| AA | Antenna Array |
| AA | Automatic Acknowledge |
| ABS | Acrylonitrile-Butadiene-Styrene(Plastic) |
| AC | All Call |
| AC | Alternating Current |
| ACA | Anisotropically Conductive Adhesive |
| ACC | Advanced Concept Construction Active Control Channel |
| ACCU | Alternating Current Connection Unit |
| AEC | Architecture, Engineering And Construction |
| Agc | Automatic Gain Control |
| AGR | Annual Average Growth Rate |
| AGV | Automated Guided Vehicle |
| AI | Artificial Intelligence |
| AIS | Adhesive Interconnect System |
| ANOVA | Analysis Of Variance |
| ANSI | American National Standards Institute |
| AOI | Automated Optical Inspection |
| AOQ | Average Outgoing Quality |
| APT | Automatically Programmed Tools |
| AQL | Acceptable Quality Level |
| ARINC | Aeronautical Radio Incorporated |
| ASCII | American Standard Code For Information Interchange |
| ASIC | Application Specific Integrated Circuit |
| ASME | American Society Of Mechanical Engineers |
| ASPaRC | Ability Of Solder Paste To Retain Components |
| ASQ | American Society For Quality |
| ASTM | American Society For Testing And Materials |
| ATE | Automatic Test Equipment |
| ATG | Automatic Test Generation |
| ATR | Air Transport Rack |
| AVT | Accelerated Vesication Test |
| AWG | American Wire Gauge |
| AXI | Automated X-Ray Inspection |
| BC | Buried Capacitance |
| BDMA | Benzyldimethylamine |
| BGA | Ball Grid Array |
| BITE | Built-In Test Equipment |
| BOD | Biochemical Oxygen Demand |
| BOM | Bill Of Material |
| BOT | Build To Order |
| BT | Bismaleimide Triazine |
| BTAB | Bumped Tape-Automated Bonding |
| C&E | Cause And Effect |
| C3 | Command,Control And Communicate |
| C4 | Controlled Collapse Component Connection |
| CAD | Computer-Aided Design |
| CAE | Computer-Aided Engineering |
| CAF | Cathotic Anionic Filaments |
| CAFM | Computer-Aided Facilities Management |
| CAGE | Commercial And Government Entity |
| CALS | Computer-Aided Acquisition And Logistic Support(DOD) |
| CAM | Computer-Aided Manufacturing |
| CAPP | Computer-Aided Process Planning |
| CAR | Computer-Aided Repair |
| CASE | Computer-Aided Software Engineering |
| CAT | Computer-Aided Testing |
| CBGA | Ceramic Ball Grid Array |
| CCAPS | Circuit Card Assembly And Processing System |
| CDA | Copper Development Association |
| CEPM | Certified Ems Program Managers |
| CET | Certified Electronic Technician |
| CFM | Continuous Flow Manufacturing |
| CFM | Cubic Feet Per Minute |
| CIM | Computer-Integrated Manufacturing |
| CISC | Complex Instruction Set Computing |
| CITIS | Contractor Integrated Technical Information Services |
| CM | Contract Manufacturer |
| CMC | Copper Moly Copper |
| CMOS | Complimentary Metal-Oxide Semiconductor |
| CNC | Computer Numerical Control |
| COB | Chip-On-Board |
| COD | Consumed Oxygen Demand |
| COT | Configure To Order |
| Cp | Capability Performance |
| CPL | Capability Performance, Lower |
| CPLD | Complex Programmable Logic Device |
| CPU | Capability Performance, Upper |
| CPU | Central Processing Unit(Computer) |
| CRC | Cyclic Redundancy Check |
| CRT | Cathode-Ray Tube |
| CSA | Canadian Standards Agency |
| CSG | Constructive Solids Geometry |
| CSP | Chip Scale Package |
| CTE | Coefficient Of Thermal Expansion |
| CVS | Cyclic Voltammetry Stripping |
| DAB | Designated Audit Body |
| DATC | Design Automation Technical Committee (Ieee) |
| DBMS | Database Management System |
| DC | Direct Current |
| DCAS | Defense Contract Administration Service |
| DCMA | Defense Contract Management Agency |
| DCMC | Defense Contract Management Command |
| DESC | Defense Electronics Supply Center |
