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1977 - 1986

1977-1986 Highlights

  • Changes name to the Institute for Interconnecting and Packaging Electronic Circuits
  • Founds the IPC Hall of Fame
  • Sponsors the First Printed Circuit World Convention (PCWC)
  • Sponsors the first PCB presidents meeting
  • Holds the first TMRC meeting outside of the United States
  • Installs the first computer in the IPC office
  • Elects the first IPC board member from an overseas company
  • 25th Anniversary Meeting attended by more than 1,040 attendees
  • Publishes the first IPC-A-610, Acceptability of Printed Circuit Assemblies
  • Completes the first major study of the market for (EMS) companies
  • Applies for ANSI accreditation
  • Opens membership to contract assembly companies
  • Initiates the SMART Conference and Exhibition with EIA
  • Forms Surface Mount Council (SMC) with EIA
  • Holds first committee meetings in Europe and Asia

1977

At IPC's 20th Anniversary Meeting, IPC officially changes its name to the Institute for Interconnecting and Packaging Electronic Circuits.

  • IPC Hall of Fame (the highest IPC award) is founded, and Methode's Bill McGinley, the first President of IPC, is the original recipient.
  • The need for a computer that can be used by IPC staff is discussed.
  • Ken Hafften, Bureau of Engraving, and Dwayne Poteet, Texas Instruments, lead a committee that develops an IPC multipurpose test board (IPC-B-25) for validation of process capability.

1978

As one of its first major international events, IPC sponsors the First Printed Circuit World Convention (PCWC), which is held in London. This meeting brings together PWB associations from around the world. IPC, EIPC (European Institute for Printed Circuits), ICT (Institute of Circuit Technology UK), JPCA (Japan Printed Circuit Association), and Printed Circuit Group IMF (Institute of Metal Finishing UK) are sponsors of the first PCWC.

  • The IPC Board creates an expanded Long-Range Planning Committee composed of past Presidents. Their recommendations are presented to the TAEC and the Board of Directors.
  • The Board also forms a special Finance Committee to meet for several days each year to develop a proposed budget for presentation to the entire Board.
  • IPC cooperates with the Joint Electronic Device Engineering Council (JEDEC) to develop standard packaging for LSI chips.
  • A new quarterly statistical program for IPC PWB supplier members begins.
  • IPC sponsors the first major management meeting at the Fall Meeting in San Diego. Rolly Mettler, Circuitwise, chairs the meeting.
Sir Harold Wilson, former Prime Minister of the U.K., addressed our international assemblage, the first PCWC. Click the photo for a larger image.
Sir Harold Wilson, former Prime Minister of the U.K., addressed our international assemblage, the first PCWC. Click the photo for a larger image..

1979

Although environmental issues continue to be high on the IPC agenda, IPC also identifies emerging problems concerning the availability of energy.

  • IPC establishes a policy that requires all IPC standards and specifications to be reviewed every five years and to be either reaffirmed, revised, or withdrawn.
  • IPC introduces its first videotapes for sale.
  • IPC sponsors the first Technology Market Research Council (TMRC) meeting in Munich, Germany.
  • IPC sponsors a statistical marketing meeting in Tokyo.
Members of the newly formed Energy Committee. George Messner, PCK Technology, and Jim Rogers, Digital Equipment, were the original co-chairmen Click the picture for a larger image.
Members of the newly formed Energy Committee. George Messner, PCK Technology, and Jim Rogers, Digital Equipment, were the original co-chairmen Click the picture for a larger image.

1980

IPC works with the U.S. Department of Defense (DoD) in discussion of their plans for a Certification Program for PWB Manufacturers. IPC also forms a Blue Ribbon Committee to review the impact of rising gold prices and develops seminars and documents on this subject.

