IPC International Technology Roadmap
for Electronic Interconnections
2009
Order the IPC Technology Roadmap and put its informational resources to work for your long-range and strategic planning activities. It’s like adding your own global research department to your staff … for only $75/$150.
Over the next several years, the electronic interconnect industry will experience numerous technological changes. Some of these advancements will be small and hardly noticeable; others may genuinely transform the industry. For any company in the electronics supply chain, having an understanding of these changes can mean the difference between success and failure.
Published every two years, IPC International Technology Roadmap for Electronic Interconnections has been a leading resource for identifying some of these changes since it was first introduced in 1993. Its development is the direct result of an extensive two-year study into the future technology landscape of the industry, aggregating rich informational resources from all areas of the supply chain and all corners of the world, with input from industry leaders and insight from the “brightest drivers of the field.” Produced in concert with roadmapping efforts of other industry organizations, the IPC Roadmap focuses exclusively on the printed board and electronics assembly industries, and centers on the manufacturing of substrates and assemblies.
What the IPC Roadmap can do for you:
- Gain insight into future technological advances and how the printed board and electronic manufacturing services industries will cope with expected changes in board, component and assembly technology from 2008 to 2018.
- Get details of how these changes may impact virtually every operation on the manufacturing floor.
- Enable your company to test its short- and long-term goals within a future technology landscape to help navigate the success of those goals.
- Understand how anticipated changes in packaging, nanotechnology and optoelectronics technologies will impact the work you do.
- Attain a clear sense of how global material elimination directives affect material declaration, recycling and regulatory education.
- See how the technology trends identified provide new methods for the integration of electronics into semiconductor packages and focus on electrical performance and miniaturization.
- Compare aspects of your company’s products to the technology drivers of tomorrow using an exclusive software analysis program developed by the National Institute of Standards and Technology (NIST).
- Get a sneak peek into new unique interconnections and assembly potential through dedicated chapters that introduce revolutionary applications still in the embryonic stage.
Guidance from Product Emulators
The foundation of the IPC Roadmap is its “product emulators” — used to depict OEM needs. Emulators reflect a specific product type as represented by a specific board assembly or piece of equipment. Created with valuable input from several OEMs and experts, the emulators embrace more than one technology philosophy and provide important information for future process and equipment development.
Used in the IPC Roadmap process since 1995, the emulator concept has been successful in reflecting advances in technology in four time periods (current, near-term, mid-term, and long-term) and the dynamic face of the marketplace.
Product emulators for the 2009 IPC Roadmap are:
E1 — Electronic Games (portable)
E2 — Consumer Products (under $500)
E3 — Hand-held/Wireless Electronics
E4 — Mid Range Performance Electronics
E5 — High Performance Systems (mainframe/server/mass storage)
E6 — RF and Microwave Electronics (10 MHz)
E7 — Harsh Environments/Aerospace
E8 — Harsh Environments/Auto Electronics
View the Table of Contents
Four Roadmap presentations made at IPC APEX EXPO are available for free download (.zip):
- Roadmap introduction
- Verification projections
- Future Emulators (View in Slide Show mode to hear audio)
- Unique Interconnection Methods
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