2007 - 2016

2007-2016 Highlights

  • IPC celebrates golden anniversary, 50 years of service to industry
  • IPC launches IPCWorks Asia and IPC Midwest Conference & Exhibition.
  • IPC China office moves to new location in Shanghai, expanding access to more of IPC’s programs.
  • IPC establishes the IPC OEM Critical Components Council Steering Committee, comprising representatives from Dell, IBM, Lenovo, Hewlett Packard, Cisco Systems, Alcatel-Lucent and

2007

IPC 50th AnniversaryIPC celebrates its 50th Anniversary

  • More to come! Stay with us for the next 50 years!

2008

  • The Electronic Components Association (ECA), IPC and JEDEC join forces to develop IPC-J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes, addressing problems that arose from the adoption of lead-free solder.

  • IPC launches its online Presentation Library, complete with live audio recordings and PowerPoint® visuals from selected conferences and meetings and made these audio/slide presentations available to members only on the IPC Web site.

  • IPC, along with several other associations sign a letter urging state agencies to adopt final definition of solid waste (DSW) rule. A win-win situation for industry and the environment, the DSW rule excludes secondary materials from the Resource Conservation and Recovery Act (RCRA) hazardous waste regulations if the materials are recycled according to specific conditions set forth in the rule. This exemption will allow listed hazardous wastes, under RCRA, to be recycled instead of disposed of in a landfill.

 
 
 
 

2009

  •  IPC delivers EMS program manager courses for first time in Chinese.

  • IPC China forms management councils that mirror its North American counterparts: Solder Products Value Council, electronics manufacturing services, original equipment manufacturers, and surface mount equipment manufacturers.

  • Yury Kovalevsky, IPC’s Russian representative, comes on board. Among his responsibilities, Yury facilitates the translation of IPC standards into Russian, supports standards development activities in the region and serves as liaison to member companies. He also organizes seminars and events and supports existing training, certification activities and distributors in the region.

  • IPC urges the Department of Defense (DoD) to speed up the appointment of a (PCB) Executive Agent, as mandated in the FY 2009 National Defense Authorization Act. Over halfway into the year, the Navy is designated as the Executive Agent (EA) with a responsibility to oversee the development and implementation of a PCB and interconnect technology roadmap for DoD. IPC continues to urge DoD and Congress to fund the PCB EA program.

 
 
 
 

2010

  • IPC releases IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake. The document covers all phases of production, from the manufacture of the bare printed board, through delivery, receiving, stocking, and soldering.

  • IPC's Solder Products Value Council (SPVC) and EHS Steering Committee record a victory when they successfully persuaded Canada not to restrict five rosin-containing substances from all products manufactured or sold in the country under the Chemicals Management Plan. Rosin is a key ingredient in solder.

  • IPC's first hand-soldering championship was successfully launched at the HKPCA/IPC show with 44 contestants participating in the competition.

  • IPC opens an office in Beijing to provide additional support for companies in North China. The Beijing office staff supports government relations programs in Beijing and works with industry members regarding use and implementation of IPC standards.

  • To provide more training and association services to the Indian electronics manufacturing industry, IPC opens its first office in South Bangalore, India not too far from the well-known Electronics City.
 
 
 
 

2011

  • IPC standards collaboration took a major step forward with the introduction of KAVI Workspace, an online collaboration system for standards development committees.

  • IPC tirelessly advocates for the specific articulation of PCB designs on the USML. IPC strategically raises the profile of this issue through outreach to Capitol Hill and key officials at the Departments of State, Defense and Commerce. In response to proposed revisions to the USML Category VIII, (aircraft), IPC's comments to the State Department emphasize that printed board designs for Category VIII equipment contain significant amounts of information in PCB design data.

  • IPC releases IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. It represents an important step in standardizing an increasingly popular component type.

  • After 12 years as the president and CEO of IPC, Denny McGuirk resigns to accept a new position as president and CEO of SEMI.

 

 
 
 
 

2012

  • When does a technology become mature enough to be ready for standardization?  In the case of printed electronics, 2012 was that year. IPC releases, IPC-4921, Requirements for Printed Electronics Base Materials, which covers requirements for base materials used in printed electronics. Whether base materials are plastic, paper, glass or ceramic, IPC-4921 defines material characteristics used for substrates.