| DFM | Design For Manufacture |
| DIM | Data-Information Record |
| DIN | Deutsches Institute For Normung |
| DIP | Dual-Inline Package |
| Dk | Dielectric Constant |
| DLA | Defense Logistics Agency (Dod) |
| DMA | Direct Memory Access |
| DMS | Dynamic Mechanical Spectroscopy |
| DMSA | Defense Manufacturers And Suppliers Association |
| DNC | Distributed (Or Direct) Numerical Control |
| DOD | Department Of Defense |
| DOD | Dissolved Oxygen Demand |
| DOE | Design Of Experiments |
| DOS | Disc Operating System |
| DRC | Design Rule Checking |
| DRM | Drawing Requirements Manual |
| DS | Double-Sided |
| DSC | Differential Scanning Calorimetry |
| DSP | Digital Signal Processor |
| DTP | Diameter True Position |
| DTS | Dock To Stock |
| DVM | Digital Voltmeter |
| DXF | Data Exchange Format |
| ECAD | Electronic Computer-Aided Design |
| ECC | Error Correction Code |
| ECCB | Electronic Components Certification Board |
| ECL | Emitter-Coupled Logic |
| ECM | Electronic Countermeasures |
| ECN | Engineering Change Notice |
| ECO | Engineering Change Order |
| ECR | Engineering Change Request |
| ED | Electrodeposited |
| EDA | Electronic Design Automation |
| EDI | Electronic Data Interchange |
| EDIF | Electronic Design Interchange Format |
| EDM | Electro-Discharge Machining |
| EDO | Extended Data Out |
| EIA | Electronics Industry Association |
| EIS | Engineering Information System |
| ELD | Electro-Luminescent Diode |
| EMC | Electromagnetic Compatibility |
| EMF | Electro-Motive Force |
| EMI | Electromagnetic Interference |
| EMP | Electromagnetic Pulse |
| EMPF | Electronics Manufacturing Productivity Facility |
| EMS | Electrical Manufacturing Services |
| EPA | Environmental Protection Agency |
| EPR | Ethylene-Propylene (Copolymer) Resin |
| EPT | Ethylene-Propylene Terepolymer |
| ESD | Electrostatic Discharge |
| ESI | Early Supplier Involvement |
| ESR | Equivalent Series Resistance |
| ETPC | Electrolytic Tough-Pitch Copper |
| FAA | Federal Aviation Administration |
| FAR | Failure Analysis Report |
| FCC | Federal Communications Commission |
| FCC | Flat-Conductor Cable |
| FC-CBGA | Flip Chip Ceramic Ball Grid Array |
| FC-PBGA | Flip Chip Platic Ball Grid Array |
| FCT | Functional Circuit Test |
| FEA | Finite-Element Analysis |
| FEM | Finite-Element Modeling |
| FEP | Fluorinated Ethylene-Propylene (Teflon) |
| FET | Field-Effect Transistor |
| FFT | Fast Fourier Transform |
| FMEA | Fault Mode And Effect Analysis |
| FPGA | Field Programmable Gate Array |
| FPT | Fine-Pitch Technology |
| FSCM | Federal Stock Code For Manufacturers |
| FTP | File Transfer Protocol |
| GaAs | Gallium Arsenide |
| GBIB | General Purpose Interface Bus |
| GMA | Gas Metal Arc (Welding) |
| GTA | Gas Tungsten Arc (Welding) |
| GTPBGA | Glob Top Plastic Ball Grid Array |
| HASL | Hot Air Solder Level |
| HPGL | Hewlett Packard Graphic Language |
| HTE | High Temperature Elongation |
| HTML | Hypertext Markup Language |
| HTTP | Hypertext Transfer Protocol |
| I/O | Input/Output (Terminations) |
| IC | Integrated Circuit |
| ICA | Isotropically Conductive Adhesive |
| ICAM | Integrated Computer-Aided Manufacturing |
| ICT | Inner Circuit Test |
| IDC | Insulation-Displacement Connection |
| IEC | International Electrotechnical Commission |
| IECQ | International Electronic Component Qualification System |
| IEDR | Initial Engineering Design Review |
| IEEE | Institute Of Electrical And Electronic Engineers |
| IEPS | International Electronic Packaging Society |
| IGES | Integrated Graphics Exchange System |
| ILB | Inner-Lead Bonding (Tab) |
| IP | Internet Protocol |
