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SECTION 2.5 - ELECTRICAL TEST METHODS

2.5.1B Arc Resistance of Printed Wiring Materials--5/86
2.5.2A Capacitance of Insulating Materials--7/75
2.5.3B Current Breakdown, Plated Through Holes--8/97
2.5.4 Current Carrying Capacity, Multilayer Printed Wring--4/73
2.5.4.1A Conductor Temperature Rise Due to Current Changes in Conductors--8/97
2.5.5A Dielectric Constant of Printed Wiring Materials--7/75
2.5.5.1B Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 1MHz (Contacting Electrode Systems)--5/86
2.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method--12/87
2.5.5.3C Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)--12/87
2.5.5.4 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method--10/85
2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band--3/98
2.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ--3/98
2.5.5.6 Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates--5/89
2.5.5.7a Characteristic Impedance Lines on Printed Boards by TDR--3/04
2.5.5.8 Low Frequency Dielectric Constant and Loss Tangent, Polymer Films--7/95
2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98
2.5.5.10 High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials--7/05
2.5.5.11 Propagation Delay of Lines on Printed Boards by TDR--4/09
2.5.5.12 Test Methods to Determine the Amount of Signal Loss on Printed Boards (PBs)--5/09
2.5.5.13 Relative Permittivity and Loss Tangent Using a Split-Cylinder Resonator--1/07
2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material--5/86
2.5.6.1B Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings--3/07
2.5.6.2A Electric Strength of Printed Wiring Material--8/97
2.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength--10/86
2.5.7D Dielectric Withstanding Voltage, PWB--5/04
2.5.7.1 Dielectric Withstanding Voltage - Polymeric Conformal Coating - 7/00
2.5.7.2A Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Boards - 11/09
2.5.8A Dissipation Factor of Flexible Printed Wiring Material--7/75
2.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds--11/98
2.5.12 Interconnection Resistance, Multilayer Printed Wiring--4/73
2.5.13A Resistance of Copper Foil--3/76
2.5.14A Resistivity of Copper Foil--8/76
2.5.15A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86
2.5.16A Shorts, Internal on Multilayer Printed Wiring--11/88
2.5.17E Volume Resistivity and Surface Resistance of Printed Wiring Materials--5/98
2.5.17.1A Volume and Surface Resistivity of Dielectric Materials--12/94
2.5.17.2 Volume Resistivity of Conductive Resistance Used in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method--11/98
2.5.18B Characteristic Impedance Flat Cables (Unbalanced)--7/84
2.5.19A Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84
2.5.19.1A Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)--7/84
2.5.21A Digital Unbalanced Crosstalk, Flat Cable--3/84
2.5.24 Conductor Resistance, Flexible Flat Cable--6/79
2.5.25A Dielectric Withstand Voltage Flexible Fat Cable--11/85
2.5.26A Insulation Resistance Flexible Flat Cable--11/85
2.5.27 Surface Insulation Resistance of Raw Printed Wiring Board Material--3/79
2.5.28A Q Resonance, Flexible Printed Wiring Materials--4/88
2.5.30 Balanced and Unbalanced Cable Attenuation Measurements--12/87
2.5.31 Current Leakage (Through Overglaze Films)--12/87
2.5.32 Resistance Test, Plated Through-Holes--12/87
2.5.33 Measurement of Electrical Overstress from Soldering Hand Tools--11/98
2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools (Ground Measurements)--11/98
2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools (Transient Measurements)--11/98
2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools (Current Leakage Measurements)--11/98
2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools (Shielded Enclosure)--11/98
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