IPC-A-610E-NL Released: Industry Requirements for Acceptability of Electronic Assemblies Updated in Dutch
BANNOCKBURN, Ill., USA, November 13, 2012 — IPC — Association Connecting Electronics Industries® has released the Dutch language E revision of IPC-A-610, Acceptatie van Geassembleerde Printplaten. IPC’s most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
The photos and drawings that show good and bad connections, considered one of the most important features of IPC-A-610, have also been upgraded. The E revision contains 165 new or updated illustrations, bringing the total to more than 800.
In addition, the standard has been revamped for ease of use and clarity. Sections have been reorganized so data and images are easier to find and to make it easier to use. The many changes that have occurred in array packaging since the standard’s last revision are also addressed in the E revision, as are changes to hot tear and filet lifting.
There are new sections on depanelization, board in board, package on package, and flex attachment, which Jack Crawford, IPC director of certification, calls “high interest topics.”
Designers and manufacturers will appreciate criteria for package-on-package technologies, often used to boost solid-state memory capacity, and for board-in-board connections, where daughter boards can be mounted perpendicular to the assembly using a through-the-board method.
For more information or to purchase IPC-A-610E-NL, Acceptatie van Geassembleerde Printplaten, visit www.ipc.org/610-NL. The hard copy price for IPC members is $55 and the industry price is $110. Additional formats of IPC-A-610E-NL are also available.
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IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
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