IPC Releases 2019 Quality Benchmark Study for Electronics Assembly

August 8, 2019 — IPC's Study of Quality Benchmarks for Electronics Assembly 2019 is now available. This global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.

The quality control measurements covered by the study include first-pass and final yields, internal yields of key processes, defect rates, and DPMO and yield targets, as well as the average cost of poor quality as percentages of sales for rework and scrap, and percentages of OEMs that accept reworked boards. The study also reports on the use of various tests and quality control methods.

Customer satisfaction and supplier performance measurements are covered in the study, including rates of customer returns and returns due to product failure, and rates of on-time delivery. The industry's adoption of major quality certifications is also reported.

The data — in averages, medians and percentiles — are segmented by company size tier, by region, and by type of production including rigid PCBs, flexible circuits, finished end products, mechanical assembly, cable and harness, and discrete wiring terminal and connectors. The aggregate data represent 57 electronics assembly companies of all sizes — both OEMs and contract electronics manufacturers (EMS companies) — worldwide.

The 148-page report is available for sale to IPC members for $675 and to nonmembers for $1,350. For more information or to purchase the report, visit the IPC Online Store or contact IPC's market research department at marketresearch@ipc.org. For information on other IPC market research programs, visit www.ipc.org/IndustryData.

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