  • IPC's market research department continues to expand and enhance the wealth of data available to IPC members, which aid in business decision-making, planning and forecasting. IPC expands participation in its statistical programs for the North American PCB and EMS industries, and for the global EMS, assembly equipment, solder, laminate and process consumables industries and publishes seven major market studies.

  • The U.S. Securities and Exchange Commission (SEC) issue a final rule implementing Section 1502 of the Dodd-Frank Act requiring publicly traded companies to provide extensive reports to the SEC if their products contain "conflict minerals" from the Democratic Republic of the Congo (DRC). IPC focuses on educating its members about the requirements and helping develop standards and other tools to aid compliance.

  • In April, John Mitchell is appointed president and CEO; In October, Raymond Foo joins IPC as Southeast Asia Representative; In October, Sanjay Huprikar is hired as vice president of member success; In December, Philip S. Carmichael is named president of IPC China.

  • IPC China celebrates 10 years of service to the electronics manufacturing industry.

 

 
 
 
 

2013

  • For the electronics assembly industry, IPC pushes the envelope and expands its presence into final assemblies with its first box build standard. IPC-A-630, Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures. The standard provides guidance for component application engineers on materials and processes used in top-level assembly builds.

  • The design community experiences two significant IPC accomplishments in 2013. The Certified Interconnect Designer (CID) program is renewed to be in sync with IPC’s best-selling design standard, IPC-2221B, Generic Standard on Printed Board Design. And, the design community gains operational efficiency from the release of the "B" version of IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. A consortium of companies rallies around this standard to make it the electronics industry defacto standard for transferring design data into manufacturing data. IPC-2581B aggregates all elements of a design into a single file that results in improved speed and efficiency of transmission to board manufacturers.

  • IPC's Multimedia Training department takes a giant step forward by moving its entire training library to an online distribution system, enabling online streaming of training.
    IPC develops a new Validation Services program which provides auditing services to certify manufacturing sites and products in accordance with IPC standards -- IPC's first venture into establishing a network of certified suppliers around the globe.

  • IPC publishes Conflict Minerals Due Diligence Guide to help companies establish and execute effective conflict minerals programs that meet the requirements of the new SEC regulation.

  • IPC makes a major investment in its government relations program, appointing John Hasselmann as its new vice president of government relations.

  • IPC Greater China undertakes a program to focus on membership growth. Each IPC member has a dedicated "relationship manager" who is a key IPC employee. The success of this program is realized in Greater China's significant membership growth of more than 45 percent in 2013. Current membership now represents nearly 15 percent of IPC's worldwide membership.

  • With IPC representative Raymond Foo located in Bangkok, IPC increases its activities in both East Asia and Southeast Asia. IPC organizes and hold sponsored hand soldering competitions in Korea, Japan, Malaysia, Thailand and Vietnam. The competition in Korea sets record attendance with more than 120 competitors.

  • The APEX brand is brought to India in 2013 with the launch of IPC APEX India in Bangalore. More than 1,000 industry delegates attend the event which includes a technical conference, workshops and exhibition. IPC APEX India also features hand soldering and PCB design competitions.

 
 
 
 

2014

  • IPC Certification focuses on developing and successfully launching the CQI (Certification Quality Initiative). CQI deploys new security features and advanced testing delivery mechanisms focused at improving quality and maintaining the integrity of IPC’s certification program.

  • The Validation Services program continues to expand and grow in 2014. A total of 14 QML audits are completed in and the company locations are added to IPC’s list of industry trusted sources. Several new QML programs are created and implemented: J-STD-001/610, Requirements and Acceptability for Soldered Electrical and Electronic Assemblies, the J-STD-001 Space Addendum, IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies, and IPC-1071, Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing.

  • IPC publishes a conflict minerals data exchange standard that aids business to business communication of important conflict minerals compliance data. IPC-1755 is co-developed with EICC and JEITA to ensure broad adoption of a common industry standard. The data exchange standard is XML schema based, allowing companies to seamlessly and electronically communicate compliance information.

