Statistical Program and Surveys for Solder Manufacturers

The global Solder Statistical Program is open to IPC-member solder producers worldwide. In the quarterly reports, the data on solder consumption are segmented by region and product type, including sub-segments within each product type for lead-free and tin/lead. For lead-free solder, percentages of SAC alloys are also collected. The data are reported in kilograms for solder paste, cored wire solder and solder alloy; and in liters for solder flux. The quarterly surveys and reports are available in English and Mandarin Chinese.

The statistical programs and surveys in the table below are open to participation by solder manufacturers. Clicking on the program/survey titles will show the questions in recent surveys.

Statistical Program or Study Geographic Scope Languages of Survey and Report Frequency Open Date Due Date Report Publication Date
Solder statistical program quarterly survey (English) Global English Quarterly 1st of the month after quarter end 25th of the month after quarter end 5-6 weeks after quarter end
Solder statistical program quarterly survey (Chinese) Global Mandarin Chinese Quarterly 1st of the month after quarter end 25th of the month after quarter end 5-6 weeks after quarter end
Pulse of the Electronics Industry Global English Quarterly 1st of the month after quarter end Around the 21st of the month after quarter end 5-6 weeks after quarter end

To participate in the statistical program and obtain the survey links, please contact Piyamart Holmgren at IPC, +1 847-597-2868 or marketresearch@ipc.org.