| IPM | Inches Per Minute |
| IR | Infrared |
| ISCET | International Society Of Certified Electronics Technician |
| ISHM | International Society For Hybrid Microelectronics |
| ISO | International Organization For Standardization |
| ITT | Inter-Test Time |
| JEDEC | Solid State Technology Association (Formerly The Joint Electronic Device Engineering Council) |
| JIT | Just-In-Time (Manufacturing) |
| KGB | Known Good Board |
| KGD | Known Good Die |
| LAN | Local Area Network |
| LBA | Logical Block Address |
| LCCC | Leadless Ceramic Chip Carrier |
| LCD | Liquid Crystal Display |
| LDA | Logic Design Automation |
| LED | Light-Emitting Diode |
| LGA | Lang Grid Array |
| LIF | Low Insertion Force |
| LMC | Least Material Condition |
| LPISM | Liquid Photo-Imageable Solder Mask |
| LRU | Lowest Replaceable Unit |
| LSI | Large Scale Integration (Integrated Circuit) |
| LTCC | Low Temperature Co-Fired Ceramic |
| MA | Mechanical Advantage |
| MAC | Maximum Allowable Concentration |
| MAC | Media Access Control |
| MAP | Manufacturing Automation Protocol |
| MATS | Material Transport Segment |
| MCAD | Mechanical Computer Aided Design |
| MCAE | Mechanical Computer-Aided Engineering |
| MCM | Multichip Module |
| MDA | Methylenedianiline |
| MEK | Methyl-Ethyl Ketone |
| MELF | Metal Electrode Face (Discrete Leadless Component) |
| MIBK | Methyl-Isobutyl Ketone |
| MIR | Moisture Insulation Resistance |
| MITI | Ministry Of International Trade And Industry (Japan) |
| MLB | Multilayer Board |
| MLPWB | Multilayer Printed Wiring Board |
| MMC | Maximum Material Condition |
| MMIC | Monolithic Microwave Integrated Circuit |
| MOS | Metal-Oxide Semiconductor |
| MRP | Material Requirement Planning |
| MRP II | Manufacturing Resource Planning |
| MSDS | Material Safety Data Sheets |
| MSI | Medium Scale Integration (Integrated Circuit) |
| MTBF | Mean Time Between Failures |
| MTTR | Mean Time To Repair |
| NADCAP | National Aerospace And Defense Contractors Accreditation Procedures |
| NASA | National Aeronautics And Space Administration |
| NBR | Nitrile Butadiene-Acrylonitrile Rubber |
| NBS | National Bureau Of Standards |
| NC | Numerical Control |
| NDT | Non-Destructive Testing |
| NECQ | National Electronics Component Qualification System |
| NEMA | National Electrical Manufacturers Association |
| NIST | National Institute For Science And Technology |
| NMR | Normal-Mode Rejection |
| NPI | New Product Introduction |
| NSA | National Security Agency |
| OA | Organic Acid (Flux) |
| ODR | Oscillating Disk Rheometer |
| OEM | Original Equipment Manufacturer |
| OFHC | Oxygen-Free High-Conductivity Copper |
| OLB | Outer-Lead Bonding (Tab) |
| OSHA | Occupational Safety Hazards Act |
| OSI | Open Systems Interconnection |
| OSP | Organic Solder Preservative |
| P&IA | Packaging And Interconnecting Assembly |
| P&IS | Packaging And Interconnecting Structure |
| PBGA | Plastic Ball Grid Array |
| PB | Printed Board |
| PBX | Private Branch Exchange |
| PC | Personal Computer |
| PCA | Printed Circuit Assembly |
| PCB | Printed Circuit Board |
| PCMCIA | Personal Computer Memory Card International Assoc |
| PDES | Product Data Exchange Specification |
| PDL | Page Description Language |
| PEM | Plastic Electronic Module |
| PGA | Pin Grid Array (Leaded Component Package) |
| PHIGS | Programmer's Hierarchical Interface Graphics Standard |
| PID | Photo-Imageable Dielectric |
| PIP | Pin-In-Paste Technology |
| PLCC | Plastic Leaded Chip Carrier |
| PLD | Programmable Logic Device |
| Pp | Process Performance (See Also Cp) |
| PPM | Parts Per Million |
| PPO | Polyphenylene Oxide |
