairly rare to hear a corporate spokesman rail against the need for quality. But quality does indeed have some detractors who say that raising quality levels can also raise costs, and a focus on quality can ripple out to stifle other aspects [...]

Tech Question of the Week

IPC guidance regarding clearance space between components when designing a printed board

2/1/2010 9:39 AM by IPC

Technical Project Manager John Perry explains the clearance information in J-STD-001, IPC-2221 and IPC-7351.

Answered by IPC Technical Projects Manager, John Perry
Originally posted 1/26/10

Have a question? Send your technical question to answers@ipc.org.

See answers to previous Tech Questions of the Week on the IPC Tech Question of the Week Blog.

IPC APEX EXPO™
April 6-8, 2010 Las Vegas, Nev.

Electronics Midwest
September 28-30, 2010 Rosemont, Ill.

2010 International Printed Circuit & Electronics Assembly Fair
December 1-3, 2010
Shenzhen, China.


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April 6-8, 2010 — Las Vegas, NV

IPC Capitol Hill Day
June 9-10, 2010 — Washington, DC

IPC Executive Market & Technology Conference: High-Reliability Electronics and the Future of American Electronics Manufacturing
June 9-10, 2010 — Washington, DC

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