High-Reliability Applications and Balancing Signal Integrity Against Manufacturability Highlight Design-Focused Activities at IPC APEX EXPO 2013
BANNOCKBURN, Ill., USA, November 7, 2012 — With expertise on the latest design technologies, techniques and roadmapping efforts, the IPC Designers Forum, design-focused courses and Designer Certification sessions will be held at IPC APEX EXPO®, February 15-18, 2013, at the San Diego Convention Center. Thought leaders in design from L-3 Avionics Systems, Plexus, Gentex and other leading companies will share insights on design challenges and processes for the next generation of electronics.
For engineering staff and managers in design, sales, purchasing and quality, the IPC Designers Forum on February 18 is a full-day educational and technical exchange program focused on critical design issues. Dieter Bergman, IPC, will kick off the Forum with a discussion on roadmapping efforts in the area of design.
Other subject matter experts presenting at the Designers Forum include: Edward Acheson, Cadence Design Systems Inc., who will discuss efficient design data transfer to manufacturing using IPC-2581; Daniel DiTuro, DiTuro Consulting, will cover design for high-reliability applications; Happy Holden, Gentex Corporation, will review the increasing complexity of PCB designs; Vern Solberg, Solberg Technical Consulting, will tackle embedded circuits; and Rick Hartley, L-3 Avionics Systems, will cover professional design technology and techniques. Mark Finstad, Flexible Circuit Technologies and Mark Verbrugge, Pica Manufacturing Solutions, will host the popular “Ask the Flexperts” session.
In addition to the Designers Forum, several professional development courses on February 17-18 focus on helping designers address design challenges. Courses include:
||Extreme HDI: Designing for Maximum Density
||Flexible and Rigid-Flex Circuits: Ask the Flexperts
||Space Hardware and Other High-Reliability Applications
||Signal Integrity in Very High Speed Circuits
||Designing PCB Stackups to Balance Signal Integrity Against Manufacturability
||Designing Complex Boards
For designers who want to earn the professional credential that demonstrates organizational and personal excellence to customers and suppliers, basic and advanced-level (CID and CID+) IPC designer certification workshops and exams will take place on February 15-17. Registration is available at www.IPCAPEXEXPO.org/certification.
To view design-focused activities at IPC APEX EXPO, visit www.IPCAPEXEXPO.org/design.
Access to the exhibit hall is free to pre-registrants, a savings of $25 on-site. Individuals who register by January 25 will save 20 percent off registration fees (discount does not apply to designer certification). A new registration option for 2013, the Maximum Value Package (MVP) which includes access to the Designers Forum and professional development courses, offers a savings of more than 75 percent over individual item prices. For more information or to view all registration options for IPC APEX EXPO, visit www.IPCAPEXEXPO.org/registration-options.
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IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
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