Solder Statistical Program
The global Solder Statistical Program is open to IPC-member solder producers worldwide. In the quarterly reports, the data on shipments are segmented by region and product type, including sub-segments within each product type for lead-free and tin/lead. The data are reported in kilograms for solder paste, cored wire solder and solder alloy; and in liters for solder flux. The quarterly survey and reports are available in English and Mandarin Chinese.
Surveys open the first week after the quarter's end and are due by the 28th of that month. Reports are published as soon as all participants' data are collected, typically around 5 to 6 weeks after the quarter's end.
To see the current survey questions, please click on the following links:
To participate in the statistical program and obtain the survey links, please contact Piyamart Holmgren at IPC, +1 847-597-2868 or PiyamartHolmgren@ipc.org.