| PPS | Polyphenylene Sulfide (Plastic) |
| PRT | Planar Resistor Technology |
| PSI | Pounds Per Square Inch |
| PT | Positional Tolerance |
| PTFE | Polytetrafluoroethylene (Teflon) |
| PTH | Plated-Through Hole |
| PVC | Polyvinyl Chloride |
| PVT | Production Validation Test |
| PWA | Printed Wiring Assembly |
| PWB | Printed Wiring Board |
| QFP | Quad Flatpack |
| QML | Qualified Manufacturers List |
| QPL | Qualified Products List |
| QTA | Quick Turn Around |
| R | Rosin (Flux) |
| R&R | Repeatability And Reproducibility |
| RA | Rosin Activated (Flux) |
| RAM | Random Access Memory |
| RETMA | Radio Electronics & Television Manufacturers Association |
| RFI | Radio-Frequency Interference |
| RFP | Request For Proposal |
| RFQ | Request For Quote |
| RFS | Regardless Of Feature Size |
| RISC | Reduced Instruction Set Computing |
| RMA | Rosin Mildy Activated (Flux) |
| RMS | Root Mean Square |
| ROM | Read Only Memory |
| ROM | Rough Order Of Magnitude |
| RPM | Revolutions Per Minute |
| RSS | Ramp Soak Spike |
| RTS | Ramp To Spike |
| RTV | Room Temperature Vulcanizing |
| RwoH | Reliability Without Hermeticity |
| SAE | Society Of Automotive Engineers |
| SBU | Sequential Buildup |
| SEC | Solvent Extract Conductivity |
| SEM | Scanning Electron Microscope |
| SEM | Standard Electronic Module (Navy) |
| SERA | Sequential Electrochemical Reduction Analysis |
| SFM | Surface Feet Per Minute |
| SIP | Single Inline Package |
| SIR | Surface Insulation Resistance |
| SMD | Surface Mount Device |
| SMEMA | Surface Mount Equipment Manufacturers Association |
| SMOBC | Solder Mask Over Bare Copper |
| SMT | Surface Mounting Technology |
| SMTA | Surface Mount Technology Association |
| SNA | Systems Network Architecture |
| SOIC | Small-Outline Integrated Circuit |
| SOS | Silicon-On-Sapphire |
| SPC | Statistical Process Control |
| SPICE | Simulation Program, Integrated Circuit Emphasis |
| SQC | Statistical Quality Control |
| SQL | Structured Query Language |
| SSI | Small-Scale Integration (Integrated Circuit) |
| STEP | Standard For Exchange Of Product Model Data |
| TAB | Tape-Automated Bonding |
| TCE | Thermal Coefficient Of Expansion |
| TCP/IP | Transmission Control Protocol / Internet Protocol |
| TCR | Temperature Coefficient Of Resistance |
| TDR | Time-Domain Reflectometry |
| TEM | Transverse Electromagnetic Mode |
| TFA | Tree-Based Floorplanning Algorithm |
| TFE | Tetrafluoroethylene (Teflon) |
| Tg | Glass Transition Temperature |
| TGA | Thermo Gravimetric Analysis |
| THT | Through-Hole Technology |
| TIFF | Tagged Image File Format |
| TMA | Thermo Mechanical Analysis |
| TO | Transistor Outline |
| TOP | Technical And Office Protocol |
| TP | True Position |
| TQM | Total Quality Management |
| T's & C's | Terms And Conditions |
| TTL | Transistor-Transistor Logic |
| UBM | Under Bump Metallization |
| UHF | Ultra-High Frequency |
| UL | Underwriter's Laboratories |
| ULSI | Ultra-Large Scale Integration (Integrated Circuit) |
| UPH | Unit Per Hour |
| URL | Uniform Resource Locator |
| VAR | Value-Added Reseller |
| VHDL | Vhsic Hardware Description Language |
| VHF | Very-High Frequency |
| VHSIC | Very-High Speed Integrated Circuits |
| VLSI | Very-Large Scale Integration (Integrated Circuit) |
| VME | Versa-Module Electronic |
| VOC | Volatile Organic Compound |
| VSAG | VHDL Standardization And Analysis Group (IEEE) |
| WIP | Work In Process |
| WSI | Wafer-Scale Integration |
| WWW | World Wide Web |
| WYSIWYG | What You See Is What You Get |
| XIP | Execute In Place |
| ZAF | Z-Axis Adhesive Film |
| ZIF | Zero-Insertion Force |
| ZIP | Zigzag Inline Package |
