IPC Thermal Excursion Simulator List

IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation, defines the procedure for simulating exposure to the thermal conditions of convection reflow assembly.

The test method requires the usage of a thermal excursion simulator capable of meeting the reflow profiles described in the method.

The following vendors provide equipment capable of meeting the reflow profiles within this test method.  This list is non-comprehensive and is not guaranteed by IPC to be fully accurate, nor are any of the vendors listed endorsed by IPC or members of the IPC D-32 Thermal Stress Test Method Subcommittee.  This list is dynamic and IPC recognizes that other capable equipment providers may exist and will be included as IPC is notified.

Vendor Model Website
APS Novastar GF-12HT www.apsgold.com
Manncorp CR-4000 www.manncorp.com
Essemtec RO300FC www.essemtec-usa.com
ATCO PRO 1600-RS www.atco-us.com
Conductor Analysis Technologies, Inc. OM System www.cat-test.info

If you are familiar with another equipment provider whose simulator meets the requirements of IPC-TM-650, Method 2.6.27, IPC encourages your input.  Please provide your name, e-mail address, and company name when providing a written e-mail to JohnPerry@ipc.org.

The following IPC member facilities also provide service for the procedures within this test method:

Company Website Phone Fax
Microtek Laboratories www.thetestlab.com +1 714-999-1616 +1 714-999-1636
Trace Laboratories - East www.tracelabs.com +1 410-584-9099 +1 410-584-9117
Robisan Laboratory Inc. www.robisan.com +1 317-353-6249 +1 317-917-2379
Conductor Analysis Technologies, Inc. www.cat-test.info +1 505-797-0100 N/A
Knowledge

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