  • The U.S. Department of Defense approves IPC-T-50,Terms and Definitions, to supersede MIL-STD-429C.
  • Dave Frisch, Photocircuits, and Don Dinella, Western Electric, present details developed during Round Robin III regarding the state-of-the-art technology of additives.
  • IPC installs its first computer.
  • IPC develops a policy that adds metric dimensions to IPC standards.
Receiving the IPC President's Award: (five in front) Jim Hardman, AMP; Fred Disque, Alpha Metals; John Reust, Beech Aircraft; Foster Gray, Texas Instruments; and Pete Gilmore, Hamilton Standard; (in back) Jim DiNitto, Raytheon; Jack Kerr, USN Electronics; Robert Moore, Sperry; Paul Gould, GTE Sylvania; and Tom Brown, FabriTek. Click the picture for a larger image.
Receiving the IPC President's Award: (five in front) Jim Hardman, AMP; Fred Disque, Alpha Metals; John Reust, Beech Aircraft; Foster Gray, Texas Instruments; and Pete Gilmore, Hamilton Standard; (in back) Jim DiNitto, Raytheon; Jack Kerr, USN Electronics; Robert Moore, Sperry; Paul Gould, GTE Sylvania; and Tom Brown, FabriTek. Click the picture for a larger image.

1981

A highlight of the 1981 IPC meeting in Washington, D.C., is the special evening session where almost 800 members have the opportunity to listen to the wisdom of Dr. W. Edwards Deming.

  • IPC's video department produces 30 new videotapes for members.
  • IPC participates as a joint sponsor of Printed Circuit World Conference II (PCWC II) in Germany.
  • Ralf Gliem, Schoeller & Company (Germany) is elected as the first member of the IPC Board of Directors from an overseas company.
  • The Handbook on Safety in Handling Chemicals is published under Tom Mathias, Digital Equipment.
Left to right: Bernie Kessler, Herb Pollack, Dr. Deming, and Jim DiNitto, who as Program Chairman, had made the arrangement for Dr. Deming to address our members.
Left to right: Bernie Kessler, Herb Pollack, Dr. Deming, and Jim DiNitto, who as Program Chairman, had made the arrangement for Dr. Deming to address our members.

1982

The 25th Anniversary Meeting is held in Boston and is attended by 1,040 members.

  • IPC and the International Society of Hybrid Microelecronics (ISHM) cooperatively publish theHybrid Microcircuit Design Guide.
One of the luncheon sessions from 25th Anniversary Meeting was held in Boston, attended by 1,040 members. Click the picture for a larger image.
One of the luncheon sessions from 25th Anniversary Meeting was held in Boston, attended by 1,040 members. Click the picture for a larger image.

1983

  • A study group is appointed to determine how to coordinate implementation of a new technology called surface mounting. The study group estimates that surface mount technology will impact more than 50 IPC technical committees.
  • IPC again sues the Environmental Protection Agency (EPA) over the requirements for Total Toxic Organics (TTO). The result of the suit is a revision in the requirements for TTO.
  • A new Advanced Packaging Technology Committee is established under the chairmanship of Foster Gray, Texas Instruments.
  • IPC-A-610, Acceptability of Electronic Assemblies, is released. Since 1983, IPC has published more than 200,000 printed copies of this document with hundreds of thousands of electronic file users. The IPC-A-610 is the most published and most referenced standard in IPC's history. Today, in addition to English, the document is also available in Chinese, Danish, Finnish, French, German, Italian, Polish, Spanish, Swedish, Russian, Hungarian, Czech, Romanian and Vietnamese. Future plans call for the document to be published in Japanese and Turkish and possibly in other languages.

 

Presenting at the 1983 Fall Meeting were (left to right) H. Sakata, Matsushita; I. Hishioka, Sharp; K. Tsukanishi, Hitachi Chemical; Y. Yoshikawa, Daisho Electronics; and Dr. Hayao Nakahara.
Presenting at the 1983 Fall Meeting were (left to right) H. Sakata, Matsushita; I. Hishioka, Sharp; K. Tsukanishi, Hitachi Chemical; Y. Yoshikawa, Daisho Electronics; and Dr. Hayao Nakahara.

1984

IPC is the first organization to recognize the importance of a group of companies called contract electronics manufacturers. IPC completes the first major study of the market for the industry, reporting sales of $1.4 billion (non-value add) for U.S. contract manufacturers.