  • IPC successfully advocates for legislative language to be included in draft TSCA reform legislation that clarifies Congressional intent to exempt byproducts from TSCA regulations. EPA’s implementation of TSCA treats byproducts as new chemicals if they are sent for recycling. This narrow interpretation is burdensome, unnecessary, and actually discourages recycling.  IPC member, Brent Grazman, VP Quality at Viasystems, testifies on behalf of IPC at a House subcommittee hearing on TSCA reform legislation.

  • IPC begins work on IPC-1401 standard, a Chinese initiated standard for the development of CSR (Corporate Social Responsibility) and Green manufacturing China supply chain companies. Chaired by Huawei and vice chaired by Flextronics, development work on this standard gains significant momentum late in the year.

  • IPC APEX South China grows from 40,000 square meters in 2013 to a record of 45,000 square meters in 2014. For the second year, it is the largest show in our industry worldwide with 39,836 participants and 520 companies with 2,205 booth equivalents comprising 410,000 square feet of show floor space.

  • The IPC Europe High Reliability Forum in Dusseldorf, Germany is well received by attendees. During this conference, IPC kicks off standards activity for an automotive industry addendum to IPC 6012, Qualification and Performance Specification for Rigid Printed Boards.

 
 
 
 

2015

  • IPC Certification focuses on enhancing the Online Certification Portal (formerly known as CQI) and concentrates efforts on using customer feedback to optimize the user experience and provide quick response times to questions on this new system for delivering online certification exams. The Online Certification Portal reaches an all-time record usage, since the roll out, in the fourth quarter with more than 150,000 active sessions.

  • Utilizing the mantra of “Push to Evolve,” IPC works to drive awareness of the benefits of IPC training and certification.

  • IPC launches the Enterprise membership category as a cost-effective way for companies with multiple locations to increase their overall engagement in IPC’s core activities such as standards, education, advocacy and solutions.

  • To maximize the value of our members, IPC adds the position of Member Success Advocate (MSA) to its staff. MSAs are responsible for addressing any questions members may have, as well as helping them navigate through IPC's products and services. This provides members a dedicated point of contact for ensuring that IPC is meeting all their needs.

  • IPC released its Global Policy Framework for 2015, outlining its top public policy priorities to promote a strong manufacturing economy.

  • Opening a new phase in its efforts to educate policy makers on issues that affect the electronics manufacturing industry, IPC launches a new website and recruitment campaign for the IPC Political Action Committee (IPC PAC).

  • In 2015, IPC reaches an all-time high number of IPC Distributors and Training Centers based in Europe, further establishing its presence and support in European countries.
 
 
 
 

 

2016

  • Through its dedication to improving educational opportunities for industry employees, IPC rolls out IPC EDGE. This online learning platform provides education and training courses on topics ranging from IPC Essentials (an introduction to the electronics industry) to a new ESD industry certification program.

  • IPC opens a new office in Brussels to offer its members increased advocacy support, standards development activities, and educational opportunities in the European Union.

  • IPC hosts its first-ever “IMPACT” advocacy event in Brussels, bringing together industry executives and EU policymakers to discuss issues of mutual concern. IMPACT Europe 2016 begins with a breakfast roundtable discussion on the effects of the REACH regulation on the electronics industry. Later, a panel discussion provides opportunity to discuss the growing skills gap in Europe.

  • The Validation Services program achieves new success. On top of certifying more organizations throughout the year, Validation Services completes its first Qualified Manufacturer List Certification in Europe. Two new certification programs are introduced, including a Qualified Manufacturers Listing (QML) for J-STD-001/IPC-A-610 and a Qualified Products Listing (QPL) for IPC-4101.

  • In line with providing solutions for tomorrow’s industry, IPC works alongside 40 member companies ranging from machine vendors, software vendors, and OEMs that comprise the 2-17 Connected Factory Initiative Subcommittee on a machine data interface standard, “Connected Factory Exchange or CFX” that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits.

  • IPC EDGE curriculum continue to evolves to meet the industry’s growing demands.  To further accomplish this, IPC engages member training centers to develop new course topics. The result of this is a strengthened partnership with authorized IPC Training Centers to deliver the most efficient and effective training possible.