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SECTION 2.3 - CHEMICAL TEST METHODS

2.3.1 Chemical Processing, Suitable Processing Material- 4/73
2.3.1.1B Chemical Cleaning of Metal Clad Laminates- 5/86
2.3.2G Chemical Resistance Of Flexible Printed Wiring Materials - 12/07
2.3.3A Chemical Resistance of Insulating Materials- 2/78
2.3.4B Chemical Resistance, Marking Paints and Inks - 8/97
2.3.4.2A Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent Exposure - 12/94
2.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride- 5/86
2.3.6A Etching, Ammonium Persulfate Method - 7/75
2.3.7A Etching, Ferric Chloride Method - 7/75
2.3.7.1A Cupric Chloride Etching Method - 12/94
2.3.7.2A Alkaline Etching Method - 12/94
2.3.8A Flammability, Flexible Insulating Materials- 12/82
2.3.8.1 Flammability of Flexible Printed Wiring- 12/88
2.3.9D Flammability of Prepreg and Thin Laminate - 8/97
2.3.10B Flammability of Laminate - 12/94
2.3.10.1 Flammability of Soldermask on Printed Wiring Laminate- 8/98
2.3.11 Glass Fabric Construction- 4/73
2.3.13A Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods- 6/04
2.3.14 Print, Etch, and Plate Test- 4/73
2.3.15D Purity, Copper Foil or Plating - 5/04
2.3.16B Resin Content of Prepreg, by Burn-off - 12/94
2.3.16.1C Resin Content of Prepeg, by Treated Weight--12/94
2.3.16.2 Treated Weight of Prepreg - 12/94
2.3.17D Resin Flow Percent of Prepreg - 8/97
2.3.17.1B Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98
2.3.17.2B Resin Flow of "No Flow" Prepreg - 8/97
2.3.18A Gel Time, Prepreg Materials - 4/86
2.3.19C Volatile Content of Prepreg - 12/94
2.3.21 Plating Quality, Hull Cell Method - 8/97
2.3.22 Copper Protective Coating Quality - 2-78
2.3.23B Cure (Permanency) Thermally Cured Solder Mask - 2/88
2.3.23.1A Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88
2.3.24 Porosity of Gold Plating- 2/78
2.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85
2.3.24.2A Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) - 8/97
2.3.25D Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract (ROSE) - 11/12
2.3.25.1 Ionic Cleanliness Testing of Bare PWBs -10/00
2.3.26A Superseded by Test Method 2.3.25
2.3.26.1 Superseded by Test Method 2.3.25
2.3.27 Cleanliness Test - Residual Rosin - 1/95
2.3.27.1 Rosin Flux Residue Analysis-HPLC Method - 1/95
2.3.28B Ionic Analysis of Circuit Boards, Ion Chromatography Method – 11/12
2.3.28.1 Halide Content of Soldering Fluxes and Pastes - 6/04
2.3.28.2 Bare Printed Board Cleanliness by Ion Chromatography – 12/09
2.3.29 Flammability, Flexible Flat Cable- 11/88
2.3.30A Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81
2.3.31 Relative Degree of Cure of U.V. Curable Material - 2/88
2.3.32D Flux Induced Corrosion (Copper Mirror Method)- 6/04
2.3.33D Presence of Halides in Flux, Silver Chromate Method - 6/04
2.3.34C Solids Content, Flux - 6/04
2.3.34.1B Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95
2.3.35C Halide Content, Quantitative (Chloride and Bromide)- 6/04
2.3.35.1A Fluorides by Spot Test, Fluxes - Qualitative - 6/04
2.3.35.2A Flouride Concentration, Fluxes - Quantitative--6/04
2.3.36 Acid Acceptance of Chlorinated Solvents- 10/85
2.3.37B Volatile Content of Adhesive Coated Dielectric Films - 5/98
2.3.38C Surface Organic Contaminant Detection Test - 5/04
2.3.39C Surface Organic Contaminant Identification Test (Infrared Analytical Method) - 5/04
2.3.40 Thermal Stability - 7/95
2.3.41 Test Method for Total Halogen Content in Base Materials – 4/06
2.3.42 Solder Mask - Resistance to Solvents and Cleaning Agents – 3/07
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