  • Printed Circuit World Convention III (PCWC III) is held in Washington, D.C.
  • An electronic information retrieval program is developed for members.
  • IPC applies for and receives ANSI accreditation as a standards developing organization.
  • IPC members vote unanimously to revise the bylaws to include contract assembly companies as Regular Members.
Key representatives of PCWC III were (seated) Reuben Josephs, Nevin Electric; Rolly Mettler, Circuit-Wise; Theo Passlick, Fuba-Hans Kolbe; and Hitoshi Aizawa, Hitachi Chemical. Standing are members of the Operations Committee: Russell House, Imasa Ltd; Bernie Kessler, Kessler & Associates; Dwayne Poteet, Texas Instruments; Dick Douglas, Hughes Aircraft; Jim DiNitto, Analog Devices; Hayao Nakahara, Photocircuits; George Messner, PCK Technology; Ray Pritchard, IPC; Dieter Bergman, IPC; and Kiyoshi Takagi, Fujitsu Ltd.
Key representatives at PCWC III were (seated) Reuben Josephs, Nevin Electric; Rolly Mettler, Circuit-Wise; Theo Passlick, Fuba-Hans Kolbe; and Hitoshi Aizawa, Hitachi Chemical. Standing are members of the Operations Committee: Russell House, Imasa Ltd; Bernie Kessler, Kessler & Associates; Dwayne Poteet, Texas Instruments; Dick Douglas, Hughes Aircraft; Jim DiNitto, Analog Devices; Hayao Nakahara, Photocircuits; George Messner, PCK Technology; Ray Pritchard, IPC; Dieter Bergman, IPC; and Kiyoshi Takagi, Fujitsu Ltd.

1985

Although technology and marketing programs continue to play a major role in programming in IPC, there is also increased interest in management programs. This year, in cooperation with the Wharton School of Finance, IPC conducts East Coast and West Coast Financial Management Seminars.

  • A promotional brochure describing the importance of is published and circulated to member companies, as well as to colleges and universities.
  • With more than 20,000 individuals on the IPC mailing list, it is impossible to send all mailings to everyone at each member company. Consequently, a new category of Participating Member is created. (Membership fee is $200.) Participating members receive the same mailings sent to Official Representatives.
  • Electronic Industries Association (EIA), with IPC, initiates the Surface Mount and Reflow Technology Conference and Exhibition (SMART).

 

 

Seated: Bob Wright, Midi; Sam Sapienza, Wharton School of Finance; John Misilli, Photocircuits; and Rolly Mettler, Circuit-Wise, were the organizers of the Financial Management Seminars.
Seated: Bob Wright, Midi; Sam Sapienza, Wharton School of Finance; John Misilli, Photocircuits; and Rolly Mettler, Circuit-Wise, were the organizers of the Financial Management Seminars.

1986

Only 15% of PWB panels contain one or more surface mount applications. However, the outlook is for surface mount technology (SMT) to eventually dominate the electronics industry, and there is a tremendous need to share information on this technology.

Because of this need, the Surface Mount Council (SMC), a joint effort between IPC and EIA, is formed. The intent of the council is to gather the most knowledgeable experts from EIA and IPC to identify and create programs to overcome the technological barriers to SMT.

  • The IPC Long-Range Planning Committee targets six areas for programming:
    • International Standards
    • Need to Improve Communications
    • U.S. Regional Meetings/Chapters
    • International Meetings and Seminars
    • Expanding Packaging Activities
    • Format for Semiannual Meetings
  • For the first time, IPC holds meetings in Europe and Asia to review a proposal for a new standard for surface mount land patterns (IPC-SM-782).
  • Recognizing that almost 80 percent of all independent PWB manufacturers have sales of less than $5 million, IPC sponsors management meetings on the East and West Coasts aimed directly at the interests and problems of small PWB manufacturers.
  • Under the leadership of Maynard Eaves, Hewlett Packard, IPC publishes a Quality Evaluation Handbook for PWBs and a comprehensive series of slides.
  • IPC headquarters move to 7380 N. Lincoln Avenue, Lincolnwood, Illinois.

 

The initial group of experts who served on the Surface Mount Council. Click the picture for a larger image.
The initial group of experts who served on the Surface Mount Council. Click the picture for